{"id":2596,"date":"2026-07-13T08:46:14","date_gmt":"2026-07-13T08:46:14","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2596"},"modified":"2026-07-13T08:46:50","modified_gmt":"2026-07-13T08:46:50","slug":"glass-wafer-coring","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/hu\/glass-wafer-coring\/","title":{"rendered":"\u00dcveglapok lyukaszt\u00e1si folyamata: Hogyan k\u00e9sz\u00fclnek a prec\u00edzi\u00f3s ny\u00edl\u00e1sok a fejlett csomagol\u00e1si technol\u00f3gi\u00e1khoz?"},"content":{"rendered":"<p>Mivel az \u00fcveghordoz\u00f3k egyre nagyobb jelent\u0151s\u00e9gre tesznek szert a fejlett f\u00e9lvezet\u0151-csomagol\u00e1sban, az \u00fcveglapokba kialak\u00edtott prec\u00edzi\u00f3s ny\u00edl\u00e1sok d\u00f6nt\u0151 szerepet j\u00e1tszanak a k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s elektronikus eszk\u00f6z\u00f6k megval\u00f3s\u00edt\u00e1s\u00e1ban. Ezek a ny\u00edl\u00e1sok \u00fatvonalakat biztos\u00edtanak az elektromos \u00f6sszek\u00f6ttet\u00e9sekhez, a folyad\u00e9kcsatorn\u00e1khoz, az optikai \u00e1tvitelhez, az igaz\u00edt\u00f3 strukt\u00far\u00e1khoz \u00e9s a speci\u00e1lis csomagol\u00e1si elemekhez.<\/p>\n\n\n\n<p>A hagyom\u00e1nyos szil\u00edcium-megmunk\u00e1l\u00e1st\u00f3l elt\u00e9r\u0151en az \u00fcveglapokba t\u00f6rt\u00e9n\u0151 furatok kialak\u00edt\u00e1sa egyedi kih\u00edv\u00e1sokat jelent, mivel az \u00fcveg egy t\u00f6r\u00e9keny anyag, amely rendk\u00edv\u00fcl hajlamos a sz\u00e9leken t\u00f6rt\u00e9n\u0151 lepattogz\u00e1sra, a mikroreped\u00e9sek kialakul\u00e1s\u00e1ra \u00e9s a marad\u00e9kfesz\u00fclts\u00e9gre. A tiszta, m\u00e9retpontos ny\u00edl\u00e1sok kialak\u00edt\u00e1s\u00e1hoz gondosan ki kell v\u00e1lasztani a megmunk\u00e1l\u00e1si m\u00f3dszereket, a folyamatparam\u00e9tereket \u00e9s az ellen\u0151rz\u00e9si technik\u00e1kat.<\/p>\n\n\n\n<p>Ez a cikk bemutatja az \u00fcveglapok magf\u00far\u00e1si folyamat\u00e1t, a rendelkez\u00e9sre \u00e1ll\u00f3 gy\u00e1rt\u00e1si technol\u00f3gi\u00e1kat, a gyakori min\u0151s\u00e9gi probl\u00e9m\u00e1kat, valamint a f\u00e9lvezet\u0151- \u00e9s fejlett csomagol\u00e1si alkalmaz\u00e1sokhoz kapcsol\u00f3d\u00f3 legfontosabb tervez\u00e9si szempontokat.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-1024x683.png\" alt=\"\" class=\"wp-image-2597\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-1024x683.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-300x200.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-768x512.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-18x12.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process-600x400.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/07\/Glass-Wafer-Coring-Process.png 1536w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Mi az \u00fcveglap magf\u00far\u00e1s?<\/h2>\n\n\n\n<p>Az \u00fcveglapok lyukaszt\u00e1sa olyan elj\u00e1r\u00e1s, amelynek sor\u00e1n prec\u00edzi\u00f3s k\u00f6r alak\u00fa ny\u00edl\u00e1sokat vagy \u00fcregeket hoznak l\u00e9tre az \u00fcveglapban, mik\u00f6zben meg\u0151rzik a k\u00f6rnyez\u0151 anyag szerkezeti integrit\u00e1s\u00e1t.<\/p>\n\n\n\n<p>Az \u00edgy keletkez\u0151 ny\u00edl\u00e1sok a k\u00f6vetkez\u0151kre haszn\u00e1lhat\u00f3k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Az \u00fcvegen \u00e1tmen\u0151 \u00e1tvezet\u0151 (TGV) el\u0151k\u00e9sz\u00edt\u00e9se<\/li>\n\n\n\n<li>\u00c9rz\u00e9kel\u0151k integr\u00e1l\u00e1sa<\/li>\n\n\n\n<li>Optikai \u00fatvonalak<\/li>\n\n\n\n<li>MEMS eszk\u00f6z\u00f6k<\/li>\n\n\n\n<li>Mikrofluidikus rendszerek<\/li>\n\n\n\n<li>Oszlop szint\u0171 csomagol\u00e1s<\/li>\n\n\n\n<li>Be\u00e1ll\u00edt\u00f3 furatok<\/li>\n\n\n\n<li>Mechanikus pozicion\u00e1l\u00e1s<\/li>\n\n\n\n<li>V\u00e1kuumcsomagol\u00e1s<\/li>\n\n\n\n<li>F\u00e9lvezet\u0151 k\u00f6zbeiktat\u00f3 szerkezetek<\/li>\n<\/ul>\n\n\n\n<p>Az alkalmaz\u00e1st\u00f3l f\u00fcgg\u0151en a ny\u00edl\u00e1s lehet:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Teljes \u00e1tmen\u0151 furat<\/li>\n\n\n\n<li>Vakfurat<\/li>\n\n\n\n<li>Egy s\u00fcllyesztett \u00fcreg<\/li>\n\n\n\n<li>L\u00e9pcs\u0151zetes ny\u00edl\u00e1s<\/li>\n\n\n\n<li>Prec\u00edzi\u00f3s s\u00fcllyeszt\u00e9s<\/li>\n<\/ul>\n\n\n\n<p>A sz\u00fcks\u00e9ges geometria hat\u00e1rozza meg a megfelel\u0151 gy\u00e1rt\u00e1si elj\u00e1r\u00e1st.