{"id":2189,"date":"2026-04-14T05:47:26","date_gmt":"2026-04-14T05:47:26","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2189"},"modified":"2026-04-14T05:47:29","modified_gmt":"2026-04-14T05:47:29","slug":"6-inch-4h-n-silicon-carbide-wafer","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fr\/product\/6-inch-4h-n-silicon-carbide-wafer\/","title":{"rendered":"Plaquette de carbure de silicium 4H-N de 6 pouces"},"content":{"rendered":"<p data-start=\"457\" data-end=\"813\">La plaquette de 6 pouces en carbure de silicium 4H-N est un substrat semi-conducteur \u00e0 large bande interdite con\u00e7u pour les dispositifs \u00e9lectroniques de puissance de la prochaine g\u00e9n\u00e9ration. Par rapport aux mat\u00e9riaux traditionnels \u00e0 base de silicium, le carbure de silicium offre un champ \u00e9lectrique de rupture nettement plus \u00e9lev\u00e9, une conductivit\u00e9 thermique sup\u00e9rieure et des performances stables dans des conditions de haute temp\u00e9rature et de haute tension.<img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2192 size-medium\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-300x300.webp\" alt=\"Plaquette de carbure de silicium 4H-N\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd2.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/p>\n<p data-start=\"815\" data-end=\"1152\">La large bande interdite d'environ 3,26 eV permet aux dispositifs \u00e0 base de SiC de fonctionner \u00e0 des tensions et des fr\u00e9quences de commutation plus \u00e9lev\u00e9es tout en maintenant des pertes d'\u00e9nergie plus faibles. Par cons\u00e9quent, le SiC est devenu un mat\u00e9riau essentiel pour les syst\u00e8mes de conversion d'\u00e9nergie \u00e0 haut rendement, notamment les v\u00e9hicules \u00e9lectriques, les syst\u00e8mes d'\u00e9nergie renouvelable et les alimentations \u00e9lectriques industrielles.<\/p>\n<p data-start=\"1154\" data-end=\"1446\">Le format de plaquette de 6 pouces (classe 150 mm) est actuellement le principal standard industriel pour la fabrication de dispositifs SiC. Il offre un \u00e9quilibre optimal entre le rendement de production, la maturit\u00e9 du processus et la rentabilit\u00e9, ce qui le rend adapt\u00e9 \u00e0 la fois \u00e0 la production de masse et aux applications de recherche avanc\u00e9e.<\/p>\n<h2 data-section-id=\"1m0bppr\" data-start=\"1453\" data-end=\"1475\">Propri\u00e9t\u00e9s des mat\u00e9riaux<\/h2>\n<p data-start=\"1477\" data-end=\"1603\">Le 4H-SiC est le polytype le plus utilis\u00e9 dans l'\u00e9lectronique de puissance en raison de sa sym\u00e9trie cristalline favorable et de ses performances \u00e9lectriques.