{"id":2349,"date":"2026-04-22T06:17:36","date_gmt":"2026-04-22T06:17:36","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2349"},"modified":"2026-04-22T07:24:00","modified_gmt":"2026-04-22T07:24:00","slug":"ai200hc-d-high-beam-ion-implantation-system-for-6-8-inch-silicon-wafer-processing-and-smart-cut-applications","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fi\/product\/ai200hc-d-high-beam-ion-implantation-system-for-6-8-inch-silicon-wafer-processing-and-smart-cut-applications\/","title":{"rendered":"Ai200HC.D High Beam Ion Implantation System 6\/8 tuuman piikiekkojen k\u00e4sittelyyn ja Smart Cut -sovelluksiin tarkoitettu ioni-implantointij\u00e4rjestelm\u00e4"},"content":{"rendered":"<p data-start=\"155\" data-end=\"421\"><img decoding=\"async\" class=\"wp-image-2350 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-300x300.png\" alt=\"\" width=\"209\" height=\"209\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai200HC.D-High-Beam-Ion-Implantation-System.png 1000w\" sizes=\"(max-width: 209px) 100vw, 209px\" \/>Ai200HC.D (High Beam) -ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 6 ja 8 tuuman piikiekkojen puolijohdetuotantolinjoille. Se on suurivirtainen ioni-implantaattori, joka on kehitetty integroitujen piirien valmistuksen tarkkuusdoping- ja edistyksellisiin prosessisovelluksiin.<\/p>\n<p data-start=\"423\" data-end=\"698\">J\u00e4rjestelm\u00e4 tukee energia-aluetta 5 keV:st\u00e4 180 keV:iin, mik\u00e4 takaa vakaan s\u00e4teen suorituskyvyn ja korkean prosessin toistettavuuden. Se soveltuu piipohjaisten puolijohteiden valmistukseen ja kehittyneisiin kiekkojen liimaukseen liittyviin prosesseihin, mukaan lukien Smart Cut -teknologian integrointi.<\/p>\n<hr data-start=\"700\" data-end=\"703\" \/>\n<h2 data-section-id=\"1d7mrtu\" data-start=\"705\" data-end=\"716\">Ominaisuudet<\/h2>\n<h3 data-section-id=\"11asise\" data-start=\"718\" data-end=\"753\">Kaukovalon vakaus Suorituskyky<\/h3>\n<p data-start=\"754\" data-end=\"897\">J\u00e4rjestelm\u00e4 yll\u00e4pit\u00e4\u00e4 vakaata ionisuihkun ulostuloa hallitulla vaihtelulla, mik\u00e4 takaa tasaisen implantointilaadun jatkuvan tuotannon aikana.<\/p>\n<h3 data-section-id=\"38j0c\" data-start=\"899\" data-end=\"929\">Laaja prosessin yhteensopivuus<\/h3>\n<p data-start=\"930\" data-end=\"1057\">Yhteensopiva piipohjaisten prosessien ja Smart Cut -sovellusten kanssa, tukee kehittyneit\u00e4 kiekkotekniikan vaatimuksia.<\/p>\n<h3 data-section-id=\"2v7p6\" data-start=\"1059\" data-end=\"1093\">Tarkka implantin ohjaus<\/h3>\n<p data-start=\"1094\" data-end=\"1142\">Tarjoaa tarkan implantointituloksen:<\/p>\n<ul data-start=\"1143\" data-end=\"1231\">\n<li data-section-id=\"1irf1o\" data-start=\"1143\" data-end=\"1166\">Kulman tarkkuus \u2264 0,2\u00b0<\/li>\n<li data-section-id=\"1hml6xy\" data-start=\"1167\" data-end=\"1192\">Palkin yhdensuuntaisuus \u2264 0,3\u00b0<\/li>\n<li data-section-id=\"1danezc\" data-start=\"1193\" data-end=\"1210\">Tasaisuus \u2264 1%<\/li>\n<li data-section-id=\"mbe4el\" data-start=\"1211\" data-end=\"1231\">Toistettavuus \u2264 1%<\/li>\n<\/ul>\n<h3 data-section-id=\"8aw6q\" data-start=\"1233\" data-end=\"1263\">Suuri l\u00e4pimenokyky<\/h3>\n<p data-start=\"1264\" data-end=\"1369\">Tukee \u2265 220 kiekkoa tunnissa, soveltuu keskisuurten ja suurten volyymien puolijohdetuotantoymp\u00e4rist\u00f6ihin.