{"id":2346,"date":"2026-04-22T05:56:29","date_gmt":"2026-04-22T05:56:29","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2346"},"modified":"2026-04-22T07:25:08","modified_gmt":"2026-04-22T07:25:08","slug":"ai250-medium-beam-room-temperature-ion-implantation-system-for-6-8-inch-silicon-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fi\/product\/ai250-medium-beam-room-temperature-ion-implantation-system-for-6-8-inch-silicon-wafer-processing\/","title":{"rendered":"Ai250 (keskis\u00e4de) huoneenl\u00e4mp\u00f6tilassa toimiva ioni-istutusj\u00e4rjestelm\u00e4 6-8 tuuman piikiekkojen k\u00e4sittelyyn"},"content":{"rendered":"<p data-start=\"190\" data-end=\"506\"><img decoding=\"async\" class=\"wp-image-2347 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Ai250-Medium-Beam-Room-Temperature-Ion-Implantation-System-for-6-8-Inch-Silicon-Wafer-Processing-300x300.png\" alt=\"\" width=\"217\" height=\"217\" srcset=\"\" sizes=\"(max-width: 217px) 100vw, 217px\" data-srcset=\"\" \/>Ai250 (Medium Beam) -ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 6 ja 8 tuuman piikiekkojen puolijohteiden valmistuslinjoille. Se on keskivirtainen ioni-implantaattori, jota k\u00e4ytet\u00e4\u00e4n kehittyneiss\u00e4 integroitujen piirien valmistusprosesseissa ja joka tarjoaa vakaan s\u00e4teen suorituskyvyn, korkean implantointitarkkuuden ja luotettavan annoksen hallinnan.<\/p>\n<p data-start=\"508\" data-end=\"755\">J\u00e4rjestelm\u00e4 tukee energia-aluetta 5 keV:st\u00e4 250 keV:iin, mik\u00e4 mahdollistaa sek\u00e4 matalat ett\u00e4 syv\u00e4t ioni-istutussovellukset. Se soveltuu monenlaisiin puolijohteiden seostamisprosesseihin ja on t\u00e4ysin yhteensopiva LSI-valmistuksen vaatimusten kanssa.<\/p>\n<hr data-start=\"757\" data-end=\"760\" \/>\n<h2 data-section-id=\"1d7mrtu\" data-start=\"762\" data-end=\"773\">Ominaisuudet<\/h2>\n<h3 data-section-id=\"cu05id\" data-start=\"775\" data-end=\"809\">Vakaa keskipitk\u00e4n s\u00e4teen suorituskyky<\/h3>\n<p data-start=\"810\" data-end=\"927\">Varmistaa vakaan ionis\u00e4teen tuoton pitkien tuotantosyklien aikana, parantaa prosessin johdonmukaisuutta ja v\u00e4hent\u00e4\u00e4 vaihtelua.<\/p>\n<h3 data-section-id=\"14z8c7o\" data-start=\"929\" data-end=\"961\">Laaja energia-alueen kapasiteetti<\/h3>\n<p data-start=\"962\" data-end=\"1082\">Energia-alue 5-250 keV tukee joustavia implantointivaatimuksia eri laiterakenteissa ja prosessisolmuissa.<\/p>\n<h3 data-section-id=\"1hi8i36\" data-start=\"1084\" data-end=\"1118\">Korkean tarkkuuden prosessinohjaus<\/h3>\n<p data-start=\"1119\" data-end=\"1264\">Tarjoaa eritt\u00e4in tarkan istutussuorituskyvyn, jonka kulmatarkkuus on \u2264 0,2\u00b0, s\u00e4teen yhdensuuntaisuus \u2264 0,2\u00b0, tasaisuus \u2264 0,5% ja toistettavuus \u2264 0,5%.<\/p>\n<h3 data-section-id=\"8aw6q\" data-start=\"1266\" data-end=\"1296\">Suuri l\u00e4pimenokyky<\/h3>\n<p data-start=\"1297\" data-end=\"1389\">Tukee \u2265 200 kiekkoa tunnissa, soveltuu keskisuuren ja suuren volyymin puolijohdetuotantoon.<\/p>\n<h3 data-section-id=\"oms7zj\" data-start=\"1391\" data-end=\"1419\">Kuvio Implantin toiminta<\/h3>\n<p data-start=\"1420\" data-end=\"1545\">Tukee usean vy\u00f6hykkeen ja kvadrantin implantointia yhdell\u00e4 kiekolla, mik\u00e4 parantaa prosessin joustavuutta ja v\u00e4hent\u00e4\u00e4 kehityskustannuksia.