<\/p>\n<p data-start=\"1605\" data-end=\"1638\">Les principales propri\u00e9t\u00e9s intrins\u00e8ques sont les suivantes<\/p>\n<ul data-start=\"1640\" data-end=\"1985\">\n<li data-section-id=\"u9adpp\" data-start=\"1640\" data-end=\"1699\">Large bande interdite (~3,26 eV) permettant un fonctionnement \u00e0 haute tension<\/li>\n<li data-section-id=\"1qovr\" data-start=\"1700\" data-end=\"1774\">Conductivit\u00e9 thermique \u00e9lev\u00e9e (~4,9 W\/cm-K) pour une dissipation efficace de la chaleur<\/li>\n<li data-section-id=\"1eo3rd4\" data-start=\"1775\" data-end=\"1850\">Champ \u00e9lectrique de rupture \u00e9lev\u00e9 (~3 MV\/cm) permettant la conception de dispositifs compacts<\/li>\n<li data-section-id=\"1pbvzeg\" data-start=\"1851\" data-end=\"1914\">Vitesse de saturation \u00e9lev\u00e9e des \u00e9lectrons permettant une commutation rapide<\/li>\n<li data-section-id=\"2w4jum\" data-start=\"1915\" data-end=\"1985\">Excellente r\u00e9sistance aux produits chimiques et aux radiations pour les environnements difficiles<\/li>\n<\/ul>\n<p data-start=\"1987\" data-end=\"2087\">Ces propri\u00e9t\u00e9s font du SiC un mat\u00e9riau essentiel pour les dispositifs semi-conducteurs \u00e0 haute puissance et \u00e0 haut rendement.<\/p>\n<h2 data-section-id=\"4ew6vq\" data-start=\"2094\" data-end=\"2137\"><img decoding=\"async\" class=\"alignright wp-image-2190 size-medium\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-300x300.webp\" alt=\"Plaquette de carbure de silicium 4H-N de 6 pouces\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd4.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Croissance des cristaux et processus de fabrication<\/h2>\n<p data-start=\"2139\" data-end=\"2286\">Les plaquettes de SiC sont g\u00e9n\u00e9ralement fabriqu\u00e9es \u00e0 l'aide de la m\u00e9thode de transport physique de vapeur (PVT), un proc\u00e9d\u00e9 industriel \u00e9prouv\u00e9 pour la croissance de cristaux de SiC en vrac.<\/p>\n<p data-start=\"2288\" data-end=\"2526\">Dans ce processus, la poudre de SiC de haute puret\u00e9 est sublim\u00e9e \u00e0 des temp\u00e9ratures sup\u00e9rieures \u00e0 2000\u00b0C. Les esp\u00e8ces en phase vapeur sont transport\u00e9es sous des gradients thermiques soigneusement contr\u00f4l\u00e9s. Les esp\u00e8ces en phase vapeur sont transport\u00e9es sous des gradients thermiques soigneusement contr\u00f4l\u00e9s et recristallis\u00e9es sur un cristal de d\u00e9part, formant une boule monocristalline.<\/p>\n<p data-start=\"2528\" data-end=\"2573\">Apr\u00e8s la croissance des cristaux, le mat\u00e9riau subit :<\/p>\n<ul data-start=\"2575\" data-end=\"2712\">\n<li data-section-id=\"1akaq77\" data-start=\"2575\" data-end=\"2608\">Tranchage de pr\u00e9cision en tranches<\/li>\n<li data-section-id=\"h9dpd3\" data-start=\"2609\" data-end=\"2637\">Fa\u00e7onnage des bords et rodage<\/li>\n<li data-section-id=\"lnoxjt\" data-start=\"2638\" data-end=\"2677\">Polissage m\u00e9canique chimique (CMP)<\/li>\n<li data-section-id=\"f7113h\" data-start=\"2678\" data-end=\"2712\">Nettoyage et inspection des d\u00e9fauts<\/li>\n<\/ul>\n<p data-start=\"2714\" data-end=\"2910\">Pour la fabrication des dispositifs, un processus suppl\u00e9mentaire de d\u00e9p\u00f4t chimique en phase vapeur (CVD) peut \u00eatre appliqu\u00e9 pour former des couches \u00e9pitaxiales de haute qualit\u00e9 avec une concentration de dopage et une \u00e9paisseur contr\u00f4l\u00e9es.