{"id":2048,"date":"2026-04-01T05:59:16","date_gmt":"2026-04-01T05:59:16","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2048"},"modified":"2026-04-01T06:04:59","modified_gmt":"2026-04-01T06:04:59","slug":"microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/hu\/product\/microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing\/","title":{"rendered":"Mikrofluidikai l\u00e9zerberendez\u00e9s a nagy pontoss\u00e1g\u00fa f\u00e9lvezet\u0151 osty\u00e1k feldolgoz\u00e1s\u00e1hoz"},"content":{"rendered":"

\"\"A mikrofluidikai l\u00e9zerberendez\u00e9sek fejlett mikrosugaras l\u00e9zertechnol\u00f3gi\u00e1t alkalmaznak a f\u00e9lvezet\u0151 osty\u00e1k \u00e9s m\u00e1s kem\u00e9ny, t\u00f6r\u00e9keny vagy sz\u00e9les s\u00e1vsz\u00e9less\u00e9g\u0171 anyagok nagy pontoss\u00e1g\u00fa, alacsony termikus k\u00e1rosod\u00e1ssal j\u00e1r\u00f3 megmunk\u00e1l\u00e1s\u00e1hoz. Egy szubmikronos v\u00edzsug\u00e1r \u00e9s egy l\u00e9zersug\u00e1r kombin\u00e1l\u00e1s\u00e1val a rendszer pontosan a munkadarab fel\u00fclet\u00e9re ir\u00e1ny\u00edtja a l\u00e9zerenergi\u00e1t, mik\u00f6zben a v\u00edz\u00e1ram folyamatosan h\u0171ti \u00e9s elt\u00e1vol\u00edtja a t\u00f6rmel\u00e9ket. Ez a technol\u00f3gia hat\u00e9konyan kezeli a hagyom\u00e1nyos l\u00e9zeres \u00e9s mechanikus megmunk\u00e1l\u00e1s \u00e1ltal\u00e1nos kih\u00edv\u00e1sait, bele\u00e9rtve a termikus k\u00e1rosod\u00e1st, a mikroreped\u00e9seket, a szennyez\u0151d\u00e9seket, a k\u00faposod\u00e1st \u00e9s a deform\u00e1ci\u00f3t.<\/p>\n

\"\"F\u0151 jellemz\u0151k<\/strong><\/span><\/h2>\n
    \n
  • L\u00e9zer t\u00edpusa:<\/strong> Di\u00f3d\u00e1val felt\u00f6lt\u00f6tt szil\u00e1rdtest Nd:YAG l\u00e9zer, hull\u00e1mhossz 532\/1064 nm, impulzussz\u00e9less\u00e9g \u03bcs\/ns, \u00e1tlagos teljes\u00edtm\u00e9ny 10-200 W<\/li>\n
  • V\u00edzsugaras rendszer:<\/strong> Alacsony nyom\u00e1s\u00fa, deioniz\u00e1lt, sz\u0171rt v\u00edz; az ultrafinom mikrosug\u00e1r 300 bar nyom\u00e1son csak 1 L\/h fogyaszt, elhanyagolhat\u00f3 er\u0151vel (<0,1 N).<\/li>\n
  • F\u00fav\u00f3ka:<\/strong> Zaf\u00edr vagy gy\u00e9m\u00e1nt, 30-150 \u03bcm \u00e1tm\u00e9r\u0151vel a prec\u00edz l\u00e9zerir\u00e1ny\u00edt\u00e1shoz<\/li>\n
  • Kieg\u00e9sz\u00edt\u0151 rendszer:<\/strong> Nagynyom\u00e1s\u00fa szivatty\u00fak \u00e9s v\u00edzkezel\u0151 egys\u00e9gek biztos\u00edtj\u00e1k a stabil sug\u00e1r teljes\u00edtm\u00e9ny\u00e9t<\/li>\n
  • Precizit\u00e1s:<\/strong> Pozicion\u00e1l\u00e1si pontoss\u00e1g \u00b15 \u03bcm, ism\u00e9telt pozicion\u00e1l\u00e1si pontoss\u00e1g \u00b12 \u03bcm<\/li>\n
  • Feldolgoz\u00e1si k\u00e9pess\u00e9g:<\/strong> Ra fel\u00fcleti \u00e9rdess\u00e9g \u22641,2-1,6 \u03bcm, line\u00e1ris v\u00e1g\u00e1si sebess\u00e9g \u226550 mm\/s, nyit\u00e1si sebess\u00e9g \u22651,25 mm\/s, ker\u00fcleti v\u00e1g\u00e1s \u22656 mm\/s<\/li>\n<\/ul>\n