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Mi\u00e9rt haszn\u00e1lnak \u00fcveget a fejlett csomagol\u00e1si technol\u00f3gi\u00e1kban?<\/h2>\n\n\n\n<p>Az \u00fcveg vonz\u00f3 hordoz\u00f3anyagg\u00e1 v\u00e1lt, mivel kiv\u00e1l\u00f3 elektromos, mechanikai \u00e9s h\u0151technikai tulajdons\u00e1gokat \u00f6tv\u00f6z mag\u00e1ban.<\/p>\n\n\n\n<p>Az organikus szubsztr\u00e1tumokhoz k\u00e9pest az \u00fcveg a k\u00f6vetkez\u0151 el\u0151ny\u00f6ket k\u00edn\u00e1lja:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kiv\u00e1l\u00f3 m\u00e9retstabilit\u00e1s<\/li>\n\n\n\n<li>Alacsony dielektromos vesztes\u00e9g<\/li>\n\n\n\n<li>Kiv\u00e1l\u00f3 elektromos szigetel\u00e9s<\/li>\n\n\n\n<li>Sima fel\u00fcleti kivitel<\/li>\n\n\n\n<li>Alacsony h\u0151t\u00e1gul\u00e1si elt\u00e9r\u00e9s<\/li>\n\n\n\n<li>Nagy laposs\u00e1g<\/li>\n\n\n\n<li>J\u00f3 optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g<\/li>\n\n\n\n<li>Kompatibilit\u00e1s a sz\u0171k oszt\u00e1s\u00fa \u00fajraeloszt\u00f3 r\u00e9tegekkel<\/li>\n<\/ul>\n\n\n\n<p>A szil\u00edciumhoz k\u00e9pest az \u00fcveg \u00e1ltal\u00e1ban alacsonyabb r\u00e1di\u00f3frekvenci\u00e1s jelvesztes\u00e9get \u00e9s jobb teljes\u00edtm\u00e9nyt biztos\u00edt a nagyfrekvenci\u00e1s alkalmaz\u00e1sokban.<\/p>\n\n\n\n<p>Ahogy a chiplet-architekt\u00far\u00e1k, a mesters\u00e9ges intelligencia-processzorok \u00e9s a heterog\u00e9n integr\u00e1ci\u00f3 folyamatosan fejl\u0151dnek, az \u00fcveg k\u00f6zbeiktat\u00f3k egyre nagyobb figyelmet kapnak a f\u00e9lvezet\u0151gy\u00e1rt\u00f3k r\u00e9sz\u00e9r\u0151l.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Mi\u00e9rt nehezebb a magf\u00far\u00e1s, mint amilyennek l\u00e1tszik?<\/h2>\n\n\n\n<p>B\u00e1r az \u00fcveg a zaf\u00edrhoz vagy a szil\u00edcium-karbidhoz k\u00e9pest viszonylag puha anyagnak t\u0171nik, megmunk\u00e1l\u00e1s sor\u00e1n t\u00f6r\u00e9keny anyagk\u00e9nt viselkedik.<\/p>\n\n\n\n<p>A k\u00e9pl\u00e9keny f\u00e9mekkel ellent\u00e9tben az \u00fcveg nem plasztikusan deform\u00e1l\u00f3dik, hanem elt\u00f6rik.<\/p>\n\n\n\n<p>A magv\u00e9tel sor\u00e1n a nem megfelel\u0151 folyamatir\u00e1ny\u00edt\u00e1s a k\u00f6vetkez\u0151ket eredm\u00e9nyezheti:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Sz\u00e9lek forg\u00e1csol\u00f3d\u00e1sa<\/li>\n\n\n\n<li>Radi\u00e1lis reped\u00e9sek<\/li>\n\n\n\n<li>Felsz\u00edn alatti k\u00e1rok<\/li>\n\n\n\n<li>Marad\u00f3 fesz\u00fclts\u00e9g<\/li>\n\n\n\n<li>Fel\u00fcleti karcol\u00e1sok<\/li>\n\n\n\n<li>K\u00fapos furatok<\/li>\n\n\n\n<li>R\u00e9szecskeszennyez\u00e9s<\/li>\n\n\n\n<li>Sarokt\u00f6r\u00e9sek<\/li>\n<\/ul>\n\n\n\n<p>Ezek a hib\u00e1k cs\u00f6kkenthetik a szil\u00edciumlapok hozam\u00e1t, \u00e9s hat\u00e1ssal lehetnek a k\u00e9s\u0151bbi folyamatokra, p\u00e9ld\u00e1ul a f\u00e9mbevon\u00e1sra, a TGV-k\u00e9pz\u00e9sre \u00e9s a szil\u00edciumlapok \u00f6sszeragaszt\u00e1s\u00e1ra.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">A leggyakrabban alkalmazott \u00fcveglap-kiv\u00e1g\u00e1si technol\u00f3gi\u00e1k<\/h2>\n\n\n\n<p>A furatm\u00e9rett\u0151l, az ostya vastags\u00e1g\u00e1t\u00f3l, a t\u0171r\u00e9si k\u00f6vetelm\u00e9nyekt\u0151l \u00e9s a gy\u00e1rt\u00e1si mennyis\u00e9gt\u0151l f\u00fcgg\u0151en t\u00f6bbf\u00e9le gy\u00e1rt\u00e1si m\u00f3dszer \u00e1ll rendelkez\u00e9sre.