{"id":2125,"date":"2026-04-08T05:30:39","date_gmt":"2026-04-08T05:30:39","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2125"},"modified":"2026-04-08T05:30:42","modified_gmt":"2026-04-08T05:30:42","slug":"wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/wgp-1271-fully-automatic-wafer-thinning-polishing-integrated-machine\/","title":{"rendered":"WGP-1271 Teljesen automatikus ostya v\u00e9kony\u00edt\u00f3 \u00e9s pol\u00edroz\u00f3 integr\u00e1lt g\u00e9p"},"content":{"rendered":"

\"\"A WGP-1271 teljesen automatikus Wafer Thinning & Polishing Integrated Machine egy \u00faj gener\u00e1ci\u00f3s megold\u00e1s, amelyet a fejlett f\u00e9lvezet\u0151 csomagol\u00e1sokban haszn\u00e1lt ultrav\u00e9kony waferek feldolgoz\u00e1s\u00e1ra terveztek. Az\u00e1ltal, hogy a rendszer egyetlen automatiz\u00e1lt platformba integr\u00e1lja a csiszol\u00e1st, pol\u00edroz\u00e1st, tiszt\u00edt\u00e1st \u00e9s szalagkezel\u00e9st, jelent\u0151sen cs\u00f6kkenti a folyamat idej\u00e9t, mik\u00f6zben jav\u00edtja a konzisztenci\u00e1t \u00e9s a hozamot.<\/p>\n

A WGP-1271 ak\u00e1r 300 mm-es (12 h\u00fcvelyk) osty\u00e1khoz tervezve lehet\u0151v\u00e9 teszi az osty\u00e1k stabil, 50 \u03bcm alatti v\u00e9kony\u00edt\u00e1s\u00e1t, \u00edgy megfelel a fejlett csomagol\u00e1si technol\u00f3gi\u00e1k, p\u00e9ld\u00e1ul a 3D IC, a wafer-level packaging (WLP) \u00e9s a t\u00e1pegys\u00e9g-integr\u00e1ci\u00f3 szigor\u00fa k\u00f6vetelm\u00e9nyeinek.<\/p>\n

A hagyom\u00e1nyos t\u00f6bbl\u00e9pcs\u0151s rendszerekkel ellent\u00e9tben ez a g\u00e9p a h\u00e1ts\u00f3 csiszol\u00e1st \u00e9s a fesz\u00fclts\u00e9gmentes\u00edt\u0151 pol\u00edroz\u00e1st egy egys\u00e9ges folyamatba egyes\u00edti, minimaliz\u00e1lva az osty\u00e1k kezel\u00e9s\u00e9t \u00e9s cs\u00f6kkentve a s\u00e9r\u00fcl\u00e9s kock\u00e1zat\u00e1t. Az eredm\u00e9ny jobb integrit\u00e1s, nagyobb teljes\u00edtm\u00e9ny \u00e9s alacsonyabb teljes birtokl\u00e1si k\u00f6lts\u00e9g (TCO).<\/p>\n

\n

F\u0151 jellemz\u0151k<\/strong><\/span><\/h2>\n

1. Integr\u00e1lt ritk\u00edt\u00e1si \u00e9s pol\u00edroz\u00e1si folyamat<\/strong><\/span><\/h3>\n

A WGP-1271 egyetlen munkafolyamatban egyes\u00edti a durvacsiszol\u00e1st, a finomcsiszol\u00e1st \u00e9s a pol\u00edroz\u00e1st. Ez az integr\u00e1lt kialak\u00edt\u00e1s kik\u00fcsz\u00f6b\u00f6li a k\u00f6zbens\u0151 \u00e1tviteli l\u00e9p\u00e9seket, jelent\u0151sen cs\u00f6kkentve a nem feldolgoz\u00e1si id\u0151t \u00e9s jav\u00edtva a termel\u00e9s \u00e1ltal\u00e1nos hat\u00e9konys\u00e1g\u00e1t.<\/p>\n

2. Ultra-v\u00e9kony szeletk\u00e9pess\u00e9g (<50 \u03bcm)<\/strong><\/span><\/h3>\n

A rendszert kifejezetten ultrav\u00e9kony osty\u00e1khoz tervezt\u00e9k. Stabil feldolgoz\u00e1st \u00e9s biztons\u00e1gos kezel\u00e9st biztos\u00edt az 50 mikron alatti osty\u00e1k sz\u00e1m\u00e1ra, amelyek jellemz\u0151en t\u00f6r\u00e9kenyek \u00e9s hajlamosak az elhajl\u00e1sra vagy reped\u00e9sre.<\/p>\n

