{"id":2084,"date":"2026-04-03T02:35:11","date_gmt":"2026-04-03T02:35:11","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2084"},"modified":"2026-04-03T02:36:56","modified_gmt":"2026-04-03T02:36:56","slug":"split-type-vertical-airflow-sic-epitaxy-equipment-for-6-8-epi-wafers","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/split-type-vertical-airflow-sic-epitaxy-equipment-for-6-8-epi-wafers\/","title":{"rendered":"Split-Type Vertical Airflow SiC Epitaxy Equipment for 6\u201d\/8\u201d Epi-Wafers"},"content":{"rendered":"<p data-start=\"207\" data-end=\"731\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-medium wp-image-2087 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-2.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>The Split-Type Vertical Airflow Silicon Carbide (SiC) Epitaxy Equipment is an advanced epitaxial growth system designed for high-efficiency production of 6-inch and 8-inch SiC epi-wafers. Featuring a modular split-type architecture, the power supply, exhaust modules, and EFEM\/PM\/TM modules can be independently installed in gray zones or mezzanine areas. This flexibility allows seamless integration into modern fab environments while maintaining full automation capability through SMIF module and overhead crane linkage.<\/p>\n<p data-start=\"733\" data-end=\"1139\">The equipment incorporates an innovative vertical airflow design combined with multi-zone temperature field control, ensuring uniform thickness and stable doping concentration\u2014critical for high-performance SiC power devices. Full automation, including EFEM wafer handling and high-temperature wafer transfer, reduces manual intervention, enhances process consistency, and improves operational efficiency.<\/p>\n<p data-start=\"1141\" data-end=\"1628\">The system supports dual-chamber continuous multi-furnace operation, achieving over 1100 wafers per month and up to 1200 wafers per month through process optimization. Its design is fully compatible with both 6-inch and 8-inch wafers, offering flexibility for manufacturers transitioning to larger wafer sizes. Additionally, the equipment is capable of high-pressure thick-film growth and trench-filling epitaxy, making it suitable for advanced high-voltage and high-power SiC devices.<\/p>\n<p data-start=\"1630\" data-end=\"1829\">The robust split-type construction ensures low defect density, high yield, simplified maintenance, and long-term reliability, minimizing the total cost of ownership for semiconductor manufacturers.<\/p>\n<h3 data-section-id=\"xj0uai\" data-start=\"1836\" data-end=\"1866\"><img decoding=\"async\" class=\"size-medium wp-image-2091 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Split-Type-Vertical-Airflow-SiC-Epitaxy-Equipment-for-68-Epi-Wafers-3-1.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Legfontosabb m\u0171szaki el\u0151ny\u00f6k<\/h3>\n<ul data-start=\"1867\" data-end=\"2438\">\n<li data-section-id=\"wpnig9\" data-start=\"1867\" data-end=\"1961\">Split-type modular design for independent installation of power, exhaust, and EFEM modules<\/li>\n<li data-section-id=\"151uc73\" data-start=\"1962\" data-end=\"2039\">Vertical airflow showerhead for uniform gas distribution across the wafer<\/li>\n<li data-section-id=\"1lzu0dd\" data-start=\"2040\" data-end=\"2105\">Multi-zone temperature control for precise thermal management<\/li>\n<li data-section-id=\"c5t7pm\" data-start=\"2106\" data-end=\"2167\">Dual-chamber configuration for high-throughput production<\/li>\n<li data-section-id=\"rs6yfl\" data-start=\"2168\" data-end=\"2217\">Low defect density and high yield performance<\/li>\n<li data-section-id=\"1rmzhz1\" data-start=\"2218\" data-end=\"2293\">Fully automated wafer handling with EFEM and overhead crane integration<\/li>\n<li data-section-id=\"1o0wgtg\" data-start=\"2294\" data-end=\"2334\">Compatible with 6\u201d and 8\u201d SiC wafers<\/li>\n<li