{"id":2162,"date":"2026-04-13T05:49:11","date_gmt":"2026-04-13T05:49:11","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2162"},"modified":"2026-04-13T05:49:16","modified_gmt":"2026-04-13T05:49:16","slug":"laser-dicing-vs-mechanical-saw-in-semiconductor-manufacturing","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/hu\/laser-dicing-vs-mechanical-saw-in-semiconductor-manufacturing\/","title":{"rendered":"L\u00e9zeres apr\u00edt\u00e1s vs. mechanikus f\u0171r\u00e9sz a f\u00e9lvezet\u0151gy\u00e1rt\u00e1sban"},"content":{"rendered":"<h2 class=\"wp-block-heading\">1. Bevezet\u00e9s<\/h2>\n\n\n\n<p>Az ostyaszeletel\u00e9s (m\u00e1s n\u00e9ven ostyaszelet-szingul\u00e1l\u00e1s) a f\u00e9lvezet\u0151gy\u00e1rt\u00e1s kritikus l\u00e9p\u00e9se, amikor a feldolgozott szil\u00edcium- vagy vegy\u00fclet f\u00e9lvezet\u0151 osty\u00e1kat k\u00fcl\u00f6n\u00e1ll\u00f3 szeletekre v\u00e1lasztj\u00e1k sz\u00e9t. Az eszk\u00f6zgeometri\u00e1k zsugorod\u00e1s\u00e1val \u00e9s az anyagok - p\u00e9ld\u00e1ul a szil\u00edciumkarbid (SiC), a gallium-nitrid (GaN) \u00e9s a zaf\u00edr - v\u00e1ltozatoss\u00e1g\u00e1val a kockakisz\u00far\u00e1si technol\u00f3gia kiv\u00e1laszt\u00e1sa egyre fontosabb\u00e1 v\u00e1lik.<\/p>\n\n\n\n<p>Ma k\u00e9t domin\u00e1ns megk\u00f6zel\u00edt\u00e9st haszn\u00e1lnak sz\u00e9les k\u00f6rben:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mechanikus szeletel\u00e9s (gy\u00e9m\u00e1ntf\u0171r\u00e9szel\u00e9s)<\/li>\n\n\n\n<li>L\u00e9zeres szeletel\u00e9s (l\u00e9zeres abl\u00e1ci\u00f3 vagy lopakod\u00f3 lev\u00e1laszt\u00e1s)<\/li>\n<\/ul>\n\n\n\n<p>Mindegyik m\u00f3dszernek k\u00fcl\u00f6nb\u00f6z\u0151 fizikai mechanizmusai, folyamatbeli korl\u00e1tai \u00e9s alkalmaz\u00e1si ter\u00fcletei vannak. Ez a cikk a k\u00e9t technol\u00f3gia tudom\u00e1nyos \u00f6sszehasonl\u00edt\u00e1s\u00e1t ny\u00fajtja az elvek, a teljes\u00edtm\u00e9ny \u00e9s az ipari alkalmass\u00e1g szempontj\u00e1b\u00f3l.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-1024x683.png\" alt=\"\" class=\"wp-image-2164\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-1024x683.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-300x200.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-768x512.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-18x12.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing-600x400.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Laser-Dicing-vs-Mechanical-Saw-in-Semiconductor-Manufacturing.png 1536w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">2. Alapvet\u0151 m\u0171k\u00f6d\u00e9si elvek<\/h2>\n\n\n\n<h2 class=\"wp-block-heading\">2.1 Mechanikus Wafer Dicing (gy\u00e9m\u00e1ntf\u0171r\u00e9szel\u00e9s)<\/h2>\n\n\n\n<p>A mechanikus kock\u00e1z\u00e1s nagy sebess\u00e9g\u0171 forg\u00f3 ors\u00f3t haszn\u00e1l, amely gy\u00e9m\u00e1nttal be\u00e1gyazott peng\u00e9vel van felszerelve. Az osty\u00e1t a szalagra szerelik, \u00e9s el\u0151re meghat\u00e1rozott utc\u00e1k ment\u00e9n v\u00e1gj\u00e1k.