\n| A g\u00e9p m\u00e9retei<\/td>\n | 1450 \u00d7 3380 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
\nM\u0171k\u00f6d\u00e9si elv<\/h2>\nA WDP-1240 \u00fagy m\u0171k\u00f6dik, hogy egy nagysebess\u00e9g\u0171 ors\u00f3 \u00e9s prec\u00edzi\u00f3s tokm\u00e1nyrendszer seg\u00edts\u00e9g\u00e9vel ellen\u0151rz\u00f6tt mechanikai pol\u00edroz\u00e1st alkalmaz a szelet h\u00e1toldal\u00e1n.<\/p>\n Az ostyav\u00e9kony\u00edt\u00e1s ut\u00e1n gyakran marad egy s\u00e9r\u00fclt r\u00e9teg a felsz\u00edn alatt, ami bels\u0151 fesz\u00fclts\u00e9get okoz. A sz\u00e1raz pol\u00edroz\u00e1si elj\u00e1r\u00e1s elt\u00e1vol\u00edtja ezt a r\u00e9teget, mik\u00f6zben szigor\u00faan ellen\u0151rzi a nyom\u00e1st \u00e9s az anyagelt\u00e1vol\u00edt\u00e1si sebess\u00e9get. Ennek eredm\u00e9nye:<\/p>\n \n- Egys\u00e9ges fel\u00fcleti min\u0151s\u00e9g<\/li>\n
- Cs\u00f6kkentett marad\u00f3 fesz\u00fclts\u00e9g<\/li>\n
- Jav\u00edtott ostyas\u00edkoss\u00e1g<\/li>\n<\/ul>\n
A be\u00e9p\u00edtett pol\u00edroz\u00f3egys\u00e9g biztos\u00edtja, hogy a pol\u00edroz\u00f3szersz\u00e1mok a folyamat sor\u00e1n v\u00e9gig egyenletes teljes\u00edtm\u00e9nyt ny\u00fajtsanak.<\/p>\n
\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp\") Alkalmaz\u00e1si tartom\u00e1ny<\/h2>\n
A WDP-1240 sorozatot sz\u00e9les k\u00f6rben haszn\u00e1lj\u00e1k:<\/p>\n \n- F\u00e9lvezet\u0151 ostya h\u00e1toldal\u00e1nak feldolgoz\u00e1sa<\/li>\n
- Fejlett csomagol\u00e1s (WLCSP, fan-out csomagol\u00e1s)<\/li>\n
- Szil\u00edcium (Si) osty\u00e1k pol\u00edroz\u00e1sa<\/li>\n
- Szil\u00edcium-karbid (SiC) ostya feldolgoz\u00e1sa<\/li>\n
- V\u00e9kony ostya fesz\u00fclts\u00e9gcs\u00f6kkent\u0151 alkalmaz\u00e1sok<\/li>\n<\/ul>\n
T\u00e1mogatja a 12 h\u00fcvelykes \u00e9s ann\u00e1l kisebb m\u00e9ret\u0171 osty\u00e1kat, \u00edgy alkalmas mind a hagyom\u00e1nyos f\u00e9lvezet\u0151gy\u00e1rt\u00e1shoz, mind a felt\u00f6rekv\u0151 fejlett csomagol\u00e1si technol\u00f3gi\u00e1khoz.<\/p>\n
\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\") Alapvet\u0151 el\u0151ny\u00f6k<\/h2>\n\n- Alacsony k\u00f6rnyezeti hat\u00e1s
A sz\u00e1raz elj\u00e1r\u00e1s kik\u00fcsz\u00f6b\u00f6li az iszapot \u00e9s cs\u00f6kkenti a hullad\u00e9kot<\/li>\n - Nagy hozamjavul\u00e1s
Minimaliz\u00e1lja a reped\u00e9st \u00e9s a torzul\u00e1st a v\u00e9kony osty\u00e1kn\u00e1l<\/li>\n - Nagyfok\u00fa folyamatstabilit\u00e1s
A robusztus strukt\u00fara k\u00f6vetkezetes eredm\u00e9nyeket biztos\u00edt<\/li>\n - Gy\u00e1rt\u00f3sor integr\u00e1ci\u00f3
Kompatibilis az automatiz\u00e1lt ostyav\u00e9kony\u00edt\u00f3 rendszerekkel<\/li>\n - Fejlett csomagol\u00e1sra optimaliz\u00e1lva
A k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s f\u00e9lvezet\u0151 elj\u00e1r\u00e1sokhoz tervezt\u00e9k<\/li>\n<\/ul>\n
\nGYIK<\/h2>\n1. k\u00e9rd\u00e9s: Mi a sz\u00e1raz pol\u00edroz\u00e1s f\u0151 el\u0151nye a nedves pol\u00edroz\u00e1shoz k\u00e9pest?
