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The WGP-1271C is a high-efficiency, fully automatic wafer thinning machine, specifically engineered to handle the challenges of large-diameter SiC substrates and device wafers. Designed with precision and productivity in mind, this advanced GGG three-spindle, four-station system ensures stable, consistent, and high-quality wafer thinning for both 8-inch SiC device wafers and 12-inch SiC substrates.<\/p>\n
Equipped with ultra-high torque spindles and a fourth-generation high-load wafer carrier, the WGP-1271C easily manages the complex and demanding process of thinning SiC, one of the most challenging semiconductor materials. With automation at its core, the machine integrates wafer transfer, cleaning, and grinding into a single streamlined workflow, significantly improving production efficiency while reducing human intervention.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-1-300x300.png\")
<\/span><\/h2>\nThe WGP-1271C is ideally suited for:<\/p>\n
Its ability to handle both device wafers and substrates makes it a versatile choice for facilities aiming to reduce downtime, increase yield, and lower overall operating costs.<\/p>\n
| Objet<\/th>\n | Sp\u00e9cifications<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Structure<\/td>\n | Spindle \u00d73 \/ Wafer Carrier \u00d74 \/ Worktable \u00d71 \/ Fully Automatic Transfer & Cleaning System \u00d71<\/td>\n<\/tr>\n |
| Spindle Power<\/td>\n | 11 kW<\/td>\n<\/tr>\n |
| Grinding Diameter<\/td>\n | \u03c66″, \u03c68″, \u03c612″<\/td>\n<\/tr>\n |
| Dimensions (W\u00d7D\u00d7H)<\/td>\n | 1900mm \u00d7 3530mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Foire aux questions (FAQ)<\/strong><\/span><\/h2>\nA :<\/strong> The machine supports \u03c66″, \u03c68″, and \u03c612″ wafers, including both 8-inch SiC device wafers and 12-inch SiC substrates, providing flexibility for different production needs.<\/li>\n A :<\/strong> Autosetup automatically performs wheel dressing after replacement, eliminating manual intervention, reducing setup errors, and saving valuable production time.<\/li>\n A :<\/strong> Yes, with ultra-high torque spindles and a fourth-generation high-load wafer carrier, the machine ensures stable thinning even for hard-to-process SiC wafers, minimizing stress and defects.<\/li>\n A :<\/strong> Absolutely. Its fully automated transfer and cleaning system, combined with high-precision spindles, makes it ideal for both research development and large-scale manufacturing.<\/li>\n A :<\/strong> The machine offers optimized consumable configurations and high process efficiency, reducing material waste and labor costs while maintaining high throughput and consistent wafer quality.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" The WGP-1271C Fully Automatic Wafer Thinning Machine is the ultimate solution for modern SiC wafer processing. By combining precision engineering, high automation, and versatile compatibility, it addresses the challenges of thinning large SiC substrates and device wafers efficiently and reliably. Whether for high-volume production or research development, WGP-1271C ensures consistent results, improved yield, and lower operational costs, making it an indispensable asset for semiconductor manufacturing facilities.<\/p>","protected":false},"featured_media":2132,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Why Choose WGP-1271C?<\/span><\/h2>\n