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Mechanikus magf\u00far\u00e1s<\/h3>\n\n\n\n<p>A gy\u00e9m\u00e1ntmagf\u00far\u00e1s az egyik hagyom\u00e1nyos m\u00f3dszer viszonylag nagy \u00e1tm\u00e9r\u0151j\u0171 ny\u00edl\u00e1sok kialak\u00edt\u00e1s\u00e1ra.<\/p>\n\n\n\n<p>Az el\u0151ny\u00f6k k\u00f6z\u00e9 tartoznak:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kifejlett technol\u00f3gia<\/li>\n\n\n\n<li>Kiv\u00e1l\u00f3 m\u00e9retellen\u0151rz\u00e9s<\/li>\n\n\n\n<li>Alkalmas protot\u00edpusgy\u00e1rt\u00e1sra<\/li>\n\n\n\n<li>K\u00fcl\u00f6nb\u00f6z\u0151 \u00fcvegt\u00edpusokkal kompatibilis<\/li>\n<\/ul>\n\n\n\n<p>A mechanikus \u00e9rintkez\u00e9s azonban v\u00e1g\u00e1si er\u0151ket eredm\u00e9nyez, amelyek n\u00f6velhetik a lepattogz\u00e1s \u00e9s a mikroreped\u00e9sek kialakul\u00e1s\u00e1nak kock\u00e1zat\u00e1t.<\/p>\n\n\n\n<p>A megfelel\u0151 h\u0171t\u0151folyad\u00e9k-ell\u00e1t\u00e1s, az ors\u00f3 fordulatsz\u00e1ma \u00e9s az el\u0151tol\u00e1s elengedhetetlenek.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Ultrahangos megmunk\u00e1l\u00e1s<\/h3>\n\n\n\n<p>Az ultrahangos megmunk\u00e1l\u00e1s a nagyfrekvenci\u00e1s rezg\u00e9st csiszol\u00f3szuszpenzi\u00f3val kombin\u00e1lja a t\u00f6r\u00e9keny anyagok elt\u00e1vol\u00edt\u00e1sa \u00e9rdek\u00e9ben.<\/p>\n\n\n\n<p>Az el\u0151ny\u00f6k k\u00f6z\u00f6tt szerepelnek:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Alacsonyabb v\u00e1g\u00e1si er\u0151k<\/li>\n\n\n\n<li>Cs\u00f6kkentett \u00e9ls\u00e9r\u00fcl\u00e9s<\/li>\n\n\n\n<li>Jobb teljes\u00edtm\u00e9ny a t\u00f6r\u00e9keny \u00fcveg eset\u00e9ben<\/li>\n\n\n\n<li>Prec\u00edzi\u00f3s ny\u00edl\u00e1sokhoz alkalmas<\/li>\n<\/ul>\n\n\n\n<p>Az ultrahangos megmunk\u00e1l\u00e1st gyakran v\u00e1lasztj\u00e1k, ha a mechanikai ig\u00e9nybev\u00e9telt a lehet\u0151 legkisebbre kell cs\u00f6kkenteni.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">L\u00e9zeres magf\u00far\u00e1s<\/h3>\n\n\n\n<p>A l\u00e9zeres magf\u00far\u00e1s egyre n\u00e9pszer\u0171bb\u00e9 v\u00e1lik a f\u00e9lvezet\u0151ipari alkalmaz\u00e1sok ter\u00e9n.<\/p>\n\n\n\n<p>A mechanikus v\u00e1g\u00e1s helyett a f\u00f3kusz\u00e1lt l\u00e9zerenergia fizikai szersz\u00e1m\u00e9rintkez\u00e9s n\u00e9lk\u00fcl alak\u00edtja \u00e1t vagy t\u00e1vol\u00edtja el az anyagot.<\/p>\n\n\n\n<p>Az el\u0151ny\u00f6k k\u00f6z\u00e9 tartoznak:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kis furatok f\u00far\u00e1s\u00e1ra alkalmas<\/li>\n\n\n\n<li>Magas pozicion\u00e1l\u00e1si pontoss\u00e1g<\/li>\n\n\n\n<li>Rugalmas geometria<\/li>\n\n\n\n<li>Cs\u00f6kkentett mechanikai terhel\u00e9s<\/li>\n\n\n\n<li>Kiv\u00e1l\u00f3 automatiz\u00e1l\u00e1si lehet\u0151s\u00e9gek<\/li>\n<\/ul>\n\n\n\n<p>Az ultranagy sebess\u00e9g\u0171 l\u00e9zerrendszerek tov\u00e1bb cs\u00f6kkentik a h\u0151hat\u00e1sos z\u00f3n\u00e1kat \u00e9s a mikroreped\u00e9seket.<\/p>\n\n\n\n<p>A l\u00e9zeres magf\u00far\u00e1s k\u00fcl\u00f6n\u00f6sen alkalmas a fejlett csomagol\u00e1si technol\u00f3gi\u00e1khoz \u00e9s a prec\u00edzi\u00f3s mikroelektronik\u00e1hoz.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">V\u00edzsug\u00e1rral t\u00e1mogatott megmunk\u00e1l\u00e1s<\/h3>\n\n\n\n<p>Bizonyos nagyobb ny\u00edl\u00e1sok eset\u00e9ben alkalmazhat\u00f3 a koptat\u00f3 v\u00edzsugaras megmunk\u00e1l\u00e1s.<\/p>\n\n\n\n<p>B\u00e1r h\u0151hat\u00e1sa viszonylag csek\u00e9ly, tov\u00e1bbi ut\u00f3munk\u00e1latok n\u00e9lk\u00fcl \u00e1ltal\u00e1ban nem k\u00e9pes el\u00e9rni a f\u00e9lvezet\u0151-csomagol\u00e1shoz sz\u00fcks\u00e9ges m\u00e9retpontoss\u00e1got.