{"id":2354,"date":"2026-04-22T06:34:59","date_gmt":"2026-04-22T06:34:59","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2354"},"modified":"2026-04-22T07:16:34","modified_gmt":"2026-04-22T07:16:34","slug":"ai300-medium-beam-high-temperature-ion-implantation-system-for-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fi\/product\/ai300-medium-beam-high-temperature-ion-implantation-system-for-12-inch-wafer-processing\/","title":{"rendered":"Ai300 (keskis\u00e4de) korkean l\u00e4mp\u00f6tilan ioni-implantointij\u00e4rjestelm\u00e4 12 tuuman kiekkojen k\u00e4sittelyyn"},"content":{"rendered":"<p data-start=\"228\" data-end=\"538\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignright wp-image-2357 size-medium\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-300x300.png\" alt=\"Ai300 (keskis\u00e4de) korkean l\u00e4mp\u00f6tilan ioni-implantointij\u00e4rjestelm\u00e4 12 tuuman kiekkojen k\u00e4sittelyyn\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/AI300.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Ai300 (Medium Beam) -korkean l\u00e4mp\u00f6tilan ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 12 tuuman piikiekkojen puolijohteiden valmistuslinjoille. Se on keskivirtainen ioni-implantointilaite, joka on kehitetty kehittyneisiin dopingprosesseihin sek\u00e4 piipohjaisissa ett\u00e4 laajakaistaisten puolijohteiden sovelluksissa, mukaan lukien SiC-prosessilinjat.<\/p>\n<p data-start=\"540\" data-end=\"872\">J\u00e4rjestelm\u00e4 tukee energia-aluetta 5 keV:st\u00e4 300 keV:iin, mik\u00e4 mahdollistaa joustavan implantaation matalista liitosmuodostuksista syviin doping-sovelluksiin. J\u00e4rjestelm\u00e4ss\u00e4 on korkeassa l\u00e4mp\u00f6tilassa l\u00e4mmitett\u00e4v\u00e4 kiekkovaihe, jonka maksimil\u00e4mp\u00f6tila on jopa 400 \u00b0C, mik\u00e4 mahdollistaa dopingaineiden paremman aktivoitumisen ja v\u00e4hent\u00e4\u00e4 ristikkovaurioita implantaation aikana.<\/p>\n<p data-start=\"874\" data-end=\"1076\">Vakaan s\u00e4teen suorituskyvyn, eritt\u00e4in tarkan ohjauksen ja yhteensopivuuden laajamittaisten integroitujen piirien prosessien kanssa ansiosta Ai300-j\u00e4rjestelm\u00e4 soveltuu kehittyneisiin puolijohdevalmistusymp\u00e4rist\u00f6ihin.<\/p>\n<hr data-start=\"1078\" data-end=\"1081\" \/>\n<h2 data-section-id=\"1d7mrtu\" data-start=\"1083\" data-end=\"1094\">Ominaisuudet<\/h2>\n<h3 data-section-id=\"1oge1av\" data-start=\"1096\" data-end=\"1135\">Korkean l\u00e4mp\u00f6tilan implantointikyky<\/h3>\n<p data-start=\"1136\" data-end=\"1272\">Varustettu l\u00e4mmitetyll\u00e4 kiekkovaiheella, joka tukee jopa 400 \u00b0C:n l\u00e4mp\u00f6tiloja, mik\u00e4 parantaa implantaation laatua ja dopingaineiden aktivoinnin tehokkuutta.<\/p>\n<h3 data-section-id=\"ox5pwk\" data-start=\"1274\" data-end=\"1295\">Laaja energia-alue<\/h3>\n<p data-start=\"1296\" data-end=\"1407\">Energia-alue 5-300 keV tukee sek\u00e4 matalia ett\u00e4 syvi\u00e4 implantaatioprosesseja kehittyneit\u00e4 laiterakenteita varten.<\/p>\n<h3 data-section-id=\"1czdwpe\" data-start=\"1409\" data-end=\"1440\">Korkean tarkkuuden s\u00e4teen ohjaus<\/h3>\n<p data-start=\"1441\" data-end=\"1574\">Tarjoaa eritt\u00e4in tarkan istutuksen, jonka kulmatarkkuus on \u2264 0,1\u00b0, s\u00e4teen yhdensuuntaisuus \u2264 0,1\u00b0, tasaisuus \u2264 0,5% ja toistettavuus \u2264 0,5%.<\/p>\n<h3 data-section-id=\"1q1uyu2\" data-start=\"1576\" data-end=\"1607\">Suuri l\u00e4pimenosuorituskyky<\/h3>\n<p data-start=\"1608\" data-end=\"1710\">Tukee jopa \u2265 500 kiekon l\u00e4pimenoa tunnissa, mik\u00e4 soveltuu suuren volyymin puolijohdevalmistukseen.