data-section-id=\"1vtm55j\" data-start=\"2335\" data-end=\"2390\">Optimized for thick-film and trench-filling epitaxy<\/li>\n<li data-section-id=\"1usg9u4\" data-start=\"2391\" data-end=\"2438\">High reliability and simplified maintenance<\/li>\n<\/ul>\n<h3 data-section-id=\"4v9b11\" data-start=\"2445\" data-end=\"2470\">Process Performance<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2472\" data-end=\"3023\">\n<thead data-start=\"2472\" data-end=\"2501\">\n<tr data-start=\"2472\" data-end=\"2501\">\n<th class=\"\" data-start=\"2472\" data-end=\"2484\" data-col-size=\"sm\">Param\u00e9ter<\/th>\n<th class=\"\" data-start=\"2484\" data-end=\"2501\" data-col-size=\"md\">Specifik\u00e1ci\u00f3<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2532\" data-end=\"3023\">\n<tr data-start=\"2532\" data-end=\"2620\">\n<td data-start=\"2532\" data-end=\"2545\" data-col-size=\"sm\">Throughput<\/td>\n<td data-start=\"2545\" data-end=\"2620\" data-col-size=\"md\">\u22651100 wafers\/month (dual chambers), up to 1200 wafers\/month (optimized)<\/td>\n<\/tr>\n<tr data-start=\"2621\" data-end=\"2674\">\n<td data-start=\"2621\" data-end=\"2648\" data-col-size=\"sm\">Wafer Size Compatibility<\/td>\n<td data-col-size=\"md\" data-start=\"2648\" data-end=\"2674\">6\u201d \/ 8\u201d SiC epi-wafers<\/td>\n<\/tr>\n<tr data-start=\"2675\" data-end=\"2711\">\n<td data-start=\"2675\" data-end=\"2697\" data-col-size=\"sm\">H\u0151m\u00e9rs\u00e9klet-szab\u00e1lyoz\u00e1s<\/td>\n<td data-col-size=\"md\" data-start=\"2697\" data-end=\"2711\">Multi-zone<\/td>\n<\/tr>\n<tr data-start=\"2712\" data-end=\"2771\">\n<td data-start=\"2712\" data-end=\"2729\" data-col-size=\"sm\">Airflow System<\/td>\n<td data-col-size=\"md\" data-start=\"2729\" data-end=\"2771\">Vertical adjustable multi-zone airflow<\/td>\n<\/tr>\n<tr data-start=\"2772\" data-end=\"2803\">\n<td data-start=\"2772\" data-end=\"2789\" data-col-size=\"sm\">Forg\u00e1si sebess\u00e9g<\/td>\n<td data-col-size=\"md\" data-start=\"2789\" data-end=\"2803\">0\u20131000 rpm<\/td>\n<\/tr>\n<tr data-start=\"2804\" data-end=\"2837\">\n<td data-start=\"2804\" data-end=\"2822\" data-col-size=\"sm\">Max Growth Rate<\/td>\n<td data-col-size=\"md\" data-start=\"2822\" data-end=\"2837\">\u226560 \u03bcm\/hour<\/td>\n<\/tr>\n<tr data-start=\"2838\" data-end=\"2899\">\n<td data-start=\"2838\" data-end=\"2861\" data-col-size=\"sm\">Thickness Uniformity<\/td>\n<td data-col-size=\"md\" data-start=\"2861\" data-end=\"2899\">\u22642% (optimized \u22641%, \u03c3\/avg, EE 5mm)<\/td>\n<\/tr>\n<tr data-start=\"2900\" data-end=\"2960\">\n<td data-start=\"2900\" data-end=\"2920\" data-col-size=\"sm\">Doping Uniformity<\/td>\n<td data-col-size=\"md\" data-start=\"2920\" data-end=\"2960\">\u22643% (optimized \u22641.5%, \u03c3\/avg, EE 5mm)<\/td>\n<\/tr>\n<tr data-start=\"2961\" data-end=\"3023\">\n<td data-start=\"2961\" data-end=\"2985\" data-col-size=\"sm\">Killer Defect Density<\/td>\n<td data-col-size=\"md\" data-start=\"2985\" data-end=\"3023\">\u22640.2 cm\u207b\u00b2 (optimized to 0.01 cm\u207b\u00b2)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"mn7c2p\" data-start=\"3030\" data-end=\"3057\">Application Scenarios<\/h3>\n<p data-start=\"3059\" data-end=\"3280\">The split-type vertical airflow SiC epitaxy equipment is widely used in high-performance SiC semiconductor manufacturing, particularly in industries requiring high efficiency, high voltage, and high thermal performance:<\/p>\n<p data-start=\"3282\" data-end=\"3471\"><strong data-start=\"3282\" data-end=\"3309\">Electric Vehicles (EVs)<\/strong><br data-start=\"3309\" data-end=\"3312\" \/>Used in the production of SiC MOSFETs and power modules for inverters, onboard chargers, and DC-DC converters, improving energy efficiency and driving range.