<\/p>\n<h2 data-section-id=\"mu966k\" data-start=\"2917\" data-end=\"2932\">Applications<\/h2>\n<h3 data-section-id=\"nvblr7\" data-start=\"2934\" data-end=\"2963\">Dispositifs \u00e9lectroniques de puissance<\/h3>\n<ul data-start=\"2964\" data-end=\"3162\">\n<li data-section-id=\"weto8f\" data-start=\"2964\" data-end=\"3017\">MOSFETs SiC pour syst\u00e8mes de commutation \u00e0 haut rendement<\/li>\n<li data-section-id=\"11pxyfb\" data-start=\"3018\" data-end=\"3083\">Diodes \u00e0 barri\u00e8re Schottky (SBD) en SiC pour le redressement \u00e0 faibles pertes<\/li>\n<li data-section-id=\"iw3utm\" data-start=\"3084\" data-end=\"3120\">Convertisseurs de puissance DC-DC et AC-DC<\/li>\n<li data-section-id=\"x74fmu\" data-start=\"3121\" data-end=\"3162\">Variateurs de vitesse et variateurs de vitesse industriels<\/li>\n<\/ul>\n<h3 data-section-id=\"1htwq4x\" data-start=\"3164\" data-end=\"3204\">V\u00e9hicules \u00e9lectriques et syst\u00e8mes \u00e9nerg\u00e9tiques<\/h3>\n<ul data-start=\"3205\" data-end=\"3327\">\n<li data-section-id=\"1yymave\" data-start=\"3205\" data-end=\"3232\">Chargeurs embarqu\u00e9s (OBC)<\/li>\n<li data-section-id=\"1usbixy\" data-start=\"3233\" data-end=\"3255\">Onduleurs de traction<\/li>\n<li data-section-id=\"1it9wh\" data-start=\"3256\" data-end=\"3281\">Syst\u00e8mes de charge rapide<\/li>\n<li data-section-id=\"1j4nm5g\" data-start=\"3282\" data-end=\"3327\">Onduleurs pour \u00e9nergies renouvelables (solaire \/ \u00e9olien)<\/li>\n<\/ul>\n<h3 data-section-id=\"1g2wpq2\" data-start=\"3329\" data-end=\"3363\">Applications en environnement difficile<\/h3>\n<ul data-start=\"3364\" data-end=\"3503\">\n<li data-section-id=\"xrpubo\" data-start=\"3364\" data-end=\"3389\">\u00c9lectronique a\u00e9rospatiale<\/li>\n<li data-section-id=\"1kgg2fq\" data-start=\"3390\" data-end=\"3429\">Syst\u00e8mes industriels \u00e0 haute temp\u00e9rature<\/li>\n<li data-section-id=\"1idwz9d\" data-start=\"3430\" data-end=\"3467\">Exploration p\u00e9troli\u00e8re et gazi\u00e8re \u00e9lectronique<\/li>\n<li data-section-id=\"12vwqli\" data-start=\"3468\" data-end=\"3503\">\u00c9lectronique r\u00e9sistante aux rayonnements<\/li>\n<\/ul>\n<h3 data-section-id=\"1hkijl5\" data-start=\"3505\" data-end=\"3543\">Applications \u00e9mergentes au niveau du syst\u00e8me<\/h3>\n<ul data-start=\"3544\" data-end=\"3658\">\n<li data-section-id=\"12zrkc2\" data-start=\"3544\" data-end=\"3596\">Modules d'alimentation compacts pour syst\u00e8mes opto\u00e9lectroniques<\/li>\n<li data-section-id=\"wqq2vx\" data-start=\"3597\" data-end=\"3658\">Circuits de pilotage de micro-\u00e9crans (int\u00e9gration de la conception \u00e0 faible consommation d'\u00e9nergie)<\/li>\n<\/ul>\n<h2 data-section-id=\"1cgu054\" data-start=\"3665\" data-end=\"3692\">Sp\u00e9cifications techniques<\/h2>\n<h3 data-section-id=\"172ipod\" data-start=\"3694\" data-end=\"3737\">Tableau des sp\u00e9cifications des plaquettes 4H-SiC de 6 pouces<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"3739\" data-end=\"4525\">\n<thead data-start=\"3739\" data-end=\"3810\">\n<tr data-start=\"3739\" data-end=\"3810\">\n<th class=\"\" data-start=\"3739\" data-end=\"3750\" data-col-size=\"sm\">Propri\u00e9t\u00e9<\/th>\n<th