<\/p>\n\n\n\n<p>A folyamatot a kop\u00e1son \u00e9s a t\u00f6r\u00e9smechanik\u00e1n kereszt\u00fcl t\u00f6rt\u00e9n\u0151 anyagelt\u00e1vol\u00edt\u00e1s szab\u00e1lyozza:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A gy\u00e9m\u00e1ntr\u00e9szecsk\u00e9k mechanikusan karcolj\u00e1k \u00e9s t\u00f6rik az osty\u00e1t.<\/li>\n\n\n\n<li>Az anyagot finom t\u00f6rmel\u00e9kk\u00e9nt t\u00e1vol\u00edtj\u00e1k el (iszap vagy sz\u00e1raz r\u00e9szecsk\u00e9k a rendszert\u0151l f\u00fcgg\u0151en).<\/li>\n\n\n\n<li>A h\u0171t\u0151vizet gyakran haszn\u00e1lj\u00e1k a termikus \u00e9s mechanikai ig\u00e9nybev\u00e9tel cs\u00f6kkent\u00e9s\u00e9re.<\/li>\n<\/ul>\n\n\n\n<p>Ez a m\u00f3dszer kiforrott \u00e9s sz\u00e9les k\u00f6rben elfogadott a f\u00e9lvezet\u0151gy\u00e1rakban.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2.2 L\u00e9zeres Wafer Dicing<\/h2>\n\n\n\n<p>A l\u00e9zeres apr\u00edt\u00e1s nagym\u00e9rt\u00e9kben f\u00f3kusz\u00e1lt l\u00e9zersugarat (nanoszekundumos, pikoszekundumos vagy femtoszekundumos impulzusokat) haszn\u00e1l az anyag m\u00f3dos\u00edt\u00e1s\u00e1ra vagy elt\u00e1vol\u00edt\u00e1s\u00e1ra.<\/p>\n\n\n\n<p>A k\u00f6z\u00f6s mechanizmusok k\u00f6z\u00e9 tartoznak:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>L\u00e9zeres abl\u00e1ci\u00f3<\/strong>: az anyag k\u00f6zvetlen elp\u00e1rolg\u00e1sa<\/li>\n\n\n\n<li><strong>Lopakod\u00f3 kock\u00e1z\u00e1s<\/strong>: a felsz\u00edn alatti r\u00e9tegek m\u00f3dos\u00edt\u00e1sa, amelyet ellen\u0151rz\u00f6tt t\u00f6r\u00e9s k\u00f6vet<\/li>\n\n\n\n<li><strong>H\u0151fesz\u00fclts\u00e9g elv\u00e1laszt\u00e1s<\/strong>: a lokaliz\u00e1lt f\u0171t\u00e9s reped\u00e9sszaporod\u00e1st induk\u00e1l<\/li>\n<\/ul>\n\n\n\n<p>A mechanikus \u00e9rintkez\u0151 v\u00e1g\u00e1ssal ellent\u00e9tben a l\u00e9zeres szeletel\u00e9s \u00e9rint\u00e9smentes elj\u00e1r\u00e1s, ami cs\u00f6kkenti a szeletet \u00e9r\u0151 mechanikai ig\u00e9nybev\u00e9telt.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">3. Folyamat \u00f6sszehasonl\u00edt\u00e1s<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">3.1 Mechanikai fesz\u00fclts\u00e9g \u00e9s k\u00e1rosod\u00e1s<\/h3>\n\n\n\n<p>Mechanikus kock\u00e1z\u00e1s bevezet\u00e9se:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Sz\u00e9lek forg\u00e1csol\u00f3d\u00e1sa<\/li>\n\n\n\n<li>Mikroreped\u00e9sek<\/li>\n\n\n\n<li>Fesz\u00fclts\u00e9gterjed\u00e9s rideg anyagokban<\/li>\n<\/ul>\n\n\n\n<p>A l\u00e9zeres apr\u00edt\u00e1s cs\u00f6kkenti a mechanikai er\u0151t, de bevezetheti:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>H\u0151hat\u00e1s \u00e1ltal \u00e9rintett z\u00f3n\u00e1k (HAZ)<\/li>\n\n\n\n<li>Mikroszerkezeti m\u00f3dos\u00edt\u00e1s a hull\u00e1mhossz \u00e9s az impulzus id\u0151tartam f\u00fcggv\u00e9ny\u00e9ben<\/li>\n<\/ul>\n\n\n\n<p>A t\u00f6r\u00e9keny \u00e9s nagy \u00e9rt\u00e9k\u0171 anyagok (pl. SiC-lapk\u00e1k) eset\u00e9ben a s\u00e9r\u00fcl\u00e9sek ellen\u0151rz\u00e9se kritikus fontoss\u00e1g\u00fa.