3. H\u00e1romors\u00f3s, n\u00e9gy\u00e1llom\u00e1sos architekt\u00fara<\/strong><\/span><\/h3>\n

Egy h\u00e1romcsig\u00e1s, n\u00e9gy tokm\u00e1nyos konfigur\u00e1ci\u00f3<\/strong>, a WGP-1271 p\u00e1rhuzamos feldolgoz\u00e1st \u00e9s nagy \u00e1tereszt\u0151k\u00e9pess\u00e9get tesz lehet\u0151v\u00e9. Mindegyik ors\u00f3 a folyamat k\u00fcl\u00f6nb\u00f6z\u0151 szakaszaira van optimaliz\u00e1lva:<\/p>\n

    \n
  • 1. ors\u00f3: durva k\u00f6sz\u00f6r\u00fcl\u00e9s<\/li>\n
  • Ors\u00f3 2: Finomcsiszol\u00e1s<\/li>\n
  • 3. ors\u00f3: Pol\u00edroz\u00e1s \/ ultraprec\u00edzi\u00f3s v\u00e9kony\u00edt\u00e1s (opcion\u00e1lis sz\u00e1raz pol\u00edroz\u00e1s)<\/li>\n<\/ul>\n

    Ez a modul\u00e1ris megk\u00f6zel\u00edt\u00e9s egyszerre biztos\u00edtja a rugalmass\u00e1got \u00e9s a pontoss\u00e1got.<\/p>\n

    4. Fejlett in-line vastags\u00e1gm\u00e9r\u00e9s (NCG + Auto TTV)<\/strong><\/span><\/h3>\n

    A rendszer integr\u00e1lja Swing NCG (\u00e9rint\u00e9smentes m\u00e9r\u0151m\u0171szer)<\/strong> Auto TTV vez\u00e9rl\u00e9ssel, amely lehet\u0151v\u00e9 teszi a val\u00f3s idej\u0171, \u00e9rint\u00e9smentes ostyavastags\u00e1g m\u00e9r\u00e9st. Ez lehet\u0151v\u00e9 teszi a vastags\u00e1g egyenletess\u00e9g\u00e9nek folyamatos nyomon k\u00f6vet\u00e9s\u00e9t \u00e9s automatikus be\u00e1ll\u00edt\u00e1s\u00e1t a folyamat sor\u00e1n.<\/p>\n

    5. Teljesen automatiz\u00e1lt v\u00e9gpontt\u00f3l v\u00e9gpontig tart\u00f3 feldolgoz\u00e1s<\/strong><\/span><\/h3>\n

    A WGP-1271 t\u00e1mogatja a teljes automatiz\u00e1lt munkafolyamatot, bele\u00e9rtve:<\/p>\n

      \n
    • Csiszol\u00e1s<\/li>\n
    • Pol\u00edroz\u00e1s<\/li>\n
    • Wafer transzfer<\/li>\n
    • Tiszt\u00edt\u00e1s<\/li>\n
    • Szalag felszerel\u00e9se \u00e9s elt\u00e1vol\u00edt\u00e1sa<\/li>\n<\/ul>\n

      Ez cs\u00f6kkenti a k\u00e9zi beavatkoz\u00e1st, jav\u00edtja az ism\u00e9telhet\u0151s\u00e9get, \u00e9s biztos\u00edtja a kompatibilit\u00e1st a modern intelligens gy\u00e1rt\u00e1si k\u00f6rnyezetekkel.<\/p>\n

      6. Opcion\u00e1lis sz\u00e1raz pol\u00edroz\u00e1s \u00e9s ultraprec\u00edzi\u00f3s csiszol\u00e1s<\/strong><\/span><\/h3>\n

      A harmadik ors\u00f3 (Z3 tengely) t\u00e1mogatja az X-tengelyes mozg\u00e1st, \u00e9s a k\u00f6vetkez\u0151kre konfigur\u00e1lhat\u00f3 sz\u00e1raz pol\u00edroz\u00e1s vagy ultraprec\u00edzi\u00f3s csiszol\u00e1s<\/strong>, lehet\u0151v\u00e9 t\u00e9ve a k\u00fcl\u00f6nf\u00e9le folyamatalkalmaz\u00e1sokat az \u00fcgyf\u00e9l ig\u00e9nyei szerint.<\/p>\n

      \"\"Alkalmaz\u00e1sok<\/strong><\/span><\/h2>\n

      A WGP-1271 ide\u00e1lis a fejlett f\u00e9lvezet\u0151gy\u00e1rt\u00e1si folyamatokhoz, t\u00f6bbek k\u00f6z\u00f6tt:<\/p>\n

