{"id":2215,"date":"2026-04-15T02:54:20","date_gmt":"2026-04-15T02:54:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2215"},"modified":"2026-04-15T02:57:45","modified_gmt":"2026-04-15T02:57:45","slug":"wdp-1240-series-dry-polishing-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fr\/product\/wdp-1240-series-dry-polishing-machine\/","title":{"rendered":"Machine de polissage \u00e0 sec de la s\u00e9rie WDP-1240 pour le traitement de la face arri\u00e8re et la r\u00e9duction des contraintes des plaquettes de 300 mm"},"content":{"rendered":"<p data-start=\"281\" data-end=\"650\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2217\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png\" alt=\"Machine de polissage \u00e0 sec de la s\u00e9rie WDP-1240 pour le traitement de la face arri\u00e8re et la r\u00e9duction des contraintes des plaquettes de 300 mm\" width=\"290\" height=\"290\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WDP-1240-Series-Dry-Polishing-Machine-for-300mm-Wafer-Stress-Relief-and-Backside-Processing.png 1000w\" sizes=\"(max-width: 290px) 100vw, 290px\" \/>La machine de polissage \u00e0 sec de la s\u00e9rie WDP-1240 est un syst\u00e8me de pr\u00e9cision avanc\u00e9 d\u00e9velopp\u00e9 pour la r\u00e9duction des contraintes sur la face arri\u00e8re des plaquettes et l'\u00e9limination des couches endommag\u00e9es dans la fabrication des semi-conducteurs. Sp\u00e9cialement con\u00e7u pour le traitement des plaquettes de 300 mm, cet \u00e9quipement utilise un processus de polissage \u00e0 sec pour obtenir une finition de surface de haute qualit\u00e9 tout en minimisant l'impact sur l'environnement.<\/p>\n<p data-start=\"652\" data-end=\"959\">Ce syst\u00e8me est particuli\u00e8rement adapt\u00e9 aux applications d'emballage avanc\u00e9es, o\u00f9 l'amincissement des plaquettes et le contr\u00f4le des contraintes sont essentiels. En \u00e9liminant efficacement les couches endommag\u00e9es sous la surface caus\u00e9es par les processus de meulage, le WDP-1240 contribue \u00e0 am\u00e9liorer l'int\u00e9grit\u00e9 des plaquettes, \u00e0 r\u00e9duire le gauchissement et \u00e0 renforcer la r\u00e9sistance m\u00e9canique.<\/p>\n<p data-start=\"961\" data-end=\"1182\">Par rapport aux syst\u00e8mes traditionnels de polissage par voie humide, le processus \u00e0 sec \u00e9limine la contamination li\u00e9e \u00e0 la boue et r\u00e9duit les exigences en mati\u00e8re de traitement des d\u00e9chets, ce qui en fait une solution plus respectueuse de l'environnement et plus rentable.<\/p>\n<hr data-start=\"1184\" data-end=\"1187\" \/>\n<h2 data-section-id=\"m7ukan\" data-start=\"1189\" data-end=\"1232\">Principales caract\u00e9ristiques et avantages techniques<\/h2>\n<h3 data-section-id=\"capa5r\" data-start=\"1234\" data-end=\"1295\">Technologie de polissage \u00e0 sec pour un faible impact sur l'environnement<\/h3>\n<p data-start=\"1296\" data-end=\"1491\">Le WDP-1240 adopte un processus de polissage enti\u00e8rement \u00e0 sec, \u00e9liminant le besoin de boues chimiques. Cela permet de r\u00e9duire consid\u00e9rablement la charge environnementale, de simplifier la maintenance et de diminuer les co\u00fbts d'exploitation.