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3.2 Precizit\u00e1s \u00e9s keresztsz\u00e9less\u00e9g<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mechanikus f\u0171r\u00e9szv\u00e1g\u00e1s: jellemz\u0151en 25-60 \u00b5m (a lapvastags\u00e1gt\u00f3l f\u00fcgg)<\/li>\n\n\n\n<li>L\u00e9zer v\u00e1g\u00e1s: optimaliz\u00e1lt rendszerekben &lt;20 \u00b5m-re cs\u00f6kkenthet\u0151<\/li>\n<\/ul>\n\n\n\n<p>A l\u00e9zertechnol\u00f3gia nagyobb rugalmass\u00e1got biztos\u00edt az ultrafinom geometri\u00e1khoz, k\u00fcl\u00f6n\u00f6sen a fejlett csomagol\u00e1si \u00e9s MEMS-eszk\u00f6z\u00f6k eset\u00e9ben.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3.3 Anyagi kompatibilit\u00e1s<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Anyag t\u00edpusa<\/th><th>Mechanikus f\u0171r\u00e9sz<\/th><th>L\u00e9zeres apr\u00edt\u00e1s<\/th><\/tr><\/thead><tbody><tr><td>Szil\u00edcium (Si)<\/td><td>Sz\u00e9les k\u00f6rben haszn\u00e1lt<\/td><td>N\u00f6vekv\u0151 haszn\u00e1lat<\/td><\/tr><tr><td>SiC<\/td><td>Neh\u00e9z (szersz\u00e1mkop\u00e1s)<\/td><td>El\u0151nyben r\u00e9szes\u00fcl (fejlett rendszerek)<\/td><\/tr><tr><td>Zaf\u00edr<\/td><td>Magas forg\u00e1csol\u00e1si kock\u00e1zat<\/td><td>Jobb \u00e9lmin\u0151s\u00e9g<\/td><\/tr><tr><td>GaN<\/td><td>M\u00e9rs\u00e9kelt k\u00e1r<\/td><td>El\u0151nyben r\u00e9szes\u00edtett<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>A l\u00e9zeres szaggat\u00e1s egyre el\u0151ny\u00f6sebb\u00e9 v\u00e1lik a kem\u00e9ny, rideg \u00e9s sz\u00e9les s\u00e1vsz\u00e9less\u00e9g\u0171 anyagok eset\u00e9ben.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3.4 \u00c1raml\u00e1steljes\u00edtm\u00e9ny \u00e9s k\u00f6lts\u00e9ghat\u00e9konys\u00e1g<\/h3>\n\n\n\n<p>Mechanikus kock\u00e1z\u00e1s:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Nagy \u00e1tereszt\u0151k\u00e9pess\u00e9g<\/li>\n\n\n\n<li>Alacsonyabb felszerel\u00e9si k\u00f6lts\u00e9g<\/li>\n\n\n\n<li>Kiforrott fogy\u00f3anyag-\u00f6kosziszt\u00e9ma (peng\u00e9k, h\u0171t\u0151folyad\u00e9k)<\/li>\n<\/ul>\n\n\n\n<p>L\u00e9zeres szeletel\u00e9s:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Magasabb t\u0151kebefektet\u00e9s<\/li>\n\n\n\n<li>Alacsonyabb fogy\u00f3eszk\u00f6zk\u00f6lts\u00e9g<\/li>\n\n\n\n<li>Bizonyos konfigur\u00e1ci\u00f3kban potenci\u00e1lisan lassabb (a beolvas\u00e1si strat\u00e9gi\u00e1t\u00f3l f\u00fcgg\u0151en)<\/li>\n<\/ul>\n\n\n\n<p>A nagy volumen\u0171 szil\u00edciumgy\u00e1rt\u00e1sban a k\u00f6lts\u00e9ghat\u00e9konys\u00e1g miatt m\u00e9g mindig a mechanikus f\u0171r\u00e9szel\u00e9s domin\u00e1l.