<\/p>\n<h3 data-section-id=\"1e3kdu8\" data-start=\"1371\" data-end=\"1409\">Er\u00e4kohteen k\u00e4sittelykapasiteetti<\/h3>\n<p data-start=\"1410\" data-end=\"1554\">Tukee er\u00e4kohteiden k\u00e4sittely\u00e4, parantaa prosessin joustavuutta ja mahdollistaa integroinnin kehittyneisiin piikiekkojen valmistustekniikoihin.<\/p>\n<p data-start=\"1410\" data-end=\"1554\"><img fetchpriority=\"high\" decoding=\"async\" class=\"aligncenter wp-image-2371 size-large\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-1024x388.png\" alt=\"\" width=\"1024\" height=\"388\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-1024x388.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-300x114.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-768x291.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-18x7.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-600x227.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs.png 1216w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<hr data-start=\"1556\" data-end=\"1559\" \/>\n<h2 data-section-id=\"rkota4\" data-start=\"1561\" data-end=\"1582\">T\u00e4rkeimm\u00e4t tekniset tiedot<\/h2>\n<h3 data-section-id=\"rc5knr\" data-start=\"1584\" data-end=\"1606\">Prosessin parametrit<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1608\" data-end=\"1813\">\n<thead data-start=\"1608\" data-end=\"1632\">\n<tr data-start=\"1608\" data-end=\"1632\">\n<th class=\"\" data-start=\"1608\" data-end=\"1615\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"1615\" data-end=\"1632\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"1657\" data-end=\"1813\">\n<tr data-start=\"1657\" data-end=\"1697\">\n<td data-start=\"1657\" data-end=\"1670\" data-col-size=\"sm\">Kiekon koko<\/td>\n<td data-start=\"1670\" data-end=\"1697\" data-col-size=\"sm\">6-8 tuuman piikiekot<\/td>\n<\/tr>\n<tr data-start=\"1698\" data-end=\"1726\">\n<td data-start=\"1698\" data-end=\"1713\" data-col-size=\"sm\">Energia-alue<\/td>\n<td data-start=\"1713\" data-end=\"1726\" data-col-size=\"sm\">5-180 keV<\/td>\n<\/tr>\n<tr data-start=\"1727\" data-end=\"1777\">\n<td data-start=\"1727\" data-end=\"1748\" data-col-size=\"sm\">Implantoidut elementit<\/td>\n<td data-start=\"1748\" data-end=\"1777\" data-col-size=\"sm\">B+, BF2+, P+, As+, N+, H+, N+, H+<\/td>\n<\/tr>\n<tr data-start=\"1778\" data-end=\"1813\">\n<td data-start=\"1778\" data-end=\"1791\" data-col-size=\"sm\">Annosalue<\/td>\n<td data-start=\"1791\" data-end=\"1813\" data-col-size=\"sm\">5E11-1E17 ionia\/cm\u00b2<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"h0mtjp\" data-start=\"1815\" data-end=\"1835\">Palkin suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1837\" data-end=\"1951\">\n<thead data-start=\"1837\" data-end=\"1861\">\n<tr data-start=\"1837\" data-end=\"1861\">\n<th class=\"\" data-start=\"1837\" data-end=\"1844\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"1844\" data-end=\"1861\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"1886\" data-end=\"1951\">\n<tr data-start=\"1886\" data-end=\"1921\">\n<td data-start=\"1886\" data-end=\"1903\" data-col-size=\"sm\">Palkin vakaus<\/td>\n<td data-start=\"1903\" data-end=\"1921\" data-col-size=\"sm\">\u2264 10% tunnissa<\/td>\n<\/tr>\n<tr data-start=\"1922\" data-end=\"1951\">\n<td