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Hibrid gy\u00e1rt\u00e1s<\/h3>\n\n\n\n<p>Sz\u00e1mos gy\u00e1rt\u00f3 t\u00f6bb technik\u00e1t is \u00f6tv\u00f6z egyazon gy\u00e1rt\u00e1si folyamaton bel\u00fcl.<\/p>\n\n\n\n<p>P\u00e9ld\u00e1ul:<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li>L\u00e9zeres el\u0151f\u00far\u00e1s<\/li>\n\n\n\n<li>Mechanikus megmunk\u00e1l\u00e1s<\/li>\n\n\n\n<li>\u00c9lek csiszol\u00e1sa<\/li>\n\n\n\n<li>Tiszt\u00edt\u00e1s<\/li>\n\n\n\n<li>Fel\u00fcleti ellen\u0151rz\u00e9s<\/li>\n<\/ol>\n\n\n\n<p>A hibrid feldolgoz\u00e1s mind a termel\u00e9kenys\u00e9get, mind a v\u00e9gs\u0151 min\u0151s\u00e9get jav\u00edthatja.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">A prec\u00edzi\u00f3s \u00fcvegny\u00edl\u00e1sok tervez\u00e9s\u00e9vel kapcsolatos szempontok<\/h2>\n\n\n\n<p>Az \u00fcveglapok sikeres magf\u00far\u00e1sa a megfelel\u0151 term\u00e9ktervez\u00e9ssel kezd\u0151dik.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">A furat \u00e1tm\u00e9r\u0151je<\/h3>\n\n\n\n<p>A kisebb furatok \u00e1ltal\u00e1ban szigor\u00fabb folyamatellen\u0151rz\u00e9st ig\u00e9nyelnek.<\/p>\n\n\n\n<p>A furatm\u00e9ret hat\u00e1sa:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Megmunk\u00e1l\u00e1si elj\u00e1r\u00e1s<\/li>\n\n\n\n<li>Ciklusid\u0151<\/li>\n\n\n\n<li>K\u00e9par\u00e1ny<\/li>\n\n\n\n<li>\u00c9lek min\u0151s\u00e9ge<\/li>\n\n\n\n<li>Az ellen\u0151rz\u00e9s neh\u00e9zs\u00e9gei<\/li>\n\n\n\n<li>Gy\u00e1rt\u00e1si k\u00f6lts\u00e9g<\/li>\n<\/ul>\n\n\n\n<p>A tervez\u0151knek lehet\u0151s\u00e9g szerint ker\u00fclni\u00fck kell a sz\u00fcks\u00e9gtelen\u00fcl kis \u00e1tm\u00e9r\u0151ket.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Oszlopvastags\u00e1g<\/h3>\n\n\n\n<p>Az ostya vastags\u00e1ga \u00e9s a furat \u00e1tm\u00e9r\u0151je k\u00f6z\u00f6tti \u00f6sszef\u00fcgg\u00e9s k\u00f6zvetlen\u00fcl befoly\u00e1solja a megmunk\u00e1l\u00e1s bonyolults\u00e1g\u00e1t.<\/p>\n\n\n\n<p>A nagy oldalar\u00e1ny megnehez\u00edti a k\u00f6vetkez\u0151ket:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hullad\u00e9keltakar\u00edt\u00e1s<\/li>\n\n\n\n<li>Az oldalfal min\u0151s\u00e9ge<\/li>\n\n\n\n<li>M\u00e9retpontoss\u00e1g<\/li>\n\n\n\n<li>A furat egyeness\u00e9ge<\/li>\n<\/ul>\n\n\n\n<p>A v\u00e9konyabb szeletek cs\u00f6kkentik a f\u00far\u00e1si m\u00e9lys\u00e9get, de tov\u00e1bbi kezel\u00e9si t\u00e1mogat\u00e1st ig\u00e9nyelnek.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">F\u00far\u00f3lyuk helyzete<\/h3>\n\n\n\n<p>A poz\u00edci\u00f3pontoss\u00e1g k\u00fcl\u00f6n\u00f6sen fontos a k\u00f6vetkez\u0151 esetekben:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>TGV-t\u00f6mb\u00f6k<\/li>\n\n\n\n<li>Optikai be\u00e1ll\u00edt\u00e1s<\/li>\n\n\n\n<li>T\u00f6bbchipes csomagol\u00e1s<\/li>\n\n\n\n<li>MEMS-szerkezetek<\/li>\n\n\n\n<li>\u00c9rz\u00e9kel\u0151k integr\u00e1l\u00e1sa<\/li>\n<\/ul>\n\n\n\n<p>A hivatkoz\u00e1si pontokat a m\u0171szaki rajzokon egy\u00e9rtelm\u0171en meg kell jel\u00f6lni.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">\u00c9lt\u00e1vols\u00e1g<\/h3>\n\n\n\n<p>A ny\u00edl\u00e1s \u00e9s az ostya sz\u00e9le k\u00f6z\u00f6tti el\u00e9gtelen t\u00e1vols\u00e1g n\u00f6veli a t\u00f6r\u00e9s kock\u00e1zat\u00e1t.<\/p>\n\n\n\n<p>A m\u00e9rn\u00f6k\u00f6knek minden ny\u00edl\u00e1s k\u00f6r\u00fcl elegend\u0151 anyagot kell hagyniuk, hogy a feldolgoz\u00e1s sor\u00e1n a szerkezeti szil\u00e1rds\u00e1g megmaradjon.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">A fel\u00fclet \u00e9s az oldalfal min\u0151s\u00e9ge<\/h2>\n\n\n\n<p>A furatok min\u0151s\u00e9g\u00e9t t\u00f6bb jellemz\u0151 alapj\u00e1n \u00e9rt\u00e9kelik.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">K\u00f6rk\u00f6r\u00f6ss\u00e9g<\/h3>\n\n\n\n<p>A k\u00e9sz ny\u00edl\u00e1snak k\u00f6zel kell maradnia a tervezett k\u00f6r alak\u00fa geometri\u00e1hoz.