<\/p>\n<h3 data-section-id=\"1h8myql\" data-start=\"1712\" data-end=\"1746\">Kehittynyt ionil\u00e4hdekapasiteetti<\/h3>\n<p data-start=\"1747\" data-end=\"1869\">Tukee useita implantoituja elementtej\u00e4, kuten C, B, P, N, He ja Ar, ja t\u00e4ytt\u00e4\u00e4 erilaiset puolijohdeprosessien vaatimukset.<\/p>\n<h3 data-section-id=\"1bq068l\" data-start=\"1871\" data-end=\"1900\">LSI-prosessin yhteensopivuus<\/h3>\n<p data-start=\"1901\" data-end=\"2010\">T\u00e4ysin yhteensopiva laajamittaisten integroitujen piirien valmistusprosessien ja kehittyneen laitevalmistuksen kanssa.<\/p>\n<p data-start=\"1901\" data-end=\"2010\"><img decoding=\"async\" class=\"alignnone size-medium wp-image-2368\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Annular-Implantation-1-267x300.webp\" alt=\"\" width=\"267\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Annular-Implantation-1-267x300.webp 267w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Annular-Implantation-1-11x12.webp 11w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Annular-Implantation-1.webp 462w\" sizes=\"(max-width: 267px) 100vw, 267px\" \/> <img decoding=\"async\" class=\"alignnone size-medium wp-image-2369\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Quadrant-Implantation-1-291x300.webp\" alt=\"\" width=\"291\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Quadrant-Implantation-1-291x300.webp 291w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Quadrant-Implantation-1-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Quadrant-Implantation-1.webp 499w\" sizes=\"(max-width: 291px) 100vw, 291px\" \/><\/p>\n<hr data-start=\"2012\" data-end=\"2015\" \/>\n<h2 data-section-id=\"rkota4\" data-start=\"2017\" data-end=\"2038\">T\u00e4rkeimm\u00e4t tekniset tiedot<\/h2>\n<h3 data-section-id=\"rc5knr\" data-start=\"2040\" data-end=\"2062\">Prosessin parametrit<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2064\" data-end=\"2246\">\n<thead data-start=\"2064\" data-end=\"2088\">\n<tr data-start=\"2064\" data-end=\"2088\">\n<th class=\"\" data-start=\"2064\" data-end=\"2071\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2071\" data-end=\"2088\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2113\" data-end=\"2246\">\n<tr data-start=\"2113\" data-end=\"2137\">\n<td data-start=\"2113\" data-end=\"2126\" data-col-size=\"sm\">Kiekon koko<\/td>\n<td data-col-size=\"sm\" data-start=\"2126\" data-end=\"2137\">12 tuumaa<\/td>\n<\/tr>\n<tr data-start=\"2138\" data-end=\"2166\">\n<td data-start=\"2138\" data-end=\"2153\" data-col-size=\"sm\">Energia-alue<\/td>\n<td data-col-size=\"sm\" data-start=\"2153\" data-end=\"2166\">5-300 keV<\/td>\n<\/tr>\n<tr data-start=\"2167\" data-end=\"2210\">\n<td data-start=\"2167\" data-end=\"2188\" data-col-size=\"sm\">Implantoidut elementit<\/td>\n<td data-col-size=\"sm\" data-start=\"2188\" data-end=\"2210\">C, B, P, N, N, He, Ar<\/td>\n<\/tr>\n<tr data-start=\"2211\" data-end=\"2246\">\n<td data-start=\"2211\" data-end=\"2224\" data-col-size=\"sm\">Annosalue<\/td>\n<td data-col-size=\"sm\" data-start=\"2224\" data-end=\"2246\">1E11-1E16 ioneja\/cm\u00b2<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"h0mtjp\" data-start=\"2253\" data-end=\"2273\">Palkin suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2275\" data-end=\"2429\">\n<thead data-start=\"2275\" data-end=\"2299\">\n<tr data-start=\"2275\" data-end=\"2299\">\n<th class=\"\" data-start=\"2275\" data-end=\"2282\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2282\" data-end=\"2299\" data-col-size=\"md\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2324\" data-end=\"2429\">\n<tr data-start=\"2324\" data-end=\"2399\">\n<td data-start=\"2324\" data-end=\"2341\" data-col-size=\"sm\">Palkin vakaus<\/td>\n<td