{"id":2491,"date":"2026-05-25T05:27:55","date_gmt":"2026-05-25T05:27:55","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2491"},"modified":"2026-05-25T05:36:36","modified_gmt":"2026-05-25T05:36:36","slug":"anodic-bonding-vs-direct-bonding","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/hu\/anodic-bonding-vs-direct-bonding\/","title":{"rendered":"An\u00f3dos k\u00f6t\u00e9s vagy k\u00f6zvetlen k\u00f6t\u00e9s: melyik a megfelel\u0151bb a MEMS- \u00e9s \u00e9rz\u00e9kel\u0151-szil\u00edciumlapok feldolgoz\u00e1s\u00e1hoz?"},"content":{"rendered":"

A fejlett MEMS-gy\u00e1rt\u00e1s \u00e9s az \u00e9rz\u00e9kel\u0151k csomagol\u00e1sa ter\u00e9n, lapk\u00e1k \u00f6sszekapcsol\u00e1sa<\/mark><\/a> ez egy kritikus l\u00e9p\u00e9s, amely k\u00f6zvetlen\u00fcl befoly\u00e1solja az eszk\u00f6z megb\u00edzhat\u00f3s\u00e1g\u00e1t, a l\u00e9gmentes lez\u00e1r\u00e1st \u00e9s a hossz\u00fa t\u00e1v\u00fa teljes\u00edtm\u00e9nyt. A legsz\u00e9lesebb k\u00f6rben alkalmazott technik\u00e1k k\u00f6z\u00e9 tartoznak an\u00f3dos k\u00f6t\u00e9s<\/strong> \u00e9s k\u00f6zvetlen (f\u00fazi\u00f3s) hegeszt\u00e9s<\/strong>.<\/p>\n\n\n\n

B\u00e1r mindk\u00e9t m\u00f3dszer atom- vagy molekulaszinten egyes\u00edti az osty\u00e1kat, teljesen elt\u00e9r\u0151 fizikai mechanizmusokon alapulnak, \u00e9s k\u00fcl\u00f6nb\u00f6z\u0151 anyagokhoz \u00e9s eszk\u00f6zszerkezetekhez alkalmasak.<\/p>\n\n\n\n

Ez a cikk egy \u00e1ttekinthet\u0151, B2B-szektorra f\u00f3kusz\u00e1l\u00f3 \u00f6sszehasonl\u00edt\u00e1st ny\u00fajt, amely seg\u00edt a m\u00e9rn\u00f6k\u00f6knek \u00e9s a beszerz\u00e9si csapatoknak a MEMS-ek, \u00e9rz\u00e9kel\u0151k \u00e9s fejlett f\u00e9lvezet\u0151 eszk\u00f6z\u00f6k sz\u00e1m\u00e1ra legmegfelel\u0151bb ragaszt\u00e1si m\u00f3dszer kiv\u00e1laszt\u00e1s\u00e1ban.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Mi az an\u00f3dos k\u00f6t\u00e9s?<\/h2>\n\n\n\n

An\u00f3dos k\u00f6t\u00e9s<\/strong> (m\u00e1s n\u00e9ven elektrosztatikus k\u00f6t\u00e9s) egy olyan szil\u00edciumlapka-\u00f6sszek\u00f6t\u00e9si technika, amelyet \u00e1ltal\u00e1ban szil\u00edcium \u00e9s \u00fcveg (\u00e1ltal\u00e1ban boroszilik\u00e1t\u00fcveg)<\/strong>.<\/p>\n\n\n\n

Hogyan m\u0171k\u00f6dik:<\/h3>\n\n\n\n
    \n
  • A szeletekre nagyfesz\u00fclts\u00e9get (\u00e1ltal\u00e1ban 200\u20131000 V) kapcsolnak<\/li>\n\n\n\n
  • A h\u0151m\u00e9rs\u00e9kletet megemelik (\u00e1ltal\u00e1ban 300\u2013450 \u00b0C-ra)<\/li>\n\n\n\n
  • A mozg\u00e9kony ionok (az \u00fcvegben f\u0151k\u00e9nt Na\u207a) az elektromos mez\u0151 hat\u00e1s\u00e1ra v\u00e1ndorolnak<\/li>\n\n\n\n
  • Az er\u0151s elektrosztatikus vonz\u00e1s tart\u00f3s k\u00f6t\u00e9st hoz l\u00e9tre a hat\u00e1rfel\u00fcleten<\/li>\n<\/ul>\n\n\n\n