data-start=\"1922\" data-end=\"1941\" data-col-size=\"sm\">Palkin rinnakkaisuus<\/td>\n<td data-start=\"1941\" data-end=\"1951\" data-col-size=\"sm\">\u2264 0.3\u00b0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"ieoahx\" data-start=\"1953\" data-end=\"1978\">Istutuksen tarkkuus<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1980\" data-end=\"2191\">\n<thead data-start=\"1980\" data-end=\"2004\">\n<tr data-start=\"1980\" data-end=\"2004\">\n<th class=\"\" data-start=\"1980\" data-end=\"1987\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"1987\" data-end=\"2004\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2029\" data-end=\"2191\">\n<tr data-start=\"2029\" data-end=\"2066\">\n<td data-start=\"2029\" data-end=\"2051\" data-col-size=\"sm\">Implantin kulma-alue<\/td>\n<td data-start=\"2051\" data-end=\"2066\" data-col-size=\"sm\">-11\u00b0 - 11\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2067\" data-end=\"2094\">\n<td data-start=\"2067\" data-end=\"2084\" data-col-size=\"sm\">Kulman tarkkuus<\/td>\n<td data-start=\"2084\" data-end=\"2094\" data-col-size=\"sm\">\u2264 0.2\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2095\" data-end=\"2141\">\n<td data-start=\"2095\" data-end=\"2113\" data-col-size=\"sm\">Tasaisuus (1\u03c3)<\/td>\n<td data-start=\"2113\" data-end=\"2141\" data-col-size=\"sm\">\u2264 1% (B+, 2E14, 150 keV)<\/td>\n<\/tr>\n<tr data-start=\"2142\" data-end=\"2191\">\n<td data-start=\"2142\" data-end=\"2163\" data-col-size=\"sm\">Toistettavuus (1\u03c3)<\/td>\n<td data-start=\"2163\" data-end=\"2191\" data-col-size=\"sm\">\u2264 1% (B+, 2E14, 150 keV)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"1i84h7f\" data-start=\"2193\" data-end=\"2215\">J\u00e4rjestelm\u00e4n suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2217\" data-end=\"2347\">\n<thead data-start=\"2217\" data-end=\"2241\">\n<tr data-start=\"2217\" data-end=\"2241\">\n<th class=\"\" data-start=\"2217\" data-end=\"2224\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2224\" data-end=\"2241\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2266\" data-end=\"2347\">\n<tr data-start=\"2266\" data-end=\"2304\">\n<td data-start=\"2266\" data-end=\"2279\" data-col-size=\"sm\">L\u00e4p\u00e4isykyky<\/td>\n<td data-start=\"2279\" data-end=\"2304\" data-col-size=\"sm\">\u2265 220 kiekkoa tunnissa<\/td>\n<\/tr>\n<tr data-start=\"2305\" data-end=\"2347\">\n<td data-start=\"2305\" data-end=\"2322\" data-col-size=\"sm\">Laitteen koko<\/td>\n<td data-start=\"2322\" data-end=\"2347\" data-col-size=\"sm\">5930 \u00d7 3000 \u00d7 2630 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2349\" data-end=\"2352\" \/>\n<h2 data-section-id=\"1nd7jny\" data-start=\"2354\" data-end=\"2375\">Hakemus<\/h2>\n<h3 data-section-id=\"kkfbvw\" data-start=\"2377\" data-end=\"2422\">Piipohjainen puolijohteiden valmistus<\/h3>\n<p data-start=\"2423\" data-end=\"2524\">K\u00e4ytet\u00e4\u00e4n CMOS- ja kehittyneiden logiikkalaitteiden valmistuksessa tukemaan tarkkoja dopingin implantointiprosesseja.<\/p>\n<h3 data-section-id=\"167rxyg\" data-start=\"2526\" data-end=\"2559\">Smart Cut -prosessin integrointi<\/h3>\n<p data-start=\"2560\" data-end=\"2659\">Soveltuu Smart Cut -tekniikan vaatimuksiin perustuviin kiekkojen liimaus- ja kerroksensiirtoprosesseihin.