<\/p>\n<h3 data-section-id=\"1awlizo\" data-start=\"1493\" data-end=\"1543\">Soulagement efficace du stress et \u00e9limination des dommages<\/h3>\n<p data-start=\"1544\" data-end=\"1722\">Con\u00e7u pour \u00e9liminer la couche de d\u00e9t\u00e9rioration de la face arri\u00e8re apr\u00e8s le broyage de la plaquette, le syst\u00e8me lib\u00e8re efficacement les tensions internes, ce qui am\u00e9liore la plan\u00e9it\u00e9 et la stabilit\u00e9 structurelle de la plaquette.<\/p>\n<h3 data-section-id=\"90fwyd\" data-start=\"1724\" data-end=\"1762\">Am\u00e9lioration du rendement des plaquettes minces<\/h3>\n<p data-start=\"1763\" data-end=\"1827\">En minimisant la concentration des contraintes, la machine permet d'\u00e9viter.. :<\/p>\n<ul data-start=\"1828\" data-end=\"1876\">\n<li data-section-id=\"pus2hj\" data-start=\"1828\" data-end=\"1846\">Fissuration des plaquettes<\/li>\n<li data-section-id=\"wcbb49\" data-start=\"1847\" data-end=\"1864\">\u00c9barbage des bords<\/li>\n<li data-section-id=\"bpnlvj\" data-start=\"1865\" data-end=\"1876\">L'arr\u00eat de travail<\/li>\n<\/ul>\n<p data-start=\"1878\" data-end=\"1965\">Cela permet d'obtenir un taux de rendement plus \u00e9lev\u00e9, en particulier pour les plaquettes de grande taille et ultra-minces.<\/p>\n<h3 data-section-id=\"98a0im\" data-start=\"1967\" data-end=\"2017\">Int\u00e9gration transparente avec les syst\u00e8mes d'\u00e9claircissage<\/h3>\n<p data-start=\"2018\" data-end=\"2217\">Le WDP-1240 peut \u00eatre int\u00e9gr\u00e9 \u00e0 des \u00e9quipements en amont tels que le broyeur automatique de plaquettes WG1251, ce qui permet de cr\u00e9er des lignes de production enti\u00e8rement automatis\u00e9es avec un transfert s\u00fbr et stable des plaquettes entre les processus.<\/p>\n<h3 data-section-id=\"1pvq7tz\" data-start=\"2219\" data-end=\"2265\">Structure m\u00e9canique stable et robuste<\/h3>\n<p data-start=\"2266\" data-end=\"2435\">L'\u00e9quipement est dot\u00e9 d'une broche unique, d'un mandrin unique et d'une unit\u00e9 de dressage, ce qui garantit des performances de polissage constantes et une stabilit\u00e9 op\u00e9rationnelle \u00e0 long terme.<\/p>\n<hr data-start=\"2437\" data-end=\"2440\" \/>\n<h2 data-section-id=\"8lu2ky\" data-start=\"2442\" data-end=\"2472\">\u00a0Sp\u00e9cifications techniques<\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2474\" data-end=\"2738\">\n<thead data-start=\"2474\" data-end=\"2498\">\n<tr data-start=\"2474\" data-end=\"2498\">\n<th class=\"\" data-start=\"2474\" data-end=\"2481\" data-col-size=\"sm\">Objet<\/th>\n<th class=\"\" data-start=\"2481\" data-end=\"2498\" data-col-size=\"md\">Sp\u00e9cifications<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2522\" data-end=\"2738\">\n<tr data-start=\"2522\" data-end=\"2583\">\n<td data-start=\"2522\" data-end=\"2534\" data-col-size=\"sm\">Structure<\/td>\n<td data-start=\"2534\" data-end=\"2583\" data-col-size=\"md\">Broche \u00d71 \/ Table de mandrin \u00d71 \/ Unit\u00e9 de dressage \u00d71<\/td>\n<\/tr>\n<tr data-start=\"2584\" data-end=\"2618\">\n<td data-start=\"2584\" data-end=\"2600\" data-col-size=\"sm\">Puissance de la broche<\/td>\n<td data-start=\"2600\" data-end=\"2618\" data-col-size=\"md\">7,5 kW \/ 11 kW<\/td>\n<\/tr>\n<tr data-start=\"2619\" data-end=\"2658\">\n<td data-start=\"2619\" data-end=\"2632\" data-col-size=\"sm\">Taille de la plaquette<\/td>\n<td data-start=\"2632\" data-end=\"2658\" data-col-size=\"md\">Jusqu'\u00e0 12 pouces (300 mm)<\/td>\n<\/tr>\n<tr data-start=\"2659\" data-end=\"2691\">\n<td