        \n
      • Ultrav\u00e9kony ostyafeldolgoz\u00e1s (\u2264 12 h\u00fcvelyk)<\/li>\n
      • Fejlett csomagol\u00e1s (WLP, Fan-out, 3D IC)<\/li>\n
      • IGBT \u00e9s teljes\u00edtm\u00e9ny f\u00e9lvezet\u0151 eszk\u00f6z\u00f6k<\/li>\n
      • Szil\u00edcium (Si) osty\u00e1k v\u00e9kony\u00edt\u00e1sa<\/li>\n
      • Szil\u00edcium-karbid (SiC) ostya feldolgoz\u00e1sa<\/li>\n
      • Nagy s\u0171r\u0171s\u00e9g\u0171 integr\u00e1lt \u00e1ramk\u00f6r\u00f6k gy\u00e1rt\u00e1sa<\/li>\n<\/ul>\n

        Az ultrav\u00e9kony osty\u00e1k kezel\u00e9s\u00e9re val\u00f3 k\u00e9pess\u00e9ge k\u00fcl\u00f6n\u00f6sen alkalmass\u00e1 teszi a kompakt m\u00e9retet \u00e9s nagy teljes\u00edtm\u00e9nyt ig\u00e9nyl\u0151, k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s elektronikus eszk\u00f6z\u00f6kh\u00f6z.<\/p>\n

        M\u0171szaki specifik\u00e1ci\u00f3k<\/strong><\/span><\/h2>\n
        \n
        \n\n\n\n\n\n\n\n\n\n\n\n
        Param\u00e9ter<\/th>\nSpecifik\u00e1ci\u00f3<\/th>\n<\/tr>\n<\/thead>\n
        Szerkezet<\/td>\n3 ors\u00f3 \/ 4 tokm\u00e1ny \/ 1 munka\u00e1llom\u00e1s \/ Automatikus \u00e1tviteli \u00e9s tiszt\u00edt\u00f3 rendszer \/ Szalag r\u00f6gz\u00edt\u0151 \u00e9s elt\u00e1vol\u00edt\u00f3 rendszer<\/td>\n<\/tr>\n
        Wafer m\u00e9ret<\/td>\n8 h\u00fcvelyk \/ 12 h\u00fcvelyk (300 mm-ig)<\/td>\n<\/tr>\n
        Ors\u00f3 teljes\u00edtm\u00e9ny<\/td>\n7,5 kW \/ 11 kW (opcion\u00e1lis)<\/td>\n<\/tr>\n
        K\u00fcl\u00f6nleges funkci\u00f3<\/td>\nZ3 tengely X-tengelyes mozg\u00e1ssal<\/td>\n<\/tr>\n
        Feldolgoz\u00e1si k\u00e9pess\u00e9g<\/td>\nCsiszol\u00e1s + pol\u00edroz\u00e1s + tiszt\u00edt\u00e1s + szalagkezel\u00e9s<\/td>\n<\/tr>\n
        Minim\u00e1lis vastags\u00e1g<\/td>\n< 50 \u03bcm<\/td>\n<\/tr>\n
        M\u00e9retek (W\u00d7D\u00d7H)<\/td>\n4050 \u00d7 3530 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

        Teljes\u00edtm\u00e9ny El\u0151ny\u00f6k<\/strong><\/span><\/h2>\n

        Nagyobb hat\u00e9konys\u00e1g<\/strong><\/span><\/h3>\n

        Az integr\u00e1lt kialak\u00edt\u00e1s cs\u00f6kkenti a folyamat l\u00e9p\u00e9seit \u00e9s a kezel\u00e9si id\u0151t, ami a hagyom\u00e1nyos, k\u00fcl\u00f6n\u00e1ll\u00f3 rendszerekhez k\u00e9pest jelent\u0151sen nagyobb \u00e1tereszt\u0151k\u00e9pess\u00e9get eredm\u00e9nyez.<\/p>\n

        Jav\u00edtott hozam<\/strong><\/span><\/h3>\n

        Az \u00e9rint\u00e9smentes m\u00e9r\u00e9s \u00e9s az alacsony ig\u00e9nybev\u00e9tel\u0171 feldolgoz\u00e1s minimaliz\u00e1lja a szil\u00e1nkok s\u00e9r\u00fcl\u00e9s\u00e9t, ami nagyobb hozamot \u00e9s jobb eszk\u00f6zmegb\u00edzhat\u00f3s\u00e1got eredm\u00e9nyez.<\/p>\n