class=\"\" data-start=\"3750\" data-end=\"3779\" data-col-size=\"sm\">Qualit\u00e9 Z (qualit\u00e9 de production)<\/th>\n<th class=\"\" data-start=\"3779\" data-end=\"3810\" data-col-size=\"sm\">Qualit\u00e9 D (qualit\u00e9 d'ing\u00e9nieur)<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"3884\" data-end=\"4525\">\n<tr data-start=\"3884\" data-end=\"3934\">\n<td data-start=\"3884\" data-end=\"3895\" data-col-size=\"sm\">Diam\u00e8tre<\/td>\n<td data-start=\"3895\" data-end=\"3914\" data-col-size=\"sm\">149,5 - 150,0 mm<\/td>\n<td data-start=\"3914\" data-end=\"3934\" data-col-size=\"sm\">149,5 - 150,0 mm<\/td>\n<\/tr>\n<tr data-start=\"3935\" data-end=\"3965\">\n<td data-start=\"3935\" data-end=\"3946\" data-col-size=\"sm\">Polytype<\/td>\n<td data-start=\"3946\" data-end=\"3955\" data-col-size=\"sm\">4H-SiC<\/td>\n<td data-start=\"3955\" data-end=\"3965\" data-col-size=\"sm\">4H-SiC<\/td>\n<\/tr>\n<tr data-start=\"3966\" data-end=\"4007\">\n<td data-start=\"3966\" data-end=\"3978\" data-col-size=\"sm\">\u00c9paisseur<\/td>\n<td data-start=\"3978\" data-end=\"3992\" data-col-size=\"sm\">350 \u00b1 15 \u00b5m<\/td>\n<td data-start=\"3992\" data-end=\"4007\" data-col-size=\"sm\">350 \u00b1 25 \u00b5m<\/td>\n<\/tr>\n<tr data-start=\"4008\" data-end=\"4047\">\n<td data-start=\"4008\" data-end=\"4028\" data-col-size=\"sm\">Type de conductivit\u00e9<\/td>\n<td data-start=\"4028\" data-end=\"4037\" data-col-size=\"sm\">Type N<\/td>\n<td data-start=\"4037\" data-end=\"4047\" data-col-size=\"sm\">Type N<\/td>\n<\/tr>\n<tr data-start=\"4048\" data-end=\"4124\">\n<td data-start=\"4048\" data-end=\"4065\" data-col-size=\"sm\">Angle hors axe<\/td>\n<td data-start=\"4065\" data-end=\"4094\" data-col-size=\"sm\">4.0\u00b0 vers  \u00b1 0.5\u00b0<\/td>\n<td data-start=\"4094\" data-end=\"4124\" data-col-size=\"sm\">4.0\u00b0 vers  \u00b1 0.5\u00b0<\/td>\n<\/tr>\n<tr data-start=\"4125\" data-end=\"4182\">\n<td data-start=\"4125\" data-end=\"4139\" data-col-size=\"sm\">R\u00e9sistivit\u00e9<\/td>\n<td data-start=\"4139\" data-end=\"4160\" data-col-size=\"sm\">0,015 - 0,024 \u03a9-cm<\/td>\n<td data-start=\"4160\" data-end=\"4182\" data-col-size=\"sm\">0,015 - 0,028 \u03a9-cm<\/td>\n<\/tr>\n<tr data-start=\"4183\" data-end=\"4229\">\n<td data-start=\"4183\" data-end=\"4203\" data-col-size=\"sm\">Densit\u00e9 des micro-tubes<\/td>\n<td data-start=\"4203\" data-end=\"4216\" data-col-size=\"sm\">\u2264 0,2 cm-\u00b2<\/td>\n<td data-start=\"4216\" data-end=\"4229\" data-col-size=\"sm\">\u2264 15 cm-\u00b2<\/td>\n<\/tr>\n<tr data-start=\"4230\" data-end=\"4274\">\n<td data-start=\"4230\" data-end=\"4255\" data-col-size=\"sm\">Rugosit\u00e9 de la surface (Ra)<\/td>\n<td data-start=\"4255\" data-end=\"4264\" data-col-size=\"sm\">\u2264 1 nm<\/td>\n<td data-start=\"4264\" data-end=\"4274\" data-col-size=\"sm\">\u2264 1 nm<\/td>\n<\/tr>\n<tr data-start=\"4275\" data-end=\"4314\">\n<td data-start=\"4275\" data-end=\"4291\" data-col-size=\"sm\">Rugosit\u00e9 CMP<\/td>\n<td data-start=\"4291\" data-end=\"4302\" data-col-size=\"sm\">\u2264 0,2 nm<\/td>\n<td data-start=\"4302\" data-end=\"4314\" data-col-size=\"sm\">\u2264 