{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fr\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"Machine de collage de plaquettes semi-automatique \u00e0 temp\u00e9rature ambiante pour le traitement de plaquettes de 2 \u00e0 12 pouces"},"content":{"rendered":"

\"\"La machine semi-automatique de collage de plaquettes \u00e0 temp\u00e9rature ambiante est un syst\u00e8me de haute pr\u00e9cision pour le collage au niveau des plaquettes et des puces. En combinant la pression m\u00e9canique et la technologie d'activation de surface in situ, elle permet un collage permanent \u00e0 temp\u00e9rature ambiante (20-30\u00b0C) sans adh\u00e9sif ni traitement \u00e0 haute temp\u00e9rature. Les contraintes thermiques et la d\u00e9formation des mat\u00e9riaux sont ainsi r\u00e9duites au minimum, ce qui en fait un outil id\u00e9al pour les mat\u00e9riaux sensibles \u00e0 la chaleur et h\u00e9t\u00e9rog\u00e8nes. La machine prend en charge des plaquettes de 2 \u00e0 12 pouces et convient \u00e0 la recherche, \u00e0 la production pilote et \u00e0 la fabrication \u00e0 petite et moyenne \u00e9chelle.<\/p>\n

\"\"Caract\u00e9ristiques principales<\/strong><\/h2>\n
    \n
  1. Collage \u00e0 temp\u00e9rature ambiante<\/strong> - Fonctionne \u00e0 25 \u00b1 5\u00b0C pour \u00e9viter les d\u00e9calages thermiques et le gauchissement des plaquettes.<\/li>\n
  2. Activation de la surface<\/strong> - L'activation par plasma ou chimique am\u00e9liore la r\u00e9sistance du collage ; la pulv\u00e9risation cathodique optionnelle am\u00e9liore la qualit\u00e9 de l'interface.<\/li>\n
  3. Alignement de haute pr\u00e9cision<\/strong> - Syst\u00e8me d'alignement visuel et plateforme de mouvement de pr\u00e9cision avec une pr\u00e9cision de \u00b10,5 \u03bcm.<\/li>\n
  4. Large compatibilit\u00e9 avec les mat\u00e9riaux<\/strong> - Supporte Si, SiC, GaAs, GaN, InP, saphir, verre, LiNbO\u2083, LiTaO\u2083, diamant et certains polym\u00e8res.<\/li>\n
  5. Fonctionnement semi-automatique<\/strong> - Chargement manuel des wafers avec processus de collage automatis\u00e9 ; recettes programmables pour des r\u00e9sultats reproductibles.<\/li>\n
  6. Environnement propre et stable<\/strong> - Le syst\u00e8me de nettoyage int\u00e9gr\u00e9 de classe 100 garantit une faible contamination et un taux de vide de l'interface <0,1%.<\/li>\n<\/ol>\n

    Sp\u00e9cifications techniques<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Param\u00e8tres<\/th>\nSp\u00e9cifications<\/th>\n<\/tr>\n<\/thead>\n
    Taille de la plaquette<\/td>\n2\u2033 - 12\u2033, compatible avec les \u00e9chantillons irr\u00e9guliers<\/td>\n<\/tr>\n
    Temp\u00e9rature de collage<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Pression maximale<\/td>\n80 kN<\/td>\n<\/tr>\n
    Contr\u00f4le de la pression<\/td>\n0-5000 N r\u00e9glable, r\u00e9solution \u00b11 N<\/td>\n<\/tr>\n
    Pr\u00e9cision de l'alignement<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Force d'adh\u00e9rence<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Traitement de surface<\/td>\nActivation in situ + d\u00e9p\u00f4t par pulv\u00e9risation cathodique<\/td>\n<\/tr>\n
    Mode d'alimentation<\/td>\nManuel<\/td>\n<\/tr>\n
    Niveau de propret\u00e9<\/td>\nClasse 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Technologie de base<\/strong><\/h2>\n
      \n
    1. Collage direct \u00e0 temp\u00e9rature ambiante<\/strong> - Les surfaces activ\u00e9es entrent en contact sous une pression contr\u00f4l\u00e9e et forment des liaisons stables sans recuit thermique.<\/li>\n
    2. Activation de la surface<\/strong> - Augmente l'\u00e9nergie de surface, \u00e9limine les contaminants et am\u00e9liore l'uniformit\u00e9 du collage entre les mat\u00e9riaux.<\/li>\n<\/ol>\n