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3.5 Szersz\u00e1mkop\u00e1s \u00e9s karbantart\u00e1s<\/h3>\n\n\n\n<p>A mechanikus rendszerek szenvednek:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Penge kop\u00e1s<\/li>\n\n\n\n<li>Gyakori csere<\/li>\n\n\n\n<li>A folyamat id\u0151beli sodr\u00f3d\u00e1sa<\/li>\n<\/ul>\n\n\n\n<p>L\u00e9zerrendszerek:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Nincs fizikai szersz\u00e1mkop\u00e1s<\/li>\n\n\n\n<li>Csak optikai igaz\u00edt\u00e1st \u00e9s lencsekarbantart\u00e1st ig\u00e9nyel<\/li>\n<\/ul>\n\n\n\n<p>Ez teszi a l\u00e9zerrendszereket vonz\u00f3v\u00e1 a prec\u00edzi\u00f3s gy\u00e1rt\u00e1s hossz\u00fa t\u00e1v\u00fa stabilit\u00e1sa szempontj\u00e1b\u00f3l.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">4. Ipari alkalmaz\u00e1sok<\/h2>\n\n\n\n<h2 class=\"wp-block-heading\">4.1 Mechanikus apr\u00edt\u00e1s alkalmaz\u00e1sok<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>CMOS k\u00e9p\u00e9rz\u00e9kel\u0151k<\/li>\n\n\n\n<li>Mem\u00f3riachipek (DRAM, NAND)<\/li>\n\n\n\n<li>Szabv\u00e1nyos szil\u00edcium IC csomagol\u00e1s<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">4.2 <a href=\"https:\/\/www.zmsh-semitech.com\/hu\/termekkategoria\/laser-cutting\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#0693e3\" class=\"has-inline-color\">L\u00e9zeres apr\u00edt\u00e1s<\/mark><\/a> Alkalmaz\u00e1sok<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>SiC t\u00e1pegys\u00e9gek (EV, t\u00f6lt\u0151infrastrukt\u00fara)<\/li>\n\n\n\n<li>LED \u00e9s optoelektronikai osty\u00e1k<\/li>\n\n\n\n<li>MEMS eszk\u00f6z\u00f6k<\/li>\n\n\n\n<li>Fejlett heterog\u00e9n integr\u00e1ci\u00f3s csomagol\u00e1s<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">5. \u00d6sszefoglal\u00f3 a legfontosabb kompromisszumokr\u00f3l<\/h2>\n\n\n\n<p>M\u00e9rn\u00f6ki szempontb\u00f3l a l\u00e9zeres \u00e9s a mechanikus apr\u00edt\u00e1s k\u00f6z\u00f6tti v\u00e1laszt\u00e1s a kiegyens\u00falyozotts\u00e1gt\u00f3l f\u00fcgg:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Hozam kontra k\u00f6lts\u00e9g<\/li>\n\n\n\n<li>Anyagkem\u00e9nys\u00e9g vs. \u00e1tereszt\u0151k\u00e9pess\u00e9g<\/li>\n\n\n\n<li>Precizit\u00e1s vs. sk\u00e1l\u00e1zhat\u00f3s\u00e1g<\/li>\n<\/ul>\n\n\n\n<p>A mechanikus apr\u00edt\u00e1s tov\u00e1bbra is a mainstream f\u00e9lvezet\u0151gy\u00e1rt\u00e1s gerinc\u00e9t k\u00e9pezi, m\u00edg a l\u00e9zeres apr\u00edt\u00e1s gyorsan terjed a fejlett anyagok \u00e9s a nagy \u00e9rt\u00e9k\u0171 alkalmaz\u00e1sok ter\u00fclet\u00e9n.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">6. J\u00f6v\u0151beli fejleszt\u00e9si trendek<\/h2>\n\n\n\n<p>T\u00f6bb trend is alak\u00edtja az ostyaszeletel\u00e9s fejl\u0151d\u00e9s\u00e9t:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.1 Hibrid szaggat\u00f3rendszerek<\/h3>\n\n\n\n<p>Egyes gy\u00e1rt\u00f3k kombin\u00e1lj\u00e1k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>L\u00e9zeres fel\u00edr\u00e1s + mechanikus t\u00f6r\u00e9s<\/li>\n\n\n\n<li>L\u00e9zeres hornyol\u00e1s + pengekik\u00e9sz\u00edt\u00e9s<\/li>\n<\/ul>\n\n\n\n<p>Ez jav\u00edtja mind a hozamot, mind az \u00e1tmen\u0151 teljes\u00edtm\u00e9nyt.