<\/p>\n\n\n\n<p>A rossz k\u00f6rk\u00f6r\u00f6ss\u00e9g megnehez\u00edtheti a f\u00e9mbevonat felvitel\u00e9t \u00e9s az alkatr\u00e9szek \u00f6sszeszerel\u00e9s\u00e9t.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Hengerszer\u0171s\u00e9g<\/h3>\n\n\n\n<p>Az \u00e1tmen\u0151 furatok eset\u00e9ben a falaknak a lehet\u0151 legegyenesebbnek kell maradniuk.<\/p>\n\n\n\n<p>A t\u00falzott k\u00fapos kialak\u00edt\u00e1s h\u00e1tr\u00e1ltathatja a TGV-bevonat kialak\u00edt\u00e1s\u00e1t \u00e9s az elektromos teljes\u00edtm\u00e9nyt.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Az oldalfal \u00e9rdess\u00e9ge<\/h3>\n\n\n\n<p>A sima oldalfalak jav\u00edtj\u00e1k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>F\u00e9mlerak\u00f3d\u00e1s<\/li>\n\n\n\n<li>Tapad\u00e1s<\/li>\n\n\n\n<li>Elektromos megb\u00edzhat\u00f3s\u00e1g<\/li>\n\n\n\n<li>Folyad\u00e9k\u00e1raml\u00e1s<\/li>\n\n\n\n<li>Optikai teljes\u00edtm\u00e9ny<\/li>\n<\/ul>\n\n\n\n<p>Ig\u00e9nyes alkalmaz\u00e1sok eset\u00e9n tov\u00e1bbi pol\u00edroz\u00e1sra lehet sz\u00fcks\u00e9g.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">\u00c9lek lepattogz\u00e1sa<\/h3>\n\n\n\n<p>A ny\u00edl\u00e1s bej\u00e1rat\u00e1nak vagy kij\u00e1rat\u00e1nak k\u00f6rny\u00e9k\u00e9n tal\u00e1lhat\u00f3 apr\u00f3 reped\u00e9sek reped\u00e9skezd\u0151 pontokk\u00e1 v\u00e1lhatnak.<\/p>\n\n\n\n<p>A sz\u00e9lek min\u0151s\u00e9g\u00e9t ez\u00e9rt a tov\u00e1bbi feldolgoz\u00e1s el\u0151tt gondosan ellen\u0151rzik.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Tiszt\u00edt\u00e1s a magf\u00far\u00e1s ut\u00e1n<\/h2>\n\n\n\n<p>A megmunk\u00e1l\u00e1s sor\u00e1n r\u00e9szecsk\u00e9k, csiszol\u00f3anyag-maradv\u00e1nyok \u00e9s mikroszkopikus \u00fcvegdarabk\u00e1k keletkeznek.<\/p>\n\n\n\n<p>A takar\u00edt\u00e1s \u00e1ltal\u00e1ban a k\u00f6vetkez\u0151ket tartalmazza:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ionmentes v\u00edzzel t\u00f6rt\u00e9n\u0151 \u00f6bl\u00edt\u00e9s<\/li>\n\n\n\n<li>Ultrahangos tiszt\u00edt\u00e1s<\/li>\n\n\n\n<li>K\u00e9miai tiszt\u00edt\u00e1s<\/li>\n\n\n\n<li>R\u00e9szecsk\u00e9k elt\u00e1vol\u00edt\u00e1sa<\/li>\n\n\n\n<li>Sz\u00e1r\u00edt\u00e1s<\/li>\n\n\n\n<li>Fel\u00fcleti ellen\u0151rz\u00e9s<\/li>\n<\/ul>\n\n\n\n<p>A tisztas\u00e1g k\u00fcl\u00f6n\u00f6sen fontos a f\u00e9mbevonat felvitele vagy a szil\u00edciumlapok \u00f6sszeragaszt\u00e1sa el\u0151tt.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Ellen\u0151rz\u00e9si m\u00f3dszerek<\/h2>\n\n\n\n<p>Az \u00fcveglapok ny\u00edl\u00e1sait \u00e1ltal\u00e1ban t\u00f6bbf\u00e9le m\u00e9r\u00e9si technik\u00e1val vizsg\u00e1lj\u00e1k.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Optikai mikroszk\u00f3pia<\/h3>\n\n\n\n<p>Alkalmaz\u00e1si ter\u00fclete:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Edge chipek<\/li>\n\n\n\n<li>Fel\u00fcleti hib\u00e1k<\/li>\n\n\n\n<li>Reped\u00e9sfelismer\u00e9s<\/li>\n\n\n\n<li>A furat geometri\u00e1ja<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Koordin\u00e1ta-m\u00e9r\u0151rendszerek<\/h3>\n\n\n\n<p>M\u00e9rt\u00e9k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A furat \u00e1tm\u00e9r\u0151je<\/li>\n\n\n\n<li>Poz\u00edci\u00f3pontoss\u00e1g<\/li>\n\n\n\n<li>Furatok k\u00f6z\u00f6tti t\u00e1vols\u00e1g<\/li>\n\n\n\n<li>K\u00f6rk\u00f6r\u00f6ss\u00e9g<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3D optikai profilometria<\/h3>\n\n\n\n<p>A k\u00f6vetkez\u0151kr\u0151l ny\u00fajt t\u00e1j\u00e9koztat\u00e1st:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Fel\u00fcleti \u00e9rdess\u00e9g<\/li>\n\n\n\n<li>L\u00e9pcs\u0151magass\u00e1g<\/li>\n\n\n\n<li>\u00c9lprofil<\/li>\n\n\n\n<li>Oldalfal-geometria<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Automatiz\u00e1lt vizu\u00e1lis ellen\u0151rz\u00e9s<\/h3>\n\n\n\n<p>A gy\u00e1rt\u00e1si k\u00f6rnyezetekben gyakran alkalmaznak automatiz\u00e1lt ellen\u0151rz\u0151 rendszereket a nagy volumen\u0171 min\u0151s\u00e9g-ellen\u0151rz\u00e9shez.