    F\u0151bb jellemz\u0151k:<\/h3>\n\n\n\n
      \n
    • Ehhez vezet\u0151k\u00e9pes \u00e9s ionos anyagp\u00e1rra van sz\u00fcks\u00e9g (szil\u00edcium + \u00fcveg)<\/li>\n\n\n\n
    • K\u00f6zepes h\u0151m\u00e9rs\u00e9klet\u0171 elj\u00e1r\u00e1s<\/li>\n\n\n\n
    • Gyors k\u00f6t\u00e9si id\u0151<\/li>\n\n\n\n
    • Kiv\u00e1l\u00f3 l\u00e9gz\u00e1r\u00f3 k\u00e9pess\u00e9g<\/li>\n<\/ul>\n\n\n\n

      2. Mi az a k\u00f6zvetlen ragaszt\u00e1s (f\u00fazi\u00f3s ragaszt\u00e1s)?<\/h2>\n\n\n\n

      K\u00f6zvetlen ragaszt\u00e1s<\/strong>, m\u00e1s n\u00e9ven f\u00fazi\u00f3s hegeszt\u00e9s<\/strong>, k\u00e9t rendk\u00edv\u00fcl s\u00edk \u00e9s rendk\u00edv\u00fcl tiszta fel\u00fcletet k\u00f6t \u00f6ssze ragaszt\u00f3anyagok \u00e9s elektromos mez\u0151k alkalmaz\u00e1sa n\u00e9lk\u00fcl.<\/p>\n\n\n\n

      Hogyan m\u0171k\u00f6dik:<\/h3>\n\n\n\n
        \n
      • K\u00e9t szil\u00edciumlapk\u00e1t megtiszt\u00edtanak \u00e9s aktiv\u00e1lnak (plazma- vagy k\u00e9miai kezel\u00e9ssel)<\/li>\n\n\n\n
      • Az osty\u00e1kat szobah\u0151m\u00e9rs\u00e9kleten \u00e9rintkez\u00e9sbe hozz\u00e1k egym\u00e1ssal<\/li>\n\n\n\n
      • A kezdeti gyenge van der Waals-er\u0151k el\u0151k\u00f6t\u00e9st hoznak l\u00e9tre<\/li>\n\n\n\n
      • A magas h\u0151m\u00e9rs\u00e9klet\u0171 h\u0151kezel\u00e9s (800\u20131100 \u00b0C) az atomok diff\u00fazi\u00f3ja r\u00e9v\u00e9n er\u0151s\u00edti a k\u00f6t\u00e9st<\/li>\n<\/ul>\n\n\n\n

        F\u0151bb jellemz\u0151k:<\/h3>\n\n\n\n
          \n
        • K\u00f6zbens\u0151 r\u00e9teg nem sz\u00fcks\u00e9ges<\/li>\n\n\n\n
        • Rendk\u00edv\u00fcl nagy tapad\u00e1si szil\u00e1rds\u00e1g h\u0151kezel\u00e9s ut\u00e1n<\/li>\n\n\n\n
        • Rendk\u00edv\u00fcl sima \u00e9s s\u00edk fel\u00fcleteket ig\u00e9nyel<\/li>\n\n\n\n
        • Magas h\u0151terhel\u00e9s\u0171 folyamat<\/li>\n<\/ul>\n\n\n\n