        Kiv\u00e1l\u00f3 vastags\u00e1gszab\u00e1lyoz\u00e1s<\/strong><\/span><\/h3>\n

        A val\u00f3s idej\u0171 TTV-be\u00e1ll\u00edt\u00e1s kiv\u00e1l\u00f3 vastags\u00e1gegyenletess\u00e9get biztos\u00edt, ami kritikus fontoss\u00e1g\u00fa a fejlett csomagol\u00e1si alkalmaz\u00e1sokn\u00e1l.<\/p>\n

        Cs\u00f6kkentett szennyez\u0151d\u00e9si kock\u00e1zat<\/strong><\/span><\/h3>\n

        A kevesebb transzferl\u00e9p\u00e9s \u00e9s az ellen\u0151rz\u00f6tt technol\u00f3giai k\u00f6rnyezet seg\u00edt fenntartani a szeletek tisztas\u00e1g\u00e1t \u00e9s cs\u00f6kkenteni a hibaar\u00e1nyt.<\/p>\n

        Fokozott folyamatbeli rugalmass\u00e1g<\/strong><\/span><\/h3>\n

        Az opcion\u00e1lis sz\u00e1raz pol\u00edroz\u00e1s \u00e9s az ultraprec\u00edzi\u00f3s csiszol\u00e1s lehet\u0151v\u00e9 teszi a k\u00fcl\u00f6nb\u00f6z\u0151 anyagokhoz \u00e9s alkalmaz\u00e1sokhoz val\u00f3 testreszab\u00e1st.<\/p>\n

        \"\"M\u00e9rn\u00f6ki \u00e9rt\u00e9k \u00e9s ipari jelent\u0151s\u00e9g<\/strong><\/span><\/h2>\n

        Mivel a f\u00e9lvezet\u0151 eszk\u00f6z\u00f6k egyre nagyobb teljes\u00edtm\u00e9ny\u0171ek \u00e9s kisebb form\u00e1tum\u00faak lesznek, az ultrav\u00e9kony osty\u00e1k kritikus k\u00f6vetelm\u00e9nny\u00e9 v\u00e1ltak. Az 50 \u03bcm alatti osty\u00e1k v\u00e9kony\u00edt\u00e1sa azonban jelent\u0151s kih\u00edv\u00e1sokat jelent a kezel\u00e9s, a fesz\u00fclts\u00e9gszab\u00e1lyoz\u00e1s \u00e9s a hib\u00e1k megel\u0151z\u00e9se ter\u00e9n.<\/p>\n

        A WGP-1271 ezeket a kih\u00edv\u00e1sokat integr\u00e1lt m\u00e9rn\u00f6ki tervez\u00e9ssel oldja meg, t\u00f6bb folyamatl\u00e9p\u00e9st egyetlen automatiz\u00e1lt rendszerben egyes\u00edtve. Ez nemcsak a termel\u00e9s hat\u00e9konys\u00e1g\u00e1t jav\u00edtja, hanem a folyamat megb\u00edzhat\u00f3s\u00e1g\u00e1t is n\u00f6veli, \u00edgy \u00e9rt\u00e9kes eszk\u00f6z a fejlett csomagol\u00e1si technol\u00f3gi\u00e1kra \u00e1tt\u00e9r\u0151 f\u00e9lvezet\u0151gy\u00e1rt\u00f3k sz\u00e1m\u00e1ra.<\/p>\n

        GYIK<\/strong><\/span><\/h2>\n

        1. Mi az integr\u00e1lt ritk\u00edt\u00f3 \u00e9s pol\u00edroz\u00f3 rendszer f\u0151 el\u0151nye?<\/strong><\/span><\/h3>\n

        Cs\u00f6kkenti az ostyakezel\u00e9si l\u00e9p\u00e9seket, ler\u00f6vid\u00edti a feldolgoz\u00e1si id\u0151t \u00e9s minimaliz\u00e1lja az ostyas\u00e9r\u00fcl\u00e9s kock\u00e1zat\u00e1t, ami nagyobb hat\u00e9konys\u00e1got \u00e9s hozamot eredm\u00e9nyez.<\/p>\n

        2. K\u00e9pes-e a WGP-1271 az 50 \u03bcm alatti, ultrav\u00e9kony osty\u00e1kat feldolgozni?<\/strong><\/span><\/h3>\n

        Igen, a rendszert kifejezetten 50 \u03bcm-n\u00e9l v\u00e9konyabb osty\u00e1k kezel\u00e9s\u00e9re \u00e9s feldolgoz\u00e1s\u00e1ra tervezt\u00e9k, nagy stabilit\u00e1ssal \u00e9s pontoss\u00e1ggal.<\/p>\n