data-col-size=\"md\" data-start=\"2341\" data-end=\"2399\">\u2264 10% \/ tunti (\u22641 s\u00e4dekatkos tai valokaari tunnissa)<\/td>\n<\/tr>\n<tr data-start=\"2400\" data-end=\"2429\">\n<td data-start=\"2400\" data-end=\"2419\" data-col-size=\"sm\">Palkin rinnakkaisuus<\/td>\n<td data-col-size=\"md\" data-start=\"2419\" data-end=\"2429\">\u2264 0.1\u00b0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"ieoahx\" data-start=\"2436\" data-end=\"2461\">Istutuksen tarkkuus<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2463\" data-end=\"2653\">\n<thead data-start=\"2463\" data-end=\"2487\">\n<tr data-start=\"2463\" data-end=\"2487\">\n<th class=\"\" data-start=\"2463\" data-end=\"2470\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2470\" data-end=\"2487\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2512\" data-end=\"2653\">\n<tr data-start=\"2512\" data-end=\"2544\">\n<td data-start=\"2512\" data-end=\"2534\" data-col-size=\"sm\">Implantin kulma-alue<\/td>\n<td data-col-size=\"sm\" data-start=\"2534\" data-end=\"2544\">0\u00b0-45\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2545\" data-end=\"2572\">\n<td data-start=\"2545\" data-end=\"2562\" data-col-size=\"sm\">Kulman tarkkuus<\/td>\n<td data-col-size=\"sm\" data-start=\"2562\" data-end=\"2572\">\u2264 0.1\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2573\" data-end=\"2621\">\n<td data-start=\"2573\" data-end=\"2591\" data-col-size=\"sm\">Tasaisuus (1\u03c3)<\/td>\n<td data-col-size=\"sm\" data-start=\"2591\" data-end=\"2621\">\u2264 0,5% (P+, 1E14, 100 keV)<\/td>\n<\/tr>\n<tr data-start=\"2622\" data-end=\"2653\">\n<td data-start=\"2622\" data-end=\"2643\" data-col-size=\"sm\">Toistettavuus (1\u03c3)<\/td>\n<td data-col-size=\"sm\" data-start=\"2643\" data-end=\"2653\">\u2264 0,5%<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"1i84h7f\" data-start=\"2660\" data-end=\"2682\">J\u00e4rjestelm\u00e4n suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2684\" data-end=\"3000\">\n<thead data-start=\"2684\" data-end=\"2708\">\n<tr data-start=\"2684\" data-end=\"2708\">\n<th class=\"\" data-start=\"2684\" data-end=\"2691\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2691\" data-end=\"2708\" data-col-size=\"md\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2733\" data-end=\"3000\">\n<tr data-start=\"2733\" data-end=\"2771\">\n<td data-start=\"2733\" data-end=\"2746\" data-col-size=\"sm\">L\u00e4p\u00e4isykyky<\/td>\n<td data-col-size=\"md\" data-start=\"2746\" data-end=\"2771\">\u2265 500 kiekkoa tunnissa<\/td>\n<\/tr>\n<tr data-start=\"2772\" data-end=\"2811\">\n<td data-start=\"2772\" data-end=\"2802\" data-col-size=\"sm\">Implantin enimm\u00e4isl\u00e4mp\u00f6tila<\/td>\n<td data-col-size=\"md\" data-start=\"2802\" data-end=\"2811\">400\u00b0C<\/td>\n<\/tr>\n<tr data-start=\"2812\" data-end=\"2854\">\n<td data-start=\"2812\" data-end=\"2829\" data-col-size=\"sm\">Laitteen koko<\/td>\n<td data-col-size=\"md\" data-start=\"2829\" data-end=\"2854\">6400 \u00d7 3640 \u00d7 3100 mm<\/td>\n<\/tr>\n<tr data-start=\"2855\" data-end=\"2883\">\n<td data-start=\"2855\" data-end=\"2870\" data-col-size=\"sm\">Tyhji\u00f6taso<\/td>\n<td data-col-size=\"md\" data-start=\"2870\" data-end=\"2883\">5E-7 Torr<\/td>\n<\/tr>\n<tr data-start=\"2884\" data-end=\"2915\">\n<td data-start=\"2884\" data-end=\"2900\" data-col-size=\"sm\">R\u00f6ntgens\u00e4teilyvuoto<\/td>\n<td data-col-size=\"md\" data-start=\"2900\" data-end=\"2915\">\u2264 0,3 \u03bcSv\/h<\/td>\n<\/tr>\n<tr data-start=\"2916\" data-end=\"3000\">\n<td data-start=\"2916\" data-end=\"2932\" data-col-size=\"sm\">Skannaustila<\/td>\n<td data-col-size=\"md\" data-start=\"2932\" data-end=\"3000\">Vaakasuora