          3. An\u00f3dos k\u00f6t\u00e9s \u00e9s k\u00f6zvetlen k\u00f6t\u00e9s: a legfontosabb k\u00fcl\u00f6nbs\u00e9gek<\/h2>\n\n\n\n
          Jellemz\u0151<\/th>An\u00f3dos k\u00f6t\u00e9s<\/th>K\u00f6zvetlen (f\u00fazi\u00f3s) k\u00f6t\u00e9s<\/th><\/tr><\/thead>
          A k\u00f6tv\u00e9nyek m\u0171k\u00f6d\u00e9si mechanizmusa<\/td>Elektrosztatikus + ionv\u00e1ndorl\u00e1s<\/td>Atomdiff\u00fazi\u00f3<\/td><\/tr>
          Anyagok<\/td>Si + \u00fcveg<\/td>Si + Si \u2192 SiO\u2082 + SiO\u2082<\/td><\/tr>
          H\u0151m\u00e9rs\u00e9klet<\/td>300\u2013450 \u00b0C<\/td>800\u20131100 \u00b0C<\/td><\/tr>
          Sz\u00fcks\u00e9ges fesz\u00fclts\u00e9g<\/td>Igen<\/td>Nem<\/td><\/tr>
          Fel\u00fcleti k\u00f6vetelm\u00e9nyek<\/td>M\u00e9rs\u00e9kelt<\/td>Rendk\u00edv\u00fcl magas (ultra-lapos)<\/td><\/tr>
          Interf\u00e9szr\u00e9teg<\/td>\u00dcvegfel\u00fclet<\/td>Nincs k\u00f6zbens\u0151 r\u00e9teg<\/td><\/tr>
          K\u00f6t\u00e9sszil\u00e1rds\u00e1g<\/td>Magas<\/td>Rendk\u00edv\u00fcl magas (hev\u00edz\u00e9s ut\u00e1n)<\/td><\/tr>
          A folyamat \u00f6sszetetts\u00e9ge<\/td>Als\u00f3<\/td>Magasabb<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

          4. Folyamatkompatibilit\u00e1s \u00e9s anyagbeli korl\u00e1tok<\/h2>\n\n\n\n

          An\u00f3dos k\u00f6t\u00e9s:<\/h3>\n\n\n\n

          Legink\u00e1bb alkalmas:<\/p>\n\n\n\n

            \n
          • Szil\u00edcium-\u00fcveg szerkezetek<\/li>\n\n\n\n
          • Optikai hozz\u00e1f\u00e9r\u00e9ssel rendelkez\u0151 MEMS-\u00fcreg<\/li>\n\n\n\n
          • \u00dcvegburkolat\u00fa nyom\u00e1s\u00e9rz\u00e9kel\u0151k<\/li>\n\n\n\n
          • Mikrofluidikus eszk\u00f6z\u00f6k<\/li>\n<\/ul>\n\n\n\n

            Gyakran haszn\u00e1lt \u00fcveganyagok:<\/p>\n\n\n\n

              \n
            • Boroszilik\u00e1t\u00fcveg (Pyrex-t\u00edpus\u00fa)<\/li>\n\n\n\n
            • Alum\u00ednium-szilik\u00e1t \u00fcveg<\/li>\n<\/ul>\n\n\n\n

              K\u00f6zvetlen ragaszt\u00e1s:<\/h3>\n\n\n\n

              Legink\u00e1bb alkalmas:<\/p>\n\n\n\n

                \n
              • Szil\u00edcium-szil\u00edcium szerkezetek<\/li>\n\n\n\n
              • SOI-szelet gy\u00e1rt\u00e1sa<\/li>\n\n\n\n
              • Nagy teljes\u00edtm\u00e9ny\u0171 MEMS-eszk\u00f6z\u00f6k<\/li>\n\n\n\n
              • Optikai min\u0151s\u00e9g\u0171 szil\u00edciumlap-r\u00e9tegek<\/li>\n\n\n\n
              • Fejlett 3D-integr\u00e1ci\u00f3<\/li>\n<\/ul>\n\n\n\n

                5. Alkalmaz\u00e1sok a MEMS \u00e9s az \u00e9rz\u00e9kel\u0151k ter\u00fclet\u00e9n<\/h2>\n\n\n\n

                Az an\u00f3dos k\u00f6t\u00e9s MEMS-alkalmaz\u00e1sai<\/h3>\n\n\n\n

                A Mikroelektromechanikus rendszerek<\/strong>, az an\u00f3dos k\u00f6t\u00e9st sz\u00e9les k\u00f6rben alkalmazz\u00e1k a k\u00f6vetkez\u0151kre:<\/p>\n\n\n\n