data-start=\"2659\" data-end=\"2674\" data-col-size=\"sm\">Type de processus<\/td>\n<td data-start=\"2674\" data-end=\"2691\" data-col-size=\"md\">Polissage \u00e0 sec<\/td>\n<\/tr>\n<tr data-start=\"2692\" data-end=\"2738\">\n<td data-start=\"2692\" data-end=\"2713\" data-col-size=\"sm\">Dimensions de la machine<\/td>\n<td data-start=\"2713\" data-end=\"2738\" data-col-size=\"md\">1450 \u00d7 3380 \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2740\" data-end=\"2743\" \/>\n<h2 data-section-id=\"13yq5fc\" data-start=\"2745\" data-end=\"2768\">Principe de fonctionnement<\/h2>\n<p data-start=\"2812\" data-end=\"2954\">Le WDP-1240 fonctionne en appliquant un polissage m\u00e9canique contr\u00f4l\u00e9 \u00e0 la face arri\u00e8re de la plaquette \u00e0 l'aide d'une broche \u00e0 grande vitesse et d'un syst\u00e8me de mandrin de pr\u00e9cision.<\/p>\n<p data-start=\"2956\" data-end=\"3193\">Apr\u00e8s l'amincissement des plaquettes, une couche endommag\u00e9e reste souvent sous la surface, introduisant une contrainte interne. Le processus de polissage \u00e0 sec \u00e9limine cette couche tout en maintenant un contr\u00f4le strict sur la pression et le taux d'enl\u00e8vement de mati\u00e8re. Il en r\u00e9sulte :<\/p>\n<ul data-start=\"3195\" data-end=\"3278\">\n<li data-section-id=\"1r1ex1w\" data-start=\"3195\" data-end=\"3222\">Qualit\u00e9 de surface uniforme<\/li>\n<li data-section-id=\"bhqqr1\" data-start=\"3223\" data-end=\"3250\">R\u00e9duction des contraintes r\u00e9siduelles<\/li>\n<li data-section-id=\"1iz8bdx\" data-start=\"3251\" data-end=\"3278\">Am\u00e9lioration de la plan\u00e9it\u00e9 des plaquettes<\/li>\n<\/ul>\n<p data-start=\"3280\" data-end=\"3392\">L'unit\u00e9 de dressage int\u00e9gr\u00e9e garantit que les outils de polissage conservent des performances constantes tout au long du processus.<\/p>\n<hr data-start=\"3394\" data-end=\"3397\" \/>\n<h2 data-section-id=\"1mpxdoq\" data-start=\"3399\" data-end=\"3422\"><img decoding=\"async\" class=\"size-medium wp-image-2171 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/4inch_silicon_carbide_wafers.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Domaine d'application<\/h2>\n<p data-start=\"3424\" data-end=\"3462\">La s\u00e9rie WDP-1240 est largement utilis\u00e9e dans :<\/p>\n<ul data-start=\"3464\" data-end=\"3675\">\n<li data-section-id=\"thioxr\" data-start=\"3464\" data-end=\"3507\">Traitement de la face arri\u00e8re des plaquettes de semi-conducteurs<\/li>\n<li data-section-id=\"1b52adm\" data-start=\"3508\" data-end=\"3557\">Emballage avanc\u00e9 (WLCSP, emballage en \u00e9ventail)<\/li>\n<li data-section-id=\"1lhtczs\" data-start=\"3558\" data-end=\"3590\">Polissage de plaquettes de silicium (Si)<\/li>\n<li data-section-id=\"zqmbwb\" data-start=\"3591\" data-end=\"3633\">Traitement des plaquettes de carbure de silicium (SiC)<\/li>\n<li data-section-id=\"1xtbjfg\" data-start=\"3634\" data-end=\"3675\">Applications de r\u00e9duction des contraintes sur les plaquettes minces<\/li>\n<\/ul>\n<p data-start=\"3677\" data-end=\"3828\">Il prend en charge les plaquettes de 12 pouces et moins, ce qui le rend adapt\u00e9 \u00e0 la fois \u00e0 la production traditionnelle de semi-conducteurs et aux technologies d'emballage avanc\u00e9es \u00e9mergentes.