<\/p>\n<h3 data-section-id=\"13cjew6\" data-start=\"2661\" data-end=\"2691\">Kehittynyt kiekkotekniikka<\/h3>\n<p data-start=\"2692\" data-end=\"2791\">Sovelletaan piikiekon muokkaukseen, rakenteelliseen optimointiin ja laitteiden suorituskyvyn parantamiseen.<\/p>\n<h3 data-section-id=\"4uip35\" data-start=\"2793\" data-end=\"2826\">Integroitujen piirien tuotanto<\/h3>\n<p data-start=\"2827\" data-end=\"2934\">Tukee keskisuurten ja suurten volyymien IC-valmistusta vakaalla prosessinohjauksella ja suurella l\u00e4pimenokyvyll\u00e4.<\/p>\n<hr data-start=\"2936\" data-end=\"2939\" \/>\n<h2 data-section-id=\"1r8frcv\" data-start=\"2941\" data-end=\"2970\">Usein kysytyt kysymykset<\/h2>\n<h3 data-section-id=\"1og21xu\" data-start=\"2972\" data-end=\"3022\">1. Mit\u00e4 kiekkokokoja Ai200HC.D tukee?<\/h3>\n<p data-start=\"3023\" data-end=\"3145\">J\u00e4rjestelm\u00e4 tukee 6 ja 8 tuuman piikiekkoja, ja se soveltuu yleisiin puolijohteiden valmistusprosesseihin.<\/p>\n<h3 data-section-id=\"rdwc10\" data-start=\"3147\" data-end=\"3193\">2. Mik\u00e4 on t\u00e4m\u00e4n j\u00e4rjestelm\u00e4n energia-alue<\/h3>\n<p data-start=\"3194\" data-end=\"3324\">Energia-alue on 5 keV-180 keV, mik\u00e4 tukee monenlaisia implantointisovelluksia piipohjaisissa puolijohdekomponenteissa.<\/p>\n<h3 data-section-id=\"nor4nw\" data-start=\"3326\" data-end=\"3391\">3. Mit\u00e4 erityisi\u00e4 prosessivalmiuksia t\u00e4m\u00e4 j\u00e4rjestelm\u00e4 tukee<\/h3>\n<p data-start=\"3392\" data-end=\"3551\">J\u00e4rjestelm\u00e4 on yhteensopiva piipohjaisten prosessien ja Smart Cut -tekniikan kanssa, ja se tukee er\u00e4kohteiden k\u00e4sittely\u00e4 ja kehittyneit\u00e4 kiekkosuunnittelusovelluksia.<\/p>","protected":false},"excerpt":{"rendered":"<p>Ai200HC.D (High Beam) -ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 6 ja 8 tuuman piikiekkojen puolijohdetuotantolinjoille. Se on suurivirtainen ioni-implantaattori, joka on kehitetty integroitujen piirien valmistuksen tarkkuusdoping- ja edistyksellisiin prosessisovelluksiin.<\/p>","protected":false},"featured_media":2350,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[1177],"product_tag":[],"class_list":{"0":"post-2349","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-ion-implantation-equipment","7":"desktop-align-left","8":"tablet-align-left","9":"mobile-align-left","10":"ast-product-gallery-layout-horizontal-slider","11":"ast-product-gallery-with-no-image","12":"ast-product-tabs-layout-horizontal","14":"first","15":"instock","16":"shipping-taxable","17":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product\/2349","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/comments?post=2349"}],"version-history":[{"count":4,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product\/2349\/revisions"}],"predecessor-version":[{"id":2373,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product\/2349\/revisions\/2373"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/media\/2350"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/media?parent=2349"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product_brand?post=2349"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product_cat?post=2349"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/fi\/wp-json\/wp\/v2\/product_tag?post=2349"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}