                  \n
                • Nyom\u00e1s\u00e9rz\u00e9kel\u0151k<\/li>\n\n\n\n
                • Gyorsul\u00e1sm\u00e9r\u0151k (fedett szerkezetek)<\/li>\n\n\n\n
                • Tintasugaras nyomtat\u00f3fejek<\/li>\n\n\n\n
                • Mikrofluidikus chipek<\/li>\n\n\n\n
                • Optikai MEMS-ek \u00fcvegablakokkal<\/li>\n<\/ul>\n\n\n\n

                  Mi\u00e9rt el\u0151ny\u00f6s:<\/strong><\/p>\n\n\n\n

                    \n
                  • Kiv\u00e1l\u00f3 l\u00e9gmentes lez\u00e1r\u00e1s<\/li>\n\n\n\n
                  • Az \u00e1tl\u00e1tsz\u00f3 \u00fcveg lehet\u0151v\u00e9 teszi a bel\u00e1t\u00e1st<\/li>\n\n\n\n
                  • K\u00f6lts\u00e9ghat\u00e9kony t\u00f6meggy\u00e1rt\u00e1shoz<\/li>\n<\/ul>\n\n\n\n

                    A k\u00f6zvetlen k\u00f6t\u00e9s MEMS-alkalmaz\u00e1sai<\/h3>\n\n\n\n

                    A nagy teljes\u00edtm\u00e9ny\u0171 MEMS-ek \u00e9s a f\u00e9lvezet\u0151-integr\u00e1ci\u00f3 ter\u00fclet\u00e9n a k\u00f6zvetlen k\u00f6t\u00e9s a prefer\u00e1lt megold\u00e1s:<\/p>\n\n\n\n

                      \n
                    • SOI-alap\u00fa MEMS-eszk\u00f6z\u00f6k<\/li>\n\n\n\n
                    • RF MEMS kapcsol\u00f3k<\/li>\n\n\n\n
                    • Nagyfrekvenci\u00e1s rezon\u00e1torok<\/li>\n\n\n\n
                    • 3D-integr\u00e1ci\u00f3 chip szintj\u00e9n<\/li>\n\n\n\n
                    • Prec\u00edzi\u00f3s tehetetlens\u00e9gi \u00e9rz\u00e9kel\u0151k<\/li>\n<\/ul>\n\n\n\n

                      Mi\u00e9rt el\u0151ny\u00f6s:<\/strong><\/p>\n\n\n\n

                        \n
                      • Nincs fel\u00fcleti szennyez\u0151d\u00e9sr\u00e9teg<\/li>\n\n\n\n
                      • Rendk\u00edv\u00fcl nagy mechanikai stabilit\u00e1s<\/li>\n\n\n\n
                      • Kiv\u00e1l\u00f3 h\u0151- \u00e9s elektromos teljes\u00edtm\u00e9ny<\/li>\n<\/ul>\n\n\n\n

                        6. Megb\u00edzhat\u00f3s\u00e1gi \u00e9s teljes\u00edtm\u00e9nybeli szempontok<\/h2>\n\n\n\n

                        Az an\u00f3dos k\u00f6t\u00e9s szil\u00e1rds\u00e1ga:<\/h3>\n\n\n\n
                          \n
                        • Hossz\u00fa t\u00e1von stabil, l\u00e9gmentes lez\u00e1r\u00e1s<\/li>\n\n\n\n
                        • J\u00f3 ellen\u00e1ll\u00f3k\u00e9pess\u00e9g m\u00e9rs\u00e9kelt ig\u00e9nybev\u00e9tel\u0171 k\u00f6rnyezetekben<\/li>\n\n\n\n
                        • Kiforrott ipari folyamat<\/li>\n<\/ul>\n\n\n\n

                          Korl\u00e1toz\u00e1sok:<\/h3>\n\n\n\n
                            \n
                          • Az \u00fcveg \u00e9s a szil\u00edcium k\u00f6z\u00f6tti h\u0151m\u00e9rs\u00e9kleti elt\u00e9r\u00e9s<\/li>\n\n\n\n
                          • A fesz\u00fclts\u00e9gig\u00e9ny megn\u00f6veli a folyamat bonyolults\u00e1g\u00e1t<\/li>\n\n\n\n
                          • Csak bizonyos anyagkombin\u00e1ci\u00f3kra vonatkozik<\/li>\n<\/ul>\n\n\n\n