0,5 nm<\/td>\n<\/tr>\n<tr data-start=\"4315\" data-end=\"4342\">\n<td data-start=\"4315\" data-end=\"4321\" data-col-size=\"sm\">LTV<\/td>\n<td data-start=\"4321\" data-end=\"4332\" data-col-size=\"sm\">\u2264 2,5 \u00b5m<\/td>\n<td data-start=\"4332\" data-end=\"4342\" data-col-size=\"sm\">\u2264 5 \u00b5m<\/td>\n<\/tr>\n<tr data-start=\"4343\" data-end=\"4369\">\n<td data-start=\"4343\" data-end=\"4349\" data-col-size=\"sm\">TTV<\/td>\n<td data-start=\"4349\" data-end=\"4358\" data-col-size=\"sm\">\u2264 6 \u00b5m<\/td>\n<td data-start=\"4358\" data-end=\"4369\" data-col-size=\"sm\">\u2264 15 \u00b5m<\/td>\n<\/tr>\n<tr data-start=\"4370\" data-end=\"4397\">\n<td data-start=\"4370\" data-end=\"4376\" data-col-size=\"sm\">Arc<\/td>\n<td data-start=\"4376\" data-end=\"4386\" data-col-size=\"sm\">\u2264 25 \u00b5m<\/td>\n<td data-start=\"4386\" data-end=\"4397\" data-col-size=\"sm\">\u2264 40 \u00b5m<\/td>\n<\/tr>\n<tr data-start=\"4398\" data-end=\"4426\">\n<td data-start=\"4398\" data-end=\"4405\" data-col-size=\"sm\">Distorsion<\/td>\n<td data-start=\"4405\" data-end=\"4415\" data-col-size=\"sm\">\u2264 35 \u00b5m<\/td>\n<td data-start=\"4415\" data-end=\"4426\" data-col-size=\"sm\">\u2264 60 \u00b5m<\/td>\n<\/tr>\n<tr data-start=\"4427\" data-end=\"4459\">\n<td data-start=\"4427\" data-end=\"4444\" data-col-size=\"sm\">Exclusion des bords<\/td>\n<td data-start=\"4444\" data-end=\"4451\" data-col-size=\"sm\">3 mm<\/td>\n<td data-start=\"4451\" data-end=\"4459\" data-col-size=\"sm\">3 mm<\/td>\n<\/tr>\n<tr data-start=\"4460\" data-end=\"4525\">\n<td data-start=\"4460\" data-end=\"4472\" data-col-size=\"sm\">Emballage<\/td>\n<td data-start=\"4472\" data-end=\"4498\" data-col-size=\"sm\">Cassette \/ Plaque unique<\/td>\n<td data-start=\"4498\" data-end=\"4525\" data-col-size=\"sm\">Cassette \/ Plaque unique<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h2 data-section-id=\"1r0wkfr\" data-start=\"4532\" data-end=\"4563\"><img decoding=\"async\" class=\"alignright wp-image-2193 size-medium\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-300x300.webp\" alt=\"Plaquette de carbure de silicium 4H-N de 6 pouces\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-768x768.webp 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/6_inch_silicon_carbide_sic_wafer_for_ar_glasses_mos_sbd1.webp 800w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Contr\u00f4le de la qualit\u00e9 et inspection<\/h2>\n<p data-start=\"4565\" data-end=\"4684\">Pour garantir la coh\u00e9rence et la compatibilit\u00e9 des appareils, chaque plaquette est soumise \u00e0 des processus de contr\u00f4le de la qualit\u00e9 tr\u00e8s stricts :<\/p>\n<ul data-start=\"4686\" data-end=\"4997\">\n<li data-section-id=\"1458qbn\" data-start=\"4686\" data-end=\"4746\">Diffraction des rayons X (DRX) pour l'\u00e9valuation de la structure cristalline<\/li>\n<li data-section-id=\"18tpu9z\" data-start=\"4747\" data-end=\"4814\">Microscopie \u00e0 force atomique (AFM) pour la mesure de la rugosit\u00e9 de la surface<\/li>\n<li