    M\u0171szaki specifik\u00e1ci\u00f3k<\/strong><\/span><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Specifik\u00e1ci\u00f3<\/th>\n1. lehet\u0151s\u00e9g<\/th>\n2. lehet\u0151s\u00e9g<\/th>\n<\/tr>\n<\/thead>\n
    Munkalap t\u00e9rfogata (mm)<\/td>\n300\u00d7300\u00d7150<\/td>\n400\u00d7400\u00d7200<\/td>\n<\/tr>\n
    Line\u00e1ris tengely XY<\/td>\nLine\u00e1ris motor<\/td>\nLine\u00e1ris motor<\/td>\n<\/tr>\n
    Line\u00e1ris tengely Z<\/td>\n150<\/td>\n200<\/td>\n<\/tr>\n
    Helymeghat\u00e1roz\u00e1si pontoss\u00e1g (\u03bcm)<\/td>\n\u00b15<\/td>\n\u00b15<\/td>\n<\/tr>\n
    Ism\u00e9telt pozicion\u00e1l\u00e1si pontoss\u00e1g (\u03bcm)<\/td>\n\u00b12<\/td>\n\u00b12<\/td>\n<\/tr>\n
    Gyorsul\u00e1s (G)<\/td>\n1<\/td>\n0.29<\/td>\n<\/tr>\n
    Numerikus vez\u00e9rl\u00e9s<\/td>\n3 tengely \/ 3+1 \/ 3+2 tengely<\/td>\n3 tengely \/ 3+1 \/ 3+2 tengely<\/td>\n<\/tr>\n
    Hull\u00e1mhossz (nm)<\/td>\n532\/1064<\/td>\n532\/1064<\/td>\n<\/tr>\n
    N\u00e9vleges teljes\u00edtm\u00e9ny (W)<\/td>\n50\/100\/200<\/td>\n50\/100\/200<\/td>\n<\/tr>\n
    V\u00edzsug\u00e1rnyom\u00e1s (bar)<\/td>\n50-100<\/td>\n50-600<\/td>\n<\/tr>\n
    F\u00fav\u00f3ka m\u00e9rete (\u03bcm)<\/td>\n30-150<\/td>\n30-150<\/td>\n<\/tr>\n
    A g\u00e9p m\u00e9retei (mm)<\/td>\n1445\u00d71944\u00d72260<\/td>\n1700\u00d71500\u00d72120<\/td>\n<\/tr>\n
    T\u00f6meg (T)<\/td>\n2.5<\/td>\n3<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Alkalmaz\u00e1sok<\/strong><\/span><\/h2>\n
      \n
    1. Wafer szeletel\u00e9s \u00e9s v\u00e1g\u00e1s<\/strong>\n
        \n
      • Anyagok: Szil\u00edcium (Si), szil\u00edcium-karbid (SiC), gallium-nitrid (GaN) \u00e9s m\u00e1s kem\u00e9ny\/roppant szil\u00edciumszeletk\u00e9k.<\/li>\n
      • El\u0151ny\u00f6k: (20 \u03bcm), 30%-vel n\u00f6veli a v\u00e1g\u00e1si sebess\u00e9get, lehet\u0151v\u00e9 teszi az ultrav\u00e9kony osty\u00e1k (<50 \u03bcm) lopakod\u00f3 szeletel\u00e9s\u00e9t.<\/li>\n<\/ul>\n<\/li>\n
      • Chipf\u00far\u00e1s \u00e9s mikrofurat-feldolgoz\u00e1s<\/strong>\n
          \n
        • Alkalmaz\u00e1sok: Szil\u00edciumon kereszt\u00fclvezet\u0151 (TSV) f\u00far\u00e1sok, termikus mikrolyuk t\u00f6mb\u00f6k a t\u00e1pegys\u00e9gek sz\u00e1m\u00e1ra<\/li>\n
        • Jellemz\u0151k: 10-200 \u03bcm ny\u00edl\u00e1s, m\u00e9lys\u00e9g-sz\u00e9less\u00e9g ar\u00e1ny ak\u00e1r 10:1, Ra fel\u00fcleti \u00e9rdess\u00e9g <0,5 \u03bcm.<\/li>\n<\/ul>\n<\/li>\n
        • Fejlett csomagol\u00e1s<\/strong>\n
            \n
          • Alkalmaz\u00e1sok: RDL ablaknyit\u00e1s, wafer-level csomagol\u00e1s (Fan-Out WLP)<\/li>\n
          • El\u0151ny\u00f6k: Elker\u00fcli a mechanikai fesz\u00fclts\u00e9get, jav\u00edtja a hozamot >99,5%-re.<\/li>\n<\/ul>\n<\/li>\n
          • \u00d6sszetett f\u00e9lvezet\u0151k feldolgoz\u00e1sa<\/strong>\n
              \n
            • Anyagok: GaN, SiC \u00e9s m\u00e1s sz\u00e9les s\u00e1vsz\u00e9less\u00e9g\u0171 f\u00e9lvezet\u0151k<\/li>\n
            • Jellemz\u0151k: l\u00e9zeres l\u00e1gy\u00edt\u00e1s, pontos energiaszab\u00e1lyoz\u00e1s a termikus boml\u00e1s megel\u0151z\u00e9s\u00e9re<\/li>\n<\/ul>\n<\/li>\n
            • Hibajav\u00edt\u00e1s \u00e9s finomhangol\u00e1s<\/strong>\n
                \n
              • Alkalmaz\u00e1sok: L\u00e9zerolvaszt\u00e1s mem\u00f3ria\u00e1ramk\u00f6r\u00f6kh\u00f6z, mikrolencse t\u00f6mb hangol\u00e1sa optikai \u00e9rz\u00e9kel\u0151kh\u00f6z.<\/li>\n
              • Pontoss\u00e1g: jav\u00edt\u00e1si pozicion\u00e1l\u00e1si hiba <0,1 \u03bcm<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

