\n| Dimensions (L\u00d7P\u00d7H)<\/td>\n | 1450mm \u00d7 3380mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\") Pourquoi choisir la s\u00e9rie WG-1261 ?<\/span><\/h2>\n\n- Pr\u00e9cision et stabilit\u00e9 \u00e9lev\u00e9es : Les broches \u00e0 coussin d'air et les supports de plaquettes \u00e0 faible vibration garantissent un amincissement pr\u00e9cis pour les mat\u00e9riaux difficiles \u00e0 traiter.<\/li>\n
- Automatisation et efficacit\u00e9 : Les syst\u00e8mes d'installation automatique et de transfert\/nettoyage complet des wafers r\u00e9duisent les co\u00fbts de main-d'\u0153uvre et le temps d'installation.<\/li>\n
- Support de mat\u00e9riaux polyvalent : Prise en charge du SiC, du saphir, du quartz et des c\u00e9ramiques, offrant une flexibilit\u00e9 pour de multiples lignes de production.<\/li>\n
- Mesure int\u00e9gr\u00e9e et connectivit\u00e9 intelligente : La mesure d'\u00e9paisseur en ligne combin\u00e9e \u00e0 SECS\/GEM garantit la fiabilit\u00e9 du processus et l'int\u00e9gration de l'usine.<\/li>\n
- R\u00e9duction des co\u00fbts d'exploitation : L'optimisation de la conception et de l'utilisation des consommables permet de r\u00e9duire les d\u00e9chets de mat\u00e9riaux et d'am\u00e9liorer le rendement de la production.<\/li>\n<\/ol>\n
Foire aux questions (FAQ)<\/strong><\/span><\/h2>\n\n- Q : Quelles sont les tailles de plaquettes et les mat\u00e9riaux pris en charge par le WG-1261 ?<\/strong>
A :<\/strong> La machine prend en charge les plaquettes jusqu'\u00e0 12 pouces, y compris les mat\u00e9riaux SiC, saphir, quartz et c\u00e9ramique, offrant ainsi des options de traitement polyvalentes pour de multiples lignes de production.<\/li>\n- Q : Comment la fonction Autosetup am\u00e9liore-t-elle la productivit\u00e9 ?<\/strong>
A :<\/strong> L'Autosetup compl\u00e8te automatiquement le dressage des roues apr\u00e8s le remplacement, ce qui \u00e9limine les interventions manuelles, r\u00e9duit les erreurs de r\u00e9glage et permet d'\u00e9conomiser consid\u00e9rablement du temps de production.<\/li>\n- Q : Le WG-1261 permet-il un contr\u00f4le pr\u00e9cis de l'\u00e9paisseur de la plaquette ?<\/strong>
A :<\/strong> Oui, il est \u00e9quip\u00e9 d'une unit\u00e9 de mesure en ligne (0-1800\u03bcm) qui assure un suivi et un contr\u00f4le pr\u00e9cis de l'amincissement des plaquettes pendant le traitement.<\/li>\n- Q : Le WG-1261 peut-il \u00eatre int\u00e9gr\u00e9 dans les \"smart fabs\" ?<\/strong>
A :<\/strong> Absolument. La machine prend en charge Connectivit\u00e9 SECS\/GEM<\/strong>, L'objectif est de permettre une surveillance en temps r\u00e9el, la collecte de donn\u00e9es et l'int\u00e9gration dans des syst\u00e8mes de fabrication intelligents.<\/li>\n- Q : Comment le WG-1261 assure-t-il la stabilit\u00e9 du traitement des plaquettes pour les mat\u00e9riaux tr\u00e8s fins ?<\/strong>
A :<\/strong> Avec des broches \u00e0 coussin d'air de grande puissance, un support de plaquettes \u00e0 charge \u00e9lev\u00e9e et \u00e0 faible vibration, et un entra\u00eenement de broche encerclant \u00e0 haute rigidit\u00e9, le WG-1261 maintient une excellente stabilit\u00e9 du processus, m\u00eame pour les plaquettes de SiC et de saphir.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"La machine \u00e0 amincir les plaquettes enti\u00e8rement automatique de la s\u00e9rie WG-1261 est la solution parfaite pour le traitement moderne des plaquettes de semi-conducteurs et d'optique. Gr\u00e2ce \u00e0 sa haute pr\u00e9cision, \u00e0 son automatisation avanc\u00e9e et \u00e0 sa compatibilit\u00e9 multi-mat\u00e9riaux, elle permet un amincissement coh\u00e9rent, efficace et fiable des plaquettes de SiC, de saphir, de quartz et de c\u00e9ramique jusqu'\u00e0 12 pouces. Id\u00e9ale pour la R&D, la production pilote et les usines de taille moyenne \u00e0 grande, la s\u00e9rie WG-1261 garantit des rendements plus \u00e9lev\u00e9s, des co\u00fbts de main-d'\u0153uvre r\u00e9duits et une efficacit\u00e9 de production optimis\u00e9e.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\")
La s\u00e9rie WG-1261 est une machine d'amincissement de gaufrettes enti\u00e8rement automatique et de haute pr\u00e9cision, con\u00e7ue pour les gaufrettes SiC de 12 pouces et moins, ainsi que pour le saphir, le quartz et les mat\u00e9riaux c\u00e9ramiques. En tant que solution compl\u00e8te propos\u00e9e par un fournisseur d'\u00e9quipements pour semi-conducteurs de confiance, cette s\u00e9rie int\u00e8gre une technologie de broche avanc\u00e9e, des supports de plaquettes \u00e0 charge \u00e9lev\u00e9e et des fonctions d'automatisation pour garantir un amincissement stable, pr\u00e9cis et efficace des plaquettes.<\/p>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
Caract\u00e9ristiques techniques<\/span><\/h2>\n