data-section-id=\"d0tbx4\" data-start=\"4815\" data-end=\"4882\">Cartographie de la photoluminescence (PL) pour l'analyse de la distribution des d\u00e9fauts<\/li>\n<li data-section-id=\"192mx5h\" data-start=\"4883\" data-end=\"4939\">Inspection optique sous illumination \u00e0 haute intensit\u00e9<\/li>\n<li data-section-id=\"nltw7\" data-start=\"4940\" data-end=\"4997\">Inspection g\u00e9om\u00e9trique (courbure, gauchissement, variation d'\u00e9paisseur)<\/li>\n<\/ul>\n<p data-start=\"4999\" data-end=\"5095\">Ces inspections garantissent la stabilit\u00e9 des plaquettes pour la croissance \u00e9pitaxiale en aval et la fabrication de dispositifs.<\/p>\n<h2 data-section-id=\"1344z7h\" data-start=\"5102\" data-end=\"5115\">Avantages<\/h2>\n<p data-start=\"5117\" data-end=\"5177\">La plate-forme de plaquettes de silicium de 6 pouces offre plusieurs avantages cl\u00e9s :<\/p>\n<ul data-start=\"5179\" data-end=\"5512\">\n<li data-section-id=\"158oj8v\" data-start=\"5179\" data-end=\"5233\">Taille de plaquette standard industrielle pour la production de masse<\/li>\n<li data-section-id=\"108qfmr\" data-start=\"5234\" data-end=\"5293\">R\u00e9duction du co\u00fbt par appareil gr\u00e2ce \u00e0 une meilleure utilisation des plaquettes de silicium<\/li>\n<li data-section-id=\"10czy6p\" data-start=\"5294\" data-end=\"5352\">Haute compatibilit\u00e9 avec les processus d'\u00e9pitaxie et de fabrication de dispositifs<\/li>\n<li data-section-id=\"1eclhbg\" data-start=\"5353\" data-end=\"5410\">Faible densit\u00e9 de d\u00e9fauts (optimis\u00e9e pour le rendement des dispositifs de puissance)<\/li>\n<li data-section-id=\"13oslub\" data-start=\"5411\" data-end=\"5456\">Performances \u00e9lectriques et thermiques stables<\/li>\n<li data-section-id=\"e2lef4\" data-start=\"5457\" data-end=\"5512\">Convient \u00e0 la fois \u00e0 la R&amp;D et \u00e0 la fabrication \u00e0 grande \u00e9chelle<\/li>\n<\/ul>\n<h2 data-section-id=\"rnyyeg\" data-start=\"5519\" data-end=\"5543\">Options de personnalisation<\/h2>\n<p data-start=\"5545\" data-end=\"5613\">Nous proposons une personnalisation flexible bas\u00e9e sur les exigences de l'application :<\/p>\n<ul data-start=\"5615\" data-end=\"5853\">\n<li data-section-id=\"1s9j489\" data-start=\"5615\" data-end=\"5654\">Substrats de type N \/ semi-isolants<\/li>\n<li data-section-id=\"1a5mkb2\" data-start=\"5655\" data-end=\"5690\">Concentration de dopant r\u00e9glable<\/li>\n<li data-section-id=\"1qkr4i0\" data-start=\"5691\" data-end=\"5717\">Angles hors axe personnalis\u00e9s<\/li>\n<li data-section-id=\"um3e5a\" data-start=\"5718\" data-end=\"5751\">Pr\u00e9paration de la surface Epi-ready<\/li>\n<li data-section-id=\"7su7ry\" data-start=\"5752\" data-end=\"5809\">Classement de la densit\u00e9 des d\u00e9fauts (qualit\u00e9 de recherche ou de production)<\/li>\n<li data-section-id=\"1rllfkp\" data-start=\"5810\" data-end=\"5853\">Personnalisation de l'\u00e9paisseur et de la r\u00e9sistivit\u00e9<\/li>\n<\/ul>\n<h2 data-section-id=\"11wdcdx\" data-start=\"71\" data-end=\"88\">FAQ<\/h2>\n<p data-start=\"90\" data-end=\"502\"><strong data-start=\"90\" data-end=\"162\">Q1 : Pourquoi le 4H-SiC est-il pr\u00e9f\u00e9r\u00e9 \u00e0 d'autres polytypes de SiC tels que le 6H-SiC ?