                            A k\u00f6zvetlen ragaszt\u00e1s el\u0151nyei:<\/h3>\n\n\n\n
                              \n
                            • A legnagyobb k\u00f6t\u00e9si szil\u00e1rds\u00e1g az ostya\u00f6sszek\u00f6t\u00e9si m\u00f3dszerek k\u00f6z\u00fcl<\/li>\n\n\n\n
                            • Kiv\u00e1l\u00f3 h\u0151vezet\u0151 k\u00e9pess\u00e9g a fel\u00fcletek k\u00f6z\u00f6tt<\/li>\n\n\n\n
                            • Nincs a k\u00f6zbens\u0151 anyagok min\u0151s\u00e9groml\u00e1sa<\/li>\n<\/ul>\n\n\n\n

                              Korl\u00e1toz\u00e1sok:<\/h3>\n\n\n\n
                                \n
                              • Rendk\u00edv\u00fcl \u00e9rz\u00e9keny a fel\u00fcleti egyenetlens\u00e9gekre<\/li>\n\n\n\n
                              • A magas h\u0151m\u00e9rs\u00e9klet\u0171 h\u0151kezel\u00e9s hat\u00e1ssal lehet az eszk\u00f6z r\u00e9tegeire<\/li>\n\n\n\n
                              • Magasabb k\u00f6lts\u00e9gek \u00e9s a folyamat bonyolults\u00e1ga<\/li>\n<\/ul>\n\n\n\n

                                7. K\u00f6lts\u00e9gek \u00e9s gy\u00e1rt\u00e1si szempontok<\/h2>\n\n\n\n

                                Gy\u00e1rt\u00e1si szempontb\u00f3l:<\/p>\n\n\n\n

                                  \n
                                • An\u00f3dos k\u00f6t\u00e9s<\/strong> \u2192 alacsonyabb k\u00f6lts\u00e9g, nagyobb hozam, egyszer\u0171bb folyamatir\u00e1ny\u00edt\u00e1s<\/li>\n\n\n\n
                                • K\u00f6zvetlen ragaszt\u00e1s<\/strong> \u2192 magasabb k\u00f6lts\u00e9gek, szigor\u00fabb elj\u00e1r\u00e1si k\u00f6vetelm\u00e9nyek, nagyobb teljes\u00edtm\u00e9ny<\/li>\n<\/ul>\n\n\n\n

                                  A t\u00f6meggy\u00e1rt\u00e1s\u00fa MEMS-\u00e9rz\u00e9kel\u0151k eset\u00e9ben gyakran az an\u00f3dos k\u00f6t\u00e9st r\u00e9szes\u00edtik el\u0151nyben.
                                  A fejlett RF MEMS-technol\u00f3gi\u00e1k \u00e9s a cs\u00facskateg\u00f3ri\u00e1s integr\u00e1ci\u00f3 ter\u00e9n a k\u00f6zvetlen k\u00f6t\u00e9s az ipar\u00e1gi szabv\u00e1ny.<\/p>\n\n\n\n

                                  8. Hogyan v\u00e1lasszuk ki a megfelel\u0151 ragaszt\u00e1si m\u00f3dszert?<\/h2>\n\n\n\n

                                  V\u00e1lassza az an\u00f3dos k\u00f6t\u00e9st, ha a k\u00f6vetkez\u0151kre van sz\u00fcks\u00e9ge:<\/h3>\n\n\n\n
                                    \n
                                  • Szil\u00edcium-\u00fcveg szerkezetek<\/li>\n\n\n\n
                                  • A csomagol\u00e1s optikai \u00e1tl\u00e1tsz\u00f3s\u00e1ga<\/li>\n\n\n\n
                                  • Alacsonyabb gy\u00e1rt\u00e1si k\u00f6lts\u00e9g<\/li>\n\n\n\n
                                  • MEMS-\u00e9rz\u00e9kel\u0151k stabil be\u00e1gyaz\u00e1sa<\/li>\n<\/ul>\n\n\n\n