                \"\"<\/p>\n

                Kiemelt pontok \u00e9s el\u0151ny\u00f6k<\/strong><\/span><\/h2>\n
                  \n
                • A hideg, tiszta \u00e9s ellen\u0151rz\u00f6tt feldolgoz\u00e1s minimaliz\u00e1lja a h\u0151k\u00e1rosod\u00e1st, a mikroreped\u00e9seket \u00e9s a k\u00faposod\u00e1st.<\/li>\n
                • Az ultrafinom v\u00edzsug\u00e1r prec\u00edz l\u00e9zeres ir\u00e1ny\u00edt\u00e1st \u00e9s hat\u00e9kony t\u00f6rmel\u00e9kelt\u00e1vol\u00edt\u00e1st biztos\u00edt<\/li>\n
                • Alkalmas kem\u00e9ny, t\u00f6r\u00e9keny \u00e9s \u00e1tl\u00e1tsz\u00f3 anyagokhoz, mint p\u00e9ld\u00e1ul SiC, GaN, gy\u00e9m\u00e1nt, LTCC \u00e9s fotovoltaikus krist\u00e1lyok.<\/li>\n
                • Kompatibilis a nagy pontoss\u00e1g\u00fa f\u00e9lvezet\u0151gy\u00e1rt\u00e1ssal, a fejlett csomagol\u00e1ssal, a rep\u00fcl\u0151g\u00e9p-alkatr\u00e9szekkel \u00e9s a mikroelektronik\u00e1val.<\/li>\n
                • N\u00f6veli a hozamot, cs\u00f6kkenti az anyaghullad\u00e9kot \u00e9s meg\u0151rzi az anyag tulajdons\u00e1gait.<\/li>\n<\/ul>\n

                  Tan\u00fas\u00edt\u00e1s \u00e9s megfelel\u00e9s<\/strong><\/span><\/h2>\n
                    \n
                  • RoHS-kompatibilis<\/li>\n
                  • Nagy pontoss\u00e1g\u00fa f\u00e9lvezet\u0151 alkalmaz\u00e1sokhoz tervezve<\/li>\n
                  • T\u00e1mogatja a reproduk\u00e1lhat\u00f3, megism\u00e9telhet\u0151 \u00e9s automatiz\u00e1lt feldolgoz\u00e1st<\/li>\n<\/ul>\n