<\/strong><br data-start=\"162\" data-end=\"165\" \/>Le 4H-SiC offre une mobilit\u00e9 \u00e9lectronique plus \u00e9lev\u00e9e et une r\u00e9sistance \u00e0 l'enclenchement plus faible que le 6H-SiC, ce qui le rend plus adapt\u00e9 aux applications de commutation \u00e0 haute fr\u00e9quence et \u00e0 haute puissance. Il offre \u00e9galement une meilleure stabilit\u00e9 des performances globales dans les dispositifs MOSFET et les diodes de puissance, ce qui explique qu'il soit devenu le polytype dominant dans l'\u00e9lectronique de puissance commerciale.<\/p>\n<p data-start=\"509\" data-end=\"872\"><strong data-start=\"509\" data-end=\"573\">Q2 : Quel est l'objectif de l'angle hors axe dans les plaquettes de SiC ?<\/strong><br data-start=\"573\" data-end=\"576\" \/>L'angle hors axe (typiquement 4\u00b0 vers ) est introduit pour am\u00e9liorer la qualit\u00e9 de la couche \u00e9pitaxiale pendant la croissance CVD. Il permet de supprimer les d\u00e9fauts de surface tels que le step bunching et favorise le mode de croissance par \u00e9tapes, ce qui se traduit par une meilleure uniformit\u00e9 cristalline et un rendement plus \u00e9lev\u00e9 des structures \u00e9pitaxiales.<\/p>\n<p data-start=\"879\" data-end=\"1229\"><strong data-start=\"879\" data-end=\"958\">Q3 : Quels sont les facteurs qui influencent le plus la qualit\u00e9 des plaquettes de SiC pour la fabrication d'appareils ?<\/strong><br data-start=\"958\" data-end=\"961\" \/>Les facteurs cl\u00e9s sont la densit\u00e9 des micropipes, les niveaux de dislocation du plan de base (BPD), la rugosit\u00e9 de la surface (Ra et qualit\u00e9 CMP) et l'inclinaison\/la d\u00e9formation de la plaquette. Parmi ces facteurs, la densit\u00e9 des d\u00e9fauts et la qualit\u00e9 de la surface ont l'impact le plus direct sur la fiabilit\u00e9 des MOSFET et les performances \u00e0 long terme des dispositifs.<\/p>\n<p data-start=\"6178\" data-end=\"6420\">","protected":false},"excerpt":{"rendered":"<p data-start=\"5875\" data-end=\"6176\">La plaquette de carbure de silicium 4H-N de 6 pouces est un mat\u00e9riau essentiel pour l'\u00e9lectronique de puissance moderne. Sa combinaison de propri\u00e9t\u00e9s de large bande interdite, de conductivit\u00e9 thermique \u00e9lev\u00e9e et de stabilit\u00e9 cristalline robuste le rend essentiel pour les syst\u00e8mes de conversion d'\u00e9nergie \u00e0 haut rendement et les dispositifs semi-conducteurs de la prochaine g\u00e9n\u00e9ration.<\/p>\n<p data-start=\"6178\" data-end=\"6420\">Avec le d\u00e9veloppement rapide des v\u00e9hicules \u00e9lectriques, des infrastructures d'\u00e9nergie renouvelable et de l'automatisation industrielle, les dispositifs \u00e0 base de SiC devraient continuer \u00e0 remplacer les technologies traditionnelles au silicium dans les applications \u00e0 haute puissance et \u00e0 haut rendement.<\/p>","protected":false},"featured_media":2192,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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