                                    V\u00e1lassza a k\u00f6zvetlen ragaszt\u00e1st, ha az al\u00e1bbiakra van sz\u00fcks\u00e9ge:<\/h3>\n\n\n\n
                                      \n
                                    • Legnagyobb mechanikai szil\u00e1rds\u00e1g<\/li>\n\n\n\n
                                    • Szil\u00edcium-szil\u00edcium integr\u00e1ci\u00f3<\/li>\n\n\n\n
                                    • R\u00e1di\u00f3frekvenci\u00e1s vagy nagyfrekvenci\u00e1s teljes\u00edtm\u00e9ny<\/li>\n\n\n\n
                                    • Fejlett 3D-s szil\u00edciumlap-r\u00e9tegez\u00e9s<\/li>\n<\/ul>\n\n\n\n

                                      9. Ipar\u00e1gi trend: a hibrid k\u00f6t\u00e9s fel\u00e9<\/h2>\n\n\n\n

                                      A modern f\u00e9lvezet\u0151-csomagol\u00e1s egyre ink\u00e1bb \u00f6tv\u00f6zi a k\u00e9t m\u00f3dszert a k\u00f6vetkez\u0151k\u00e9ppen:<\/p>\n\n\n\n

                                        \n
                                      • Oszlopos szint\u0171 be\u00e1gyaz\u00e1s<\/li>\n\n\n\n
                                      • Heterog\u00e9n integr\u00e1ci\u00f3<\/li>\n\n\n\n
                                      • 3D-s r\u00e9teges MEMS-rendszerek<\/li>\n\n\n\n
                                      • Fejlett RF-modulok<\/li>\n<\/ul>\n\n\n\n

                                        Ez a hibrid megk\u00f6zel\u00edt\u00e9s mind a k\u00f6lts\u00e9ghat\u00e9konys\u00e1got, mind az eszk\u00f6z teljes\u00edtm\u00e9ny\u00e9t jav\u00edtja.<\/p>\n\n\n\n

                                        10. K\u00f6vetkeztet\u00e9s<\/h2>\n\n\n\n

                                        Mind az an\u00f3dos k\u00f6t\u00e9s, mind a k\u00f6zvetlen k\u00f6t\u00e9s alapvet\u0151 szerepet j\u00e1tszik a modern MEMS- \u00e9s \u00e9rz\u00e9kel\u0151-szil\u00edciumlapok feldolgoz\u00e1s\u00e1ban.<\/p>\n\n\n\n

                                          \n
                                        • An\u00f3dos k\u00f6t\u00e9s<\/strong> \u2192 k\u00f6lts\u00e9ghat\u00e9kony, \u00fcvegalap\u00fa MEMS-csomagol\u00e1s<\/li>\n\n\n\n
                                        • K\u00f6zvetlen ragaszt\u00e1s<\/strong> \u2192 nagy teljes\u00edtm\u00e9ny\u0171, integr\u00e1lt \u00e1ramk\u00f6ri rendszerek<\/li>\n<\/ul>\n\n\n\n

                                          A megfelel\u0151 v\u00e1laszt\u00e1s az anyagok \u00f6sszef\u00e9rhet\u0151s\u00e9g\u00e9t\u0151l, a teljes\u00edtm\u00e9nyi k\u00f6vetelm\u00e9nyekt\u0151l \u00e9s a gy\u00e1rt\u00e1si m\u00e9rett\u0151l f\u00fcgg.<\/p>","protected":false},"excerpt":{"rendered":"

                                          In advanced MEMS manufacturing and sensor packaging, wafer bonding is a critical step that directly impacts device reliability, hermetic sealing, and long-term performance. Among the most widely used techniques are anodic bonding and direct (fusion) bonding. Although both methods join wafers at the atomic or molecular level, they rely on completely different physical mechanisms and […]<\/p>\n","protected":false},"author":1,"featured_media":2031,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[207,206,208,1395,1393,1396,210,1394,204,215],"class_list":["post-2491","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-anodic-bonding","tag-direct-bonding","tag-fusion-bonding","tag-glass-bonding","tag-mems-packaging","tag-mems-sensors","tag-silicon-wafer-bonding","tag-soi-wafer","tag-wafer-bonding","tag-wafer-level-packaging"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2491","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/comments?post=2491"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2491\/revisions"}],"predecessor-version":[{"id":2494,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/posts\/2491\/revisions\/2494"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media\/2031"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/media?parent=2491"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/categories?post=2491"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/hu\/wp-json\/wp\/v2\/tags?post=2491"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}