                    GYIK<\/strong><\/span><\/h2>\n

                    1. Milyen t\u00edpus\u00fa anyagok dolgozhat\u00f3k fel mikrofluidikai l\u00e9zerberendez\u00e9ssel?<\/strong>
                    A mikrofluidikai l\u00e9zertechnol\u00f3gia k\u00e9pes a kem\u00e9ny, rideg \u00e9s sz\u00e9les s\u00e1vsz\u00e9less\u00e9g\u0171 f\u00e9lvezet\u0151 anyagok, k\u00f6zt\u00fck a szil\u00edcium (Si), a szil\u00edcium-karbid (SiC), a gallium-nitrid (GaN), a gy\u00e9m\u00e1nt, az LTCC sz\u00e9nker\u00e1mia szubsztr\u00e1tumok, a fotovoltaikus krist\u00e1lyok \u00e9s m\u00e1s fejlett anyagok prec\u00edz megmunk\u00e1l\u00e1s\u00e1ra. Ide\u00e1lis a minim\u00e1lis termikus k\u00e1rosod\u00e1st \u00e9s magas fel\u00fcleti min\u0151s\u00e9get ig\u00e9nyl\u0151 alkalmaz\u00e1sokhoz.<\/p>\n

                    2. Hogyan jav\u00edtja a mikrosugaras l\u00e9zertechnol\u00f3gia a f\u00e9lvezet\u0151 osty\u00e1k gy\u00e1rt\u00e1s\u00e1t?<\/strong>
                    A technol\u00f3gia egy szubmikronos v\u00edzsug\u00e1r \u00e9s egy l\u00e9zersug\u00e1r kombin\u00e1l\u00e1s\u00e1val szubmikronos pontoss\u00e1got \u00e9r el, mik\u00f6zben minimaliz\u00e1lja a h\u0151hat\u00e1s \u00e1ltal \u00e9rintett z\u00f3n\u00e1kat, a szennyez\u0151d\u00e9seket \u00e9s az \u00e9lek t\u00f6r\u00e9s\u00e9t. A hagyom\u00e1nyos mechanikus peng\u00e9ket helyettes\u00edti a szaggat\u00e1s, f\u00far\u00e1s \u00e9s mikrostruktur\u00e1l\u00e1s sor\u00e1n, jav\u00edtva a hozamot \u00e9s cs\u00f6kkentve az anyaghullad\u00e9kot.<\/p>\n

                    3. Milyen alkalmaz\u00e1sokra alkalmasak a mikrofluidikai l\u00e9zerberendez\u00e9sek?<\/strong>
                    Ezt a berendez\u00e9st sz\u00e9les k\u00f6rben haszn\u00e1lj\u00e1k:<\/p>\n

                      \n
                    • Ultra v\u00e9kony (<50 \u03bcm) osty\u00e1k szeletel\u00e9se \u00e9s lopakod\u00f3 szeletel\u00e9se<\/li>\n
                    • Szil\u00edciumon kereszt\u00fcli \u00e1tvezet\u00e9sek (TSV) f\u00far\u00e1sa \u00e9s mikrolyukak elrendez\u00e9se 3D-s IC-khez \u00e9s t\u00e1pegys\u00e9gekhez<\/li>\n
                    • Fejlett csomagol\u00e1s, mint p\u00e9ld\u00e1ul RDL ablaknyit\u00e1s, wafer-level packaging (Fan-Out WLP), valamint a GaN \u00e9s SiC f\u00e9lvezet\u0151k kapu marat\u00e1sa\/l\u00e9zerrel t\u00f6rt\u00e9n\u0151 l\u00e1gy\u00edt\u00e1s.<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

                      A mikrofluidikai l\u00e9zerberendez\u00e9sek fejlett mikrosugaras l\u00e9zertechnol\u00f3gi\u00e1t alkalmaznak a f\u00e9lvezet\u0151 osty\u00e1k \u00e9s m\u00e1s kem\u00e9ny, t\u00f6r\u00e9keny vagy sz\u00e9les s\u00e1vsz\u00e9less\u00e9g\u0171 anyagok nagy pontoss\u00e1g\u00fa, alacsony termikus k\u00e1rosod\u00e1ssal j\u00e1r\u00f3 megmunk\u00e1l\u00e1s\u00e1hoz.<\/p>","protected":false},"featured_media":2049,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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