<\/p>\n<hr data-start=\"3830\" data-end=\"3833\" \/>\n<h2 data-section-id=\"1116wfg\" data-start=\"3835\" data-end=\"3856\"><img decoding=\"async\" class=\"size-medium wp-image-2122 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Avantages principaux<\/h2>\n<ul data-start=\"3858\" data-end=\"4293\">\n<li data-section-id=\"6czk3i\" data-start=\"3858\" data-end=\"3942\">Faible impact environnemental<br data-start=\"3888\" data-end=\"3891\" \/>Le proc\u00e9d\u00e9 \u00e0 sec \u00e9limine les boues et r\u00e9duit les d\u00e9chets<\/li>\n<li data-section-id=\"7ceake\" data-start=\"3944\" data-end=\"4024\">Am\u00e9lioration du rendement<br data-start=\"3972\" data-end=\"3975\" \/>Minimise la fissuration et le gauchissement des plaquettes minces<\/li>\n<li data-section-id=\"aztc7d\" data-start=\"4026\" data-end=\"4104\">Stabilit\u00e9 \u00e9lev\u00e9e du processus<br data-start=\"4054\" data-end=\"4057\" \/>La structure robuste garantit des r\u00e9sultats coh\u00e9rents<\/li>\n<li data-section-id=\"1viz6br\" data-start=\"4106\" data-end=\"4194\">Int\u00e9gration de la cha\u00eene de production<br data-start=\"4139\" data-end=\"4142\" \/>Compatible avec les syst\u00e8mes automatis\u00e9s d'amincissement des gaufrettes<\/li>\n<li data-section-id=\"vz1nvb\" data-start=\"4196\" data-end=\"4293\">Optimis\u00e9 pour l'emballage avanc\u00e9<br data-start=\"4234\" data-end=\"4237\" \/>Con\u00e7ue pour les proc\u00e9d\u00e9s de semi-conducteurs de la prochaine g\u00e9n\u00e9ration<\/li>\n<\/ul>\n<hr data-start=\"4295\" data-end=\"4298\" \/>\n<h2 data-section-id=\"w1cnyx\" data-start=\"4300\" data-end=\"4309\">FAQ<\/h2>\n<p data-start=\"4311\" data-end=\"4563\">Q1 : Quel est le principal avantage du polissage \u00e0 sec par rapport au polissage humide ?<br data-start=\"4389\" data-end=\"4392\" \/>R : Le polissage \u00e0 sec \u00e9limine l'utilisation de boues, ce qui r\u00e9duit l'impact sur l'environnement, simplifie l'entretien et diminue les co\u00fbts d'exploitation tout en maintenant une qualit\u00e9 de surface \u00e9lev\u00e9e.<\/p>\n<p data-start=\"4565\" data-end=\"4700\">Q2 : Quelles sont les tailles de plaquettes prises en charge ?<br data-start=\"4604\" data-end=\"4607\" \/>R : Le WDP-1240 prend en charge les wafers jusqu'\u00e0 12 pouces (300 mm), y compris les mat\u00e9riaux Si et SiC.<\/p>\n<p data-start=\"4702\" data-end=\"4916\">Q3 : Cette machine peut-elle \u00eatre int\u00e9gr\u00e9e dans une cha\u00eene de production ?<br data-start=\"4764\" data-end=\"4767\" \/>R : Oui. Il peut \u00eatre connect\u00e9 de mani\u00e8re transparente \u00e0 un \u00e9quipement d'amincissement des gaufres tel que le WG1251, ce qui permet un transfert automatis\u00e9 des gaufres et un traitement continu.<\/p>","protected":false},"excerpt":{"rendered":"<p>La machine de polissage \u00e0 sec de la s\u00e9rie WDP-1240 est un syst\u00e8me de pr\u00e9cision avanc\u00e9 d\u00e9velopp\u00e9 pour la r\u00e9duction des contraintes sur la face arri\u00e8re des plaquettes et l'\u00e9limination des couches endommag\u00e9es dans la fabrication des semi-conducteurs. Sp\u00e9cialement con\u00e7u pour le traitement des plaquettes de 300 mm, cet \u00e9quipement utilise un processus de polissage \u00e0 sec pour obtenir une finition de surface de haute qualit\u00e9 tout en minimisant l'impact sur l'environnement.<\/p>","protected":false},"featured_media":2217,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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