        3. Milyen t\u00edpus\u00fa osty\u00e1k t\u00e1mogatottak?<\/strong><\/span><\/h3>\n

        A g\u00e9p a szil\u00edcium (Si), szil\u00edcium-karbid (SiC) \u00e9s egy\u00e9b f\u00e9lvezet\u0151 osty\u00e1kat t\u00e1mogatja 300 mm-es m\u00e9retig.<\/p>\n

        4. Hogyan szab\u00e1lyozz\u00e1k a vastags\u00e1g egyenletess\u00e9g\u00e9t?<\/strong><\/span><\/h3>\n

        Integr\u00e1lt \u00e9rint\u00e9smentes m\u00e9r\u0151rendszer (NCG) \u00e9s automatikus TTV-be\u00e1ll\u00edt\u00e1s a val\u00f3s idej\u0171 vez\u00e9rl\u00e9shez.<\/p>\n

        5. T\u00e1mogatja a g\u00e9p a teljesen automatiz\u00e1lt gy\u00e1rt\u00e1st?<\/strong><\/span><\/h3>\n

        Igen, automatikus \u00e1tviteli, tiszt\u00edt\u00f3 \u00e9s szalagkezel\u0151 rendszereket tartalmaz, \u00edgy alkalmas nagy volumen\u0171 automatiz\u00e1lt gy\u00e1rt\u00e1s sz\u00e1m\u00e1ra.<\/p>","protected":false},"excerpt":{"rendered":"

        A WGP-1271 teljesen automatikus ostyav\u00e9kony\u00edt\u00f3 \u00e9s pol\u00edroz\u00f3 integr\u00e1lt g\u00e9p \u00e1tfog\u00f3 megold\u00e1st k\u00edn\u00e1l az ultrav\u00e9kony osty\u00e1k feldolgoz\u00e1s\u00e1hoz. Fejlett automatiz\u00e1l\u00e1s\u00e1val, prec\u00edzi\u00f3s vez\u00e9rl\u00e9s\u00e9vel \u00e9s integr\u00e1lt munkafolyamat\u00e1val ide\u00e1lisan alkalmas a cs\u00facskateg\u00f3ri\u00e1s f\u00e9lvezet\u0151 alkalmaz\u00e1sokhoz, ahol a teljes\u00edtm\u00e9ny, a hozam \u00e9s a hat\u00e9konys\u00e1g kritikus fontoss\u00e1g\u00fa.<\/p>","protected":false},"featured_media":2126,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[724,725],"product_tag":[617,812,814,813,826,824,485,833,821,811,819,825,817,827,830,823,818,820,831,832,110,475,102,101,822,547,810,829,802,828,815,809,816],"class_list":{"0":"post-2125","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-grinding-machine","7":"product_cat-polishing-machine","8":"product_tag-12-inch-wafer","9":"product_tag-300mm-wafer","10":"product_tag-3d-ic","11":"product_tag-50-micron-wafer","12":"product_tag-advanced-packaging-technology","13":"product_tag-auto-ttv","14":"product_tag-automated-wafer-handling","15":"product_tag-cleanroom-equipment","16":"product_tag-dry-polishing","17":"product_tag-fully-automatic-wafer-machine","18":"product_tag-high-density-ic","19":"product_tag-high-throughput-semiconductor","20":"product_tag-igbt","21":"product_tag-integrated-wafer-processing","22":"product_tag-low-stress-processing","23":"product_tag-ncg-measurement","24":"product_tag-power-device","25":"product_tag-precision-grinding","26":"product_tag-process-flexibility","27":"product_tag-semiconductor-automation","28":"product_tag-semiconductor-equipment","29":"product_tag-semiconductor-manufacturing","30":"product_tag-sic-wafer","31":"product_tag-silicon-wafer","32":"product_tag-tape-mounting-system","33":"product_tag-ultra-thin-wafer-processing","34":"product_tag-wafer-polishing-machine","35":"product_tag-wafer-thickness-control","36":"product_tag-wafer-thinning-machine","37":"product_tag-wafer-yield-improvement","38":"product_tag-wafer-level-packaging","39":"product_tag-wgp-1271","40":"product_tag-wlp","41":"desktop-align-left","42":"tablet-align-left","43":"mobile-align-left","44":"ast-product-gallery-layout-horizontal-slider","45":"ast-product-tabs-layout-horizontal","47":"first","48":"instock","49":"shipping-taxable","50":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2125","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/comments?post=2125"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2125\/revisions"}],"predecessor-version":[{"id":2130,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product\/2125\/revisions\/2130"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media\/2126"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media?parent=2125"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_brand?post=2125"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_cat?post=2125"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/product_tag?post=2125"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}