<\/p>\n<p data-start=\"3473\" data-end=\"3622\"><strong data-start=\"3473\" data-end=\"3501\">Renewable Energy Systems<\/strong><br data-start=\"3501\" data-end=\"3504\" \/>Applied in photovoltaic inverters and energy storage systems, enabling higher conversion efficiency and reliability.<\/p>\n<p data-start=\"3624\" data-end=\"3794\"><strong data-start=\"3624\" data-end=\"3656\">Industrial Power Electronics<\/strong><br data-start=\"3656\" data-end=\"3659\" \/>Suitable for high-power motor drives, industrial automation systems, and power supply units requiring stable and efficient operation.<\/p>\n<p data-start=\"3796\" data-end=\"3957\"><strong data-start=\"3796\" data-end=\"3826\">Rail Transit &amp; Power Grids<\/strong><br data-start=\"3826\" data-end=\"3829\" \/>Supports high-voltage and high-frequency devices used in smart grids, traction systems, and power transmission infrastructure.<\/p>\n<p data-start=\"3959\" data-end=\"4113\"><strong data-start=\"3959\" data-end=\"3985\">High-End Power Devices<\/strong><br data-start=\"3985\" data-end=\"3988\" \/>Ideal for manufacturing advanced SiC devices such as Schottky diodes, MOSFETs, and next-generation high-voltage components.<\/p>\n<p data-start=\"3959\" data-end=\"4113\"><img decoding=\"async\" class=\"wp-image-2080 size-large aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-1024x578.png\" alt=\"\" width=\"1024\" height=\"578\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-1024x578.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-300x169.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-768x433.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-18x10.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application-600x339.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/application.png 1285w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h3 data-section-id=\"6toqgg\" data-start=\"4120\" data-end=\"4129\">GYIK<\/h3>\n<p data-start=\"4131\" data-end=\"4359\"><strong data-start=\"4131\" data-end=\"4206\">1. What wafer sizes are supported by this split-type epitaxy equipment?<\/strong><br data-start=\"4206\" data-end=\"4209\" \/>The system supports both 6-inch and 8-inch SiC wafers, allowing manufacturers to meet current production demands while preparing for future scaling.<\/p>\n<p data-start=\"4361\" data-end=\"4591\"><strong data-start=\"4361\" data-end=\"4417\">2. What are the advantages of the split-type design?<\/strong><br data-start=\"4417\" data-end=\"4420\" \/>The modular split design allows independent installation of power, exhaust, and EFEM modules, improving flexibility for fab layout and enhancing maintenance convenience.<\/p>\n<p data-start=\"4593\" data-end=\"4809\"><strong data-start=\"4593\" data-end=\"4661\">3. How does the vertical airflow design improve epitaxy quality?<\/strong><br data-start=\"4661\" data-end=\"4664\" \/>Vertical airflow ensures uniform gas distribution across the wafer, leading to consistent thickness, stable doping, and reduced defect density.<\/p>\n<p data-start=\"4811\" data-end=\"5053\"><strong data-start=\"4811\" data-end=\"4875\">4. Is this equipment suitable for high-volume manufacturing?<\/strong><\/p>\n<p data-pm-slice=\"0 0 []\">Yes, the dual-chamber configuration supports continuous multi-furnace operation, with throughput exceeding 1100 wafers per month, making it ideal for large-scale production and ensuring consistent high-quality wafers with reduced operational downtime.<\/p>","protected":false},"excerpt":{"rendered":"<p>The Split-Type Vertical Airflow Silicon Carbide (SiC) Epitaxy Equipment is an advanced epitaxial growth system designed for high-efficiency production of 6-inch and 8-inch SiC epi-wafers. Featuring a modular split-type architecture, the power supply, exhaust modules, and EFEM\/PM\/TM modules can be independently installed in gray zones or mezzanine areas.<\/p>","protected":false},"featured_media":2087,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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