      \"\"Applications<\/strong><\/h2>\n
        \n
      1. Conditionnement avanc\u00e9 des semi-conducteurs<\/strong> - Empilage de circuits int\u00e9gr\u00e9s en 3D, collage de TSV, int\u00e9gration h\u00e9t\u00e9rog\u00e8ne de puces logiques et de m\u00e9moires.<\/li>\n
      2. Fabrication de MEMS<\/strong> - Emballage sous vide au niveau de la plaquette pour les capteurs tels que les acc\u00e9l\u00e9rom\u00e8tres et les gyroscopes.<\/li>\n
      3. Opto\u00e9lectronique et \u00e9crans<\/strong> - Collage de LED, collage de substrats en saphir et en verre, assemblage de modules optiques AR\/VR.<\/li>\n
      4. Microfluidique et biopuces<\/strong> - PDMS et verre tout en pr\u00e9servant l'activit\u00e9 biologique.<\/li>\n
      5. Recherche et dispositifs \u00e9mergents<\/strong> - \u00c9lectronique flexible, dispositifs quantiques et int\u00e9gration de mat\u00e9riaux h\u00e9t\u00e9rog\u00e8nes.<\/li>\n<\/ol>\n

        Service et soutien<\/strong><\/h2>\n
          \n
        1. D\u00e9veloppement des processus<\/strong> - Optimisation des param\u00e8tres de liaison et solutions d'activation de surface pour diff\u00e9rents mat\u00e9riaux.<\/li>\n
        2. Personnalisation de l'\u00e9quipement<\/strong> - Modules d'alignement de haute pr\u00e9cision, chambres \u00e0 vide ou \u00e0 atmosph\u00e8re contr\u00f4l\u00e9e.<\/li>\n
        3. Formation technique<\/strong> - Orientation des op\u00e9rations sur site et d\u00e9bogage des processus.<\/li>\n
        4. Support apr\u00e8s-vente<\/strong> - Garantie de 12 mois, remplacement rapide des composants cl\u00e9s, diagnostics \u00e0 distance et mises \u00e0 jour logicielles.<\/li>\n<\/ol>\n

          FAQ<\/h2>\n

          Q : Quel est le principal avantage du collage \u00e0 temp\u00e9rature ambiante ?
          R : Il \u00e9limine les contraintes thermiques et permet un collage fiable des mat\u00e9riaux sensibles \u00e0 la chaleur et h\u00e9t\u00e9rog\u00e8nes.<\/p>\n

          Q : Quels sont les mat\u00e9riaux qui peuvent \u00eatre coll\u00e9s ?
          A : Silicium, carbure de silicium, nitrure de gallium, ars\u00e9niure de gallium, phosphure d'indium, saphir, verre, niobate de lithium, diamant et certains polym\u00e8res.<\/p>","protected":false},"excerpt":{"rendered":"

          La machine semi-automatique de collage de plaquettes \u00e0 temp\u00e9rature ambiante est un syst\u00e8me de haute pr\u00e9cision pour le collage au niveau des plaquettes et des puces. En combinant la pression m\u00e9canique et la technologie d'activation de surface in situ, elle permet un collage permanent \u00e0 temp\u00e9rature ambiante (20-30\u00b0C) sans adh\u00e9sif ni traitement \u00e0 haute temp\u00e9rature.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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