s\u00e4hk\u00f6staattinen skannaus + pystysuora mekaaninen skannaus<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"3002\" data-end=\"3005\" \/>\n<h2 data-section-id=\"1nd7jny\" data-start=\"3007\" data-end=\"3028\">Sovelluskent\u00e4t<\/h2>\n<h3 data-section-id=\"1xxdh4v\" data-start=\"3030\" data-end=\"3062\">SiC-puolijohteiden k\u00e4sittely<\/h3>\n<p data-start=\"3063\" data-end=\"3194\">K\u00e4ytet\u00e4\u00e4n piikarbidilaitteiden valmistuksessa tukemaan korkean l\u00e4mp\u00f6tilan implantaatioprosesseja, joita tarvitaan laajan kaistanleveyden materiaaleissa.<\/p>\n<h3 data-section-id=\"kkfbvw\" data-start=\"3196\" data-end=\"3241\">Piipohjainen puolijohteiden valmistus<\/h3>\n<p data-start=\"3242\" data-end=\"3348\">Soveltuu 12 tuuman piikiekkojen tuotantolinjoihin CMOS- ja kehittyneiden integroitujen piirien valmistukseen.<\/p>\n<h3 data-section-id=\"c3blgn\" data-start=\"3350\" data-end=\"3393\">Korkean l\u00e4mp\u00f6tilan istutusprosessit<\/h3>\n<p data-start=\"3394\" data-end=\"3511\">Tukee implantointiprosesseja, jotka edellytt\u00e4v\u00e4t kohonnutta kiekon l\u00e4mp\u00f6tilaa vikojen v\u00e4hent\u00e4miseksi ja dopingaineiden aktivoinnin parantamiseksi.<\/p>\n<h3 data-section-id=\"2m28ht\" data-start=\"3513\" data-end=\"3541\">Teholaitteen valmistus<\/h3>\n<p data-start=\"3542\" data-end=\"3646\">Soveltuu tehopuolijohdekomponentteihin, joissa tarvitaan tarkkaa seostusta ja suuren energian implantointia.<\/p>\n<h3 data-section-id=\"10yv1en\" data-start=\"3648\" data-end=\"3690\">Kehittynyt integroitujen piirien tuotanto<\/h3>\n<p data-start=\"3691\" data-end=\"3777\">Tukee LSI-prosessien integrointia korkean tarkkuuden ja suuren l\u00e4pimenon vaatimuksilla.<\/p>\n<hr data-start=\"3779\" data-end=\"3782\" \/>\n<h2 data-section-id=\"1r8frcv\" data-start=\"3784\" data-end=\"3813\">Usein kysytyt kysymykset<\/h2>\n<h3 data-section-id=\"hl3b9g\" data-start=\"3815\" data-end=\"3867\">1. Mit\u00e4 kiekkokokoa Ai300-j\u00e4rjestelm\u00e4 tukee?<\/h3>\n<p data-start=\"3868\" data-end=\"3981\">J\u00e4rjestelm\u00e4 on suunniteltu 12-tuumaisille piikiekkoille, ja se soveltuu kehittyneisiin puolijohteiden valmistuslinjoihin.<\/p>\n<h3 data-section-id=\"gygi37\" data-start=\"3983\" data-end=\"4063\">2. Mik\u00e4 on korkean l\u00e4mp\u00f6tilan implantointikyvyn keskeinen etu?<\/h3>\n<p data-start=\"4064\" data-end=\"4211\">J\u00e4rjestelm\u00e4 tukee implantointia jopa 400 \u00b0C:n l\u00e4mp\u00f6tilaan asti, mik\u00e4 auttaa v\u00e4hent\u00e4m\u00e4\u00e4n ristikkovaurioita, parantamaan dopingaineiden aktivoitumista ja parantamaan laitteen yleist\u00e4 suorituskyky\u00e4.<\/p>\n<h3 data-section-id=\"13ypcut\" data-start=\"4213\" data-end=\"4293\">3. Mink\u00e4laisen tarkkuuden ja tuotannon tehokkuuden j\u00e4rjestelm\u00e4 tarjoaa?<\/h3>\n<p data-start=\"4294\" data-end=\"4481\">J\u00e4rjestelm\u00e4n kulmatarkkuus on 0,1 asteen tarkkuudella, s\u00e4teen yhdensuuntaisuus 0,1 asteen tarkkuudella ja tasaisuus ja toistettavuus 0,5 prosentin tarkkuudella, ja sen l\u00e4pimenoteho on jopa 500 kiekkoa tunnissa.<\/p>","protected":false},"excerpt":{"rendered":"<p>Ai300 (Medium Beam) -korkean l\u00e4mp\u00f6tilan ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 12 tuuman piikiekkojen puolijohteiden valmistuslinjoille. Se on keskivirtainen ioni-implantointilaite, joka on kehitetty kehittyneisiin dopingprosesseihin sek\u00e4 piipohjaisissa ett\u00e4 laajakaistaisten puolijohteiden sovelluksissa, mukaan lukien SiC-prosessilinjat.<\/p>","protected":false},"featured_media":2357,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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