<\/p>\n\n\n\n<p>Ezek a rendszerek jav\u00edtj\u00e1k az egys\u00e9gess\u00e9get, mik\u00f6zben ler\u00f6vid\u00edtik az ellen\u0151rz\u00e9si id\u0151t.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">A gy\u00e1rt\u00e1s sor\u00e1n gyakran el\u0151fordul\u00f3 kih\u00edv\u00e1sok<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Mikroreped\u00e9sek<\/h3>\n\n\n\n<p>A mikroreped\u00e9sek az els\u0151 vizsg\u00e1lat sor\u00e1n nem felt\u00e9tlen\u00fcl l\u00e1that\u00f3k, de a h\u0151ciklusok sor\u00e1n vagy a szil\u00edciumlapka kezel\u00e9se k\u00f6zben tov\u00e1bbterjedhetnek.<\/p>\n\n\n\n<p>Az optimaliz\u00e1lt megmunk\u00e1l\u00e1si param\u00e9terek hozz\u00e1j\u00e1rulnak ezek kialakul\u00e1s\u00e1nak minimaliz\u00e1l\u00e1s\u00e1hoz.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">R\u00e9szecsk\u00e9k gener\u00e1l\u00e1sa<\/h3>\n\n\n\n<p>Az \u00fcvegr\u00e9szecsk\u00e9k szennyezhetik a k\u00e9s\u0151bbi f\u00e9lvezet\u0151-gy\u00e1rt\u00e1si folyamatokat.<\/p>\n\n\n\n<p>A megfelel\u0151 h\u0171t\u0151folyad\u00e9k-\u00e1raml\u00e1s, a tiszt\u00edt\u00e1si elj\u00e1r\u00e1sok \u00e9s a berendez\u00e9sek karbantart\u00e1sa cs\u00f6kkentik a szennyez\u0151d\u00e9st.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Furatk\u00fapos<\/h3>\n\n\n\n<p>A szersz\u00e1m kop\u00e1sa vagy a nem megfelel\u0151 folyamatbe\u00e1ll\u00edt\u00e1sok k\u00fapos ny\u00edl\u00e1sokat eredm\u00e9nyezhetnek.<\/p>\n\n\n\n<p>A TGV-alkalmaz\u00e1sok eset\u00e9ben az oldalfal geometri\u00e1ja k\u00fcl\u00f6n\u00f6sen fontos, mivel befoly\u00e1solja a k\u00e9s\u0151bbi f\u00e9mbevonat-felvitelt.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Marad\u00e9k fesz\u00fclts\u00e9g<\/h3>\n\n\n\n<p>A mechanikai vagy h\u0151kezel\u00e9s bels\u0151 fesz\u00fclts\u00e9get okozhat.<\/p>\n\n\n\n<p>A stressz a csomagol\u00e1s vagy a megb\u00edzhat\u00f3s\u00e1gi vizsg\u00e1lat sor\u00e1n k\u00e9sleltetett reped\u00e9shez vezethet.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Az \u00fcveglapok magf\u00far\u00e1s\u00e1nak alkalmaz\u00e1sai<\/h2>\n\n\n\n<p>A prec\u00edzi\u00f3s \u00fcvegny\u00edl\u00e1sokat sz\u00e9les k\u00f6rben alkalmazz\u00e1k a modern f\u00e9lvezet\u0151gy\u00e1rt\u00e1sban.<\/p>\n\n\n\n<p>A tipikus alkalmaz\u00e1sok k\u00f6z\u00e9 tartoznak:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">\u00dcveg\u00e1tt\u00f6r\u0151 \u00e1tvezet\u0151 (TGV)<\/h3>\n\n\n\n<p>Az \u00fcvegmagf\u00far\u00e1s sor\u00e1n keletkeznek azok a kezdeti ny\u00edl\u00e1sok, amelyeket k\u00e9s\u0151bb f\u00e9mbevonattal l\u00e1tnak el az elektromos \u00f6sszek\u00f6ttet\u00e9sek kialak\u00edt\u00e1sa \u00e9rdek\u00e9ben.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">MEMS-eszk\u00f6z\u00f6k<\/h3>\n\n\n\n<p>Sz\u00e1mos MEMS-\u00e9rz\u00e9kel\u0151h\u00f6z pontosan elhelyezett \u00fcregekre \u00e9s folyad\u00e9kcsatorn\u00e1kra van sz\u00fcks\u00e9g.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Optikai csomagol\u00e1s<\/h3>\n\n\n\n<p>Az \u00fcvegny\u00edl\u00e1sok lehet\u0151v\u00e9 teszik az optikai sz\u00e1lak, lencs\u00e9k \u00e9s fotonikus alkatr\u00e9szek kompakt h\u00e1zakba t\u00f6rt\u00e9n\u0151 be\u00e9p\u00edt\u00e9s\u00e9t.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Biomedicin\u00e1lis chipek<\/h3>\n\n\n\n<p>A mikrofluidikus eszk\u00f6z\u00f6k gyakran prec\u00edzen megmunk\u00e1lt \u00fcvegcsatorn\u00e1kra \u00e9s tart\u00e1lyokra t\u00e1maszkodnak.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">RF-csomagol\u00e1s<\/h3>\n\n\n\n<p>Az \u00fcveg hordoz\u00f3k kiv\u00e1l\u00f3 jelintegrit\u00e1ssal t\u00e1mogatj\u00e1k a nagyfrekvenci\u00e1s kommunik\u00e1ci\u00f3s eszk\u00f6z\u00f6ket.