V: A sz\u00e1raz pol\u00edroz\u00e1s kik\u00fcsz\u00f6b\u00f6li a h\u00edgtr\u00e1gya haszn\u00e1lat\u00e1t, ez\u00e1ltal cs\u00f6kkenti a k\u00f6rnyezetterhel\u00e9st, egyszer\u0171s\u00edti a karbantart\u00e1st \u00e9s cs\u00f6kkenti az \u00fczemeltet\u00e9si k\u00f6lts\u00e9geket, mik\u00f6zben fenntartja a magas fel\u00fcleti min\u0151s\u00e9get.<\/p>\n 2. k\u00e9rd\u00e9s: Milyen ostyam\u00e9retek t\u00e1mogatottak?
V: A WDP-1240 ak\u00e1r 12 h\u00fcvelyk (300 mm) m\u00e9ret\u0171 osty\u00e1kat is t\u00e1mogat, bele\u00e9rtve a Si \u00e9s SiC anyagokat is.<\/p>\n 3. k\u00e9rd\u00e9s: Be\u00e9p\u00edthet\u0151-e ez a g\u00e9p egy gy\u00e1rt\u00f3sorba?
V: Igen. Z\u00f6kken\u0151mentesen \u00f6sszekapcsolhat\u00f3 az olyan ostyav\u00e9kony\u00edt\u00f3 berendez\u00e9sekkel, mint a WG1251, lehet\u0151v\u00e9 t\u00e9ve az automatiz\u00e1lt ostyatranszfert \u00e9s a folyamatos feldolgoz\u00e1st.<\/p>","protected":false},"excerpt":{"rendered":" A WDP-1240 sorozat\u00fa sz\u00e1raz pol\u00edroz\u00f3g\u00e9p egy fejlett prec\u00edzi\u00f3s rendszer, amelyet a f\u00e9lvezet\u0151gy\u00e1rt\u00e1s sor\u00e1n a wafer h\u00e1toldal\u00e1n l\u00e9v\u0151 fesz\u00fclts\u00e9gmentes\u00edt\u00e9sre \u00e9s a s\u00e9r\u00fclt r\u00e9tegek elt\u00e1vol\u00edt\u00e1s\u00e1ra fejlesztettek ki. A kifejezetten 300 mm-es osty\u00e1k feldolgoz\u00e1s\u00e1ra tervezett berendez\u00e9s sz\u00e1raz pol\u00edroz\u00e1si elj\u00e1r\u00e1st alkalmaz a kiv\u00e1l\u00f3 min\u0151s\u00e9g\u0171 fel\u00fcletkik\u00e9sz\u00edt\u00e9s el\u00e9r\u00e9s\u00e9hez, mik\u00f6zben minimaliz\u00e1lja a k\u00f6rnyezetterhel\u00e9st.<\/p>","protected":false},"featured_media":2217,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[725],"product_tag":[995,1000,993,1001,996,997,999,998,994,1002],"class_list":{"0":"post-2215","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-polishing-machine","7":"product_tag-300mm-wafer-polishing","8":"product_tag-advanced-packaging-equipment","9":"product_tag-dry-polishing-machine","10":"product_tag-dry-wafer-processing","11":"product_tag-semiconductor-polishing-machine","12":"product_tag-sic-wafer-polishing","13":"product_tag-stress-relief-polishing-machine","14":"product_tag-wafer-backside-polishing","15":"product_tag-wafer-polishing-equipment","16":"product_tag-wafer-thinning-line-equipment","17":"desktop-align-left","18":"tablet-align-left","19":"mobile-align-left","20":"ast-product-gallery-layout-horizontal-slider","21":"ast-product-gallery-with-no-image","22":"ast-product-tabs-layout-horizontal","24":"first","25":"instock","26":"shipping-taxable","27":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2215","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/comments?post=2215"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2215\/revisions"}],"predecessor-version":[{"id":2219,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2215\/revisions\/2219"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media\/2217"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media?parent=2215"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_brand?post=2215"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_cat?post=2215"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_tag?post=2215"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
|
![\"WDP-1240](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png\")
A WDP-1240 sorozat\u00fa sz\u00e1raz pol\u00edroz\u00f3g\u00e9p egy fejlett prec\u00edzi\u00f3s rendszer, amelyet a f\u00e9lvezet\u0151gy\u00e1rt\u00e1s sor\u00e1n a wafer h\u00e1toldal\u00e1n l\u00e9v\u0151 fesz\u00fclts\u00e9gmentes\u00edt\u00e9sre \u00e9s a s\u00e9r\u00fclt r\u00e9tegek elt\u00e1vol\u00edt\u00e1s\u00e1ra fejlesztettek ki. A kifejezetten 300 mm-es osty\u00e1k feldolgoz\u00e1s\u00e1ra tervezett berendez\u00e9s sz\u00e1raz pol\u00edroz\u00e1si elj\u00e1r\u00e1st alkalmaz a kiv\u00e1l\u00f3 min\u0151s\u00e9g\u0171 fel\u00fcletkik\u00e9sz\u00edt\u00e9s el\u00e9r\u00e9s\u00e9hez, mik\u00f6zben minimaliz\u00e1lja a k\u00f6rnyezetterhel\u00e9st.<\/p>\n