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.2 Ultrar\u00f6vid impulzus\u00fa l\u00e9zerek<\/h3>\n\n\n\n<p>A femtoszekundumos l\u00e9zerrendszerek jelent\u0151sen cs\u00f6kkentik a h\u0151hat\u00e1s \u00e1ltal \u00e9rintett z\u00f3n\u00e1kat, lehet\u0151v\u00e9 t\u00e9ve:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tiszt\u00e1bb \u00e9lek<\/li>\n\n\n\n<li>Cs\u00f6kkentett mikroreped\u00e9sek<\/li>\n\n\n\n<li>Jav\u00edtott megb\u00edzhat\u00f3s\u00e1g SiC \u00e9s zaf\u00edr osty\u00e1k eset\u00e9ben<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">6.3 300 mm-es osty\u00e1k kih\u00edv\u00e1sai<\/h3>\n\n\n\n<p>Ahogy n\u0151 az ostyam\u00e9ret:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A mechanikai fesz\u00fclts\u00e9geloszl\u00e1s \u00f6sszetettebb\u00e9 v\u00e1lik<\/li>\n\n\n\n<li>A vetemed\u00e9s ellen\u0151rz\u00e9se kritikus fontoss\u00e1g\u00fa<\/li>\n\n\n\n<li>A l\u00e9zeres pontoss\u00e1g egyre \u00e9rt\u00e9kesebb\u00e9 v\u00e1lik<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">7. K\u00f6vetkeztet\u00e9s<\/h2>\n\n\n\n<p>A l\u00e9zeres szeletel\u00e9s \u00e9s a mechanikus f\u0171r\u00e9szel\u00e9s k\u00e9t alapvet\u0151en elt\u00e9r\u0151 m\u0171szaki megk\u00f6zel\u00edt\u00e9st k\u00e9pvisel a szeletel\u00e9shez.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>A mechanikus f\u0171r\u00e9szek kiemelkednek a k\u00f6lts\u00e9ghat\u00e9konys\u00e1g \u00e9s a nagy volumen\u0171 szil\u00edciumgy\u00e1rt\u00e1s ter\u00e9n<\/li>\n\n\n\n<li>A l\u00e9zeres szaggat\u00e1s kiemelkedik a pontoss\u00e1g, az anyagrugalmass\u00e1g \u00e9s a fejlett f\u00e9lvezet\u0151 alkalmaz\u00e1sok ter\u00e9n<\/li>\n<\/ul>\n\n\n\n<p>Ahelyett, hogy teljesen felv\u00e1ltan\u00e1k egym\u00e1st, ezek a technol\u00f3gi\u00e1k egyre ink\u00e1bb egym\u00e1s mellett l\u00e9teznek egy egym\u00e1st kieg\u00e9sz\u00edt\u0151 gy\u00e1rt\u00e1si \u00f6kosziszt\u00e9m\u00e1ban, amelyet az anyaginnov\u00e1ci\u00f3 \u00e9s az eszk\u00f6z\u00f6k miniat\u00fcriz\u00e1l\u00e1sa hajt.<\/p>","protected":false},"excerpt":{"rendered":"<p>1. Introduction Wafer dicing (also called wafer singulation) is a critical step in semiconductor manufacturing, where processed silicon or compound semiconductor wafers are separated into individual dies. As device geometries shrink and materials diversify\u2014such as silicon carbide (SiC), gallium nitride (GaN), and sapphire\u2014the choice of dicing technology becomes increasingly important. Two dominant approaches are widely [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2164,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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