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Oszlop szint\u0171 csomagol\u00e1s<\/h3>\n\n\n\n<p>A prec\u00edzi\u00f3s ny\u00edl\u00e1sok lehet\u0151v\u00e9 teszik t\u00f6bb funkcion\u00e1lis r\u00e9teg kompakt integr\u00e1l\u00e1s\u00e1t a fejlett f\u00e9lvezet\u0151-csomagol\u00e1sokon bel\u00fcl.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Az egyedi gy\u00e1rt\u00e1shoz sz\u00fcks\u00e9ges inform\u00e1ci\u00f3k<\/h2>\n\n\n\n<p>Az \u00fcveglapok magf\u00far\u00e1s\u00e1ra vonatkoz\u00f3 \u00e1raj\u00e1nlatk\u00e9r\u00e9skor a megrendel\u0151knek a k\u00f6vetkez\u0151ket kell megadniuk:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\u00dcveganyag<\/li>\n\n\n\n<li>A szelet \u00e1tm\u00e9r\u0151je<\/li>\n\n\n\n<li>Az ostya vastags\u00e1ga<\/li>\n\n\n\n<li>A furat \u00e1tm\u00e9r\u0151je<\/li>\n\n\n\n<li>A furat m\u00e9lys\u00e9ge<\/li>\n\n\n\n<li>A meghirdetett \u00e1ll\u00e1shelyek sz\u00e1ma<\/li>\n\n\n\n<li>Poz\u00edci\u00f3t\u0171r\u00e9s<\/li>\n\n\n\n<li>Fel\u00fcleti min\u0151s\u00e9g<\/li>\n\n\n\n<li>Az oldalfalakra vonatkoz\u00f3 k\u00f6vetelm\u00e9nyek<\/li>\n\n\n\n<li>\u00c9lek min\u0151s\u00e9ge<\/li>\n\n\n\n<li>Rajzf\u00e1jl<\/li>\n\n\n\n<li>Gy\u00e1rt\u00e1si mennyis\u00e9g<\/li>\n\n\n\n<li>Ellen\u0151rz\u00e9si k\u00f6vetelm\u00e9nyek<\/li>\n<\/ul>\n\n\n\n<p>A r\u00e9szletes rajzok seg\u00edts\u00e9g\u00e9vel a gy\u00e1rt\u00f3k javaslatot tehetnek a legmegfelel\u0151bb elj\u00e1r\u00e1sra.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Gyakran ism\u00e9telt k\u00e9rd\u00e9sek<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Mi a k\u00fcl\u00f6nbs\u00e9g az \u00fcveglapok magf\u00far\u00e1sa \u00e9s a f\u00far\u00e1sa k\u00f6z\u00f6tt?<\/h3>\n\n\n\n<p>A magf\u00far\u00e1s \u00e1ltal\u00e1ban olyan prec\u00edzi\u00f3s ny\u00edl\u00e1sok kialak\u00edt\u00e1s\u00e1t jelenti, amelyek geometri\u00e1ja szab\u00e1lyozott, \u00e9s a k\u00e1rosod\u00e1s minim\u00e1lis, m\u00edg a f\u00far\u00e1s egy t\u00e1gabb \u00e9rtelemben vett megmunk\u00e1l\u00e1si fogalom. A f\u00e9lvezet\u0151ipari alkalmaz\u00e1sok gyakran sokkal szigor\u00fabb t\u0171r\u00e9shat\u00e1rokat ig\u00e9nyelnek, mint a hagyom\u00e1nyos f\u00far\u00e1s.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">A l\u00e9zeres magkiv\u00e1g\u00e1s kik\u00fcsz\u00f6b\u00f6lheti-e az \u00e9lek lepattogz\u00e1s\u00e1t?<\/h3>\n\n\n\n<p>A l\u00e9zeres megmunk\u00e1l\u00e1s jelent\u0151sen cs\u00f6kkentheti a mechanikai k\u00e1rosod\u00e1sokat, de a nem megfelel\u0151 folyamatparam\u00e9terek m\u00e9g \u00edgy is h\u0151hat\u00e1s\u00fa hib\u00e1kat vagy mikroreped\u00e9seket okozhatnak.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Melyik elj\u00e1r\u00e1s a legalkalmasabb a TGV gy\u00e1rt\u00e1s\u00e1hoz?<\/h3>\n\n\n\n<p>Az optim\u00e1lis m\u00f3dszer a furat m\u00e9ret\u00e9t\u0151l, a szil\u00edciumlapka vastags\u00e1g\u00e1t\u00f3l, az oldalar\u00e1nyt\u00f3l, a gy\u00e1rt\u00e1si mennyis\u00e9gt\u0151l \u00e9s a f\u00e9mbevonat-k\u00f6vetelm\u00e9nyekt\u0151l f\u00fcgg. Sz\u00e1mos gy\u00e1rt\u00f3 a l\u00e9zeres megmunk\u00e1l\u00e1st kieg\u00e9sz\u00edt\u0151 ut\u00f3munk\u00e1latokkal kombin\u00e1lja.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Lehet-e nagyon apr\u00f3 lyukakat k\u00e9sz\u00edteni \u00fcveglapk\u00e1kba?<\/h3>\n\n\n\n<p>Igen. Az ultranagy sebess\u00e9g\u0171 l\u00e9zerrendszerek \u00e9s a speci\u00e1lis mikromegmunk\u00e1l\u00e1si technol\u00f3gi\u00e1k k\u00e9pesek rendk\u00edv\u00fcl apr\u00f3 ny\u00edl\u00e1sok kialak\u00edt\u00e1s\u00e1ra, nagy pozicion\u00e1l\u00e1si pontoss\u00e1ggal.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Hogyan ellen\u0151rzik a furatok min\u0151s\u00e9g\u00e9t?