\n| Dimensions (L\u00d7P\u00d7H)<\/td>\n | 1900mm \u00d7 3530mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\") Pourquoi choisir WGP-1271C ?<\/span><\/h2>\n\n- Efficacit\u00e9 et productivit\u00e9 \u00e9lev\u00e9es : La configuration \u00e0 trois broches et quatre stations r\u00e9duit la dur\u00e9e du cycle de traitement tout en maintenant une production de haute qualit\u00e9.<\/li>\n
- Pr\u00e9cision d'amincissement sup\u00e9rieure : Le porte-gaufrettes de quatri\u00e8me g\u00e9n\u00e9ration et les broches \u00e0 couple tr\u00e8s \u00e9lev\u00e9 garantissent une \u00e9paisseur et une uniformit\u00e9 pr\u00e9cises des gaufrettes.<\/li>\n
- Intervention humaine r\u00e9duite : L'installation automatique et le syst\u00e8me de transfert\/nettoyage enti\u00e8rement automatis\u00e9 r\u00e9duisent les besoins en main-d'\u0153uvre et les erreurs d'installation.<\/li>\n
- Adaptable \u00e0 divers processus : La compatibilit\u00e9 de divers consommables permet d'optimiser les tailles de plaquettes et les mat\u00e9riaux, r\u00e9pondant ainsi aux besoins uniques de la fabrication moderne de SiC.<\/li>\n
- Faibles co\u00fbts d'exploitation : La conception optimis\u00e9e du processus et l'utilisation efficace des consommables permettent de r\u00e9duire les co\u00fbts d'exploitation sans compromettre le rendement.<\/li>\n
- Une production \u00e0 l'\u00e9preuve du temps : Con\u00e7ue pour accueillir des plaquettes plus grandes et des dispositifs SiC de la prochaine g\u00e9n\u00e9ration, elle permet l'expansion de l'installation et les mises \u00e0 niveau technologiques.<\/li>\n<\/ol>\n
Foire aux questions (FAQ)<\/strong><\/span><\/h2>\n\n- Q : Quelles tailles de plaquettes le WGP-1271C peut-il prendre en charge ?<\/strong>
A :<\/strong> La machine prend en charge les plaquettes \u03c66\u2033, \u03c68\u2033 et \u03c612\u2033, y compris les plaquettes de dispositifs SiC de 8 pouces et les substrats SiC de 12 pouces, ce qui permet de r\u00e9pondre \u00e0 diff\u00e9rents besoins de production.<\/li>\n- Q : Comment la fonction Autosetup am\u00e9liore-t-elle l'efficacit\u00e9 de la production ?<\/strong>
A :<\/strong> L'Autosetup effectue automatiquement le dressage des roues apr\u00e8s leur remplacement, ce qui \u00e9limine les interventions manuelles, r\u00e9duit les erreurs de r\u00e9glage et fait gagner un temps pr\u00e9cieux \u00e0 la production.<\/li>\n- Q : Le WGP-1271C peut-il traiter des plaquettes de SiC tr\u00e8s fines sans se fissurer ?<\/strong>
A :<\/strong> En effet, gr\u00e2ce \u00e0 des broches \u00e0 couple tr\u00e8s \u00e9lev\u00e9 et \u00e0 un support de plaquettes \u00e0 charge \u00e9lev\u00e9e de quatri\u00e8me g\u00e9n\u00e9ration, la machine garantit un amincissement stable, m\u00eame pour les plaquettes de SiC difficiles \u00e0 traiter, ce qui minimise les contraintes et les d\u00e9fauts.<\/li>\n- Q : La machine convient-elle \u00e0 la fois aux environnements de R&D et de production de masse ?<\/strong>
A :<\/strong> Absolument. Son syst\u00e8me de transfert et de nettoyage enti\u00e8rement automatis\u00e9, associ\u00e9 \u00e0 des broches de haute pr\u00e9cision, en fait un outil id\u00e9al pour le d\u00e9veloppement de la recherche et la fabrication \u00e0 grande \u00e9chelle.<\/li>\n- Q : Comment le WGP-1271C r\u00e9duit-il les co\u00fbts d'exploitation ?<\/strong>
A :<\/strong> La machine offre des configurations de consommables optimis\u00e9es et une grande efficacit\u00e9 du processus, r\u00e9duisant les d\u00e9chets de mat\u00e9riaux et les co\u00fbts de main-d'\u0153uvre tout en maintenant un d\u00e9bit \u00e9lev\u00e9 et une qualit\u00e9 constante des gaufrettes.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"La machine d'amincissement de plaquettes enti\u00e8rement automatique WGP-1271C est la solution ultime pour le traitement moderne des plaquettes de SiC. En combinant une ing\u00e9nierie de pr\u00e9cision, une automatisation pouss\u00e9e et une compatibilit\u00e9 polyvalente, elle rel\u00e8ve les d\u00e9fis de l'amincissement des substrats SiC de grande taille et des plaquettes de dispositifs de mani\u00e8re efficace et fiable. Qu'il s'agisse de production en grande quantit\u00e9 ou de d\u00e9veloppement de la recherche, la WGP-1271C garantit des r\u00e9sultats constants, un rendement am\u00e9lior\u00e9 et des co\u00fbts d'exploitation r\u00e9duits, ce qui en fait un atout indispensable pour les installations de fabrication de semi-conducteurs.<\/p>","protected":false},"featured_media":2132,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
La WGP-1271C est une machine d'amincissement de gaufrettes enti\u00e8rement automatique et \u00e0 haut rendement, sp\u00e9cialement con\u00e7ue pour relever les d\u00e9fis pos\u00e9s par les substrats SiC de grand diam\u00e8tre et les gaufrettes de dispositifs. Con\u00e7u dans un souci de pr\u00e9cision et de productivit\u00e9, ce syst\u00e8me GGG avanc\u00e9 \u00e0 trois broches et quatre stations garantit un amincissement stable, coh\u00e9rent et de haute qualit\u00e9 des wafers SiC de 8 pouces et des substrats SiC de 12 pouces.<\/p>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-1-300x300.png\")
<\/span><\/h2>\n