<\/h3>\n\n\n\n<p>A gy\u00e1rt\u00f3k \u00e1ltal\u00e1ban optikai \u00e9s automatiz\u00e1lt m\u00e9r\u0151berendez\u00e9sek seg\u00edts\u00e9g\u00e9vel \u00e9rt\u00e9kelik az \u00e1tm\u00e9r\u0151t, a helyzetet, a k\u00fapos kialak\u00edt\u00e1st, az oldalfal min\u0151s\u00e9g\u00e9t, a fel\u00fcleti hib\u00e1kat, az \u00e9lek lepattogz\u00e1s\u00e1t \u00e9s a r\u00e9szecskeszennyez\u0151d\u00e9st.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Befoly\u00e1solja-e az \u00fcveg t\u00edpusa a magkiv\u00e9teli folyamatot?<\/h3>\n\n\n\n<p>Igen. A boroszilik\u00e1t\u00fcveg, az olvasztott szil\u00edcium-dioxid, a kvarc\u00fcveg \u00e9s a speci\u00e1lis csomagol\u00f3\u00fcveg mindegyike elt\u00e9r\u0151 h\u0151- \u00e9s mechanikai tulajdons\u00e1gokkal rendelkezik, ez\u00e9rt k\u00fcl\u00f6nb\u00f6z\u0151 megmunk\u00e1l\u00e1si param\u00e9tereket ig\u00e9nyelnek.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">K\u00f6vetkeztet\u00e9s<\/h2>\n\n\n\n<p>Az \u00fcveglapok magf\u00far\u00e1sa egy kulcsfontoss\u00e1g\u00fa gy\u00e1rt\u00e1si folyamat, amely t\u00e1mogatja a fejlett f\u00e9lvezet\u0151-csomagol\u00e1s, a MEMS-eszk\u00f6z\u00f6k, a fotonika \u00e9s az \u00fcveg\u00e1tt\u00f6r\u0151 \u00e1tvezet\u00e9si technol\u00f3gia gyors fejl\u0151d\u00e9s\u00e9t.<\/p>\n\n\n\n<p>A kiv\u00e1l\u00f3 min\u0151s\u00e9g\u0171 ny\u00edl\u00e1sok el\u0151\u00e1ll\u00edt\u00e1s\u00e1hoz sokkal t\u00f6bbre van sz\u00fcks\u00e9g, mint puszt\u00e1n egy lyuk kialak\u00edt\u00e1s\u00e1ra. A folyamat kiv\u00e1laszt\u00e1sa, a megmunk\u00e1l\u00e1si param\u00e9terek, a falak min\u0151s\u00e9ge, a tisztas\u00e1g \u00e9s az ellen\u0151rz\u00e9s mind hozz\u00e1j\u00e1rulnak a k\u00e9sz\u00fcl\u00e9k v\u00e9gs\u0151 megb\u00edzhat\u00f3s\u00e1g\u00e1hoz.<\/p>\n\n\n\n<p>Mivel a f\u00e9lvezet\u0151-csomagol\u00e1s ter\u00e9n folyamatosan haladunk a kisebb r\u00e1cst\u00e1vols\u00e1gok \u00e9s a nagyobb \u00fcvegszubsztr\u00e1tok ir\u00e1ny\u00e1ba, a prec\u00edzi\u00f3s \u00fcveglap-kiv\u00e1g\u00e1s tov\u00e1bbra is elengedhetetlen alaptechnol\u00f3gi\u00e1nak sz\u00e1m\u00edt majd a j\u00f6v\u0151beli elektronikus rendszerek sz\u00e1m\u00e1ra.<\/p>","protected":false},"excerpt":{"rendered":"<p>As glass substrates become increasingly important in advanced semiconductor packaging, precision openings manufactured in glass wafers are playing a critical role in enabling next-generation electronic devices. These openings provide pathways for electrical interconnections, fluid channels, optical transmission, alignment structures and specialized packaging features. Unlike conventional silicon machining, creating holes in glass wafers presents unique challenges [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2597,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[1409,1574,1644,1646,1645,1581,214,1643,1408],"class_list":["post-2596","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-glass-interposer","tag-glass-wafer-coring","tag-glass-wafer-drilling","tag-laser-glass-coring","tag-mems-glass-wafer","tag-precision-glass-machining","tag-semiconductor-packaging","tag-tgv-technology","tag-through-glass-via"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2596","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/comments?post=2596"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2596\/revisions"}],"predecessor-version":[{"id":2598,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2596\/revisions\/2598"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media\/2597"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media?parent=2596"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/categories?post=2596"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/tags?post=2596"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}