<\/p>\n<h3 data-section-id=\"1bq068l\" data-start=\"1547\" data-end=\"1576\">LSI-prosessin yhteensopivuus<\/h3>\n<p data-start=\"1577\" data-end=\"1641\">T\u00e4ysin yhteensopiva LSI-puolijohteiden valmistusprosessien kanssa.<\/p>\n<p data-start=\"1577\" data-end=\"1641\"><img fetchpriority=\"high\" decoding=\"async\" class=\"wp-image-2371 size-large aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-1024x388.png\" alt=\"\" width=\"1024\" height=\"388\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-1024x388.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-300x114.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-768x291.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-18x7.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs-600x227.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/rs.png 1216w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<hr data-start=\"1643\" data-end=\"1646\" \/>\n<h2 data-section-id=\"rkota4\" data-start=\"1648\" data-end=\"1669\">T\u00e4rkeimm\u00e4t tekniset tiedot<\/h2>\n<h3 data-section-id=\"rc5knr\" data-start=\"1671\" data-end=\"1693\">Prosessin parametrit<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1695\" data-end=\"1899\">\n<thead data-start=\"1695\" data-end=\"1719\">\n<tr data-start=\"1695\" data-end=\"1719\">\n<th class=\"\" data-start=\"1695\" data-end=\"1702\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"1702\" data-end=\"1719\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"1744\" data-end=\"1899\">\n<tr data-start=\"1744\" data-end=\"1784\">\n<td data-start=\"1744\" data-end=\"1757\" data-col-size=\"sm\">Kiekon koko<\/td>\n<td data-col-size=\"sm\" data-start=\"1757\" data-end=\"1784\">6-8 tuuman piikiekot<\/td>\n<\/tr>\n<tr data-start=\"1785\" data-end=\"1813\">\n<td data-start=\"1785\" data-end=\"1800\" data-col-size=\"sm\">Energia-alue<\/td>\n<td data-col-size=\"sm\" data-start=\"1800\" data-end=\"1813\">5-250 keV<\/td>\n<\/tr>\n<tr data-start=\"1814\" data-end=\"1863\">\n<td data-start=\"1814\" data-end=\"1835\" data-col-size=\"sm\">Implantoidut elementit<\/td>\n<td data-col-size=\"sm\" data-start=\"1835\" data-end=\"1863\">B+, P+, As+, Ar+, N+, N+, H+<\/td>\n<\/tr>\n<tr data-start=\"1864\" data-end=\"1899\">\n<td data-start=\"1864\" data-end=\"1877\" data-col-size=\"sm\">Annosalue<\/td>\n<td data-col-size=\"sm\" data-start=\"1877\" data-end=\"1899\">5E11-1E16 ionia\/cm\u00b2<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"h0mtjp\" data-start=\"1901\" data-end=\"1921\">Palkin suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1923\" data-end=\"2217\">\n<thead data-start=\"1923\" data-end=\"1947\">\n<tr data-start=\"1923\" data-end=\"1947\">\n<th class=\"\" data-start=\"1923\" data-end=\"1930\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"1930\" data-end=\"1947\" data-col-size=\"md\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"1972\" data-end=\"2217\">\n<tr data-start=\"1972\" data-end=\"2104\">\n<td data-start=\"1972\" data-end=\"1995\" data-col-size=\"sm\">Suurin s\u00e4teen virta<\/td>\n<td data-col-size=\"md\" data-start=\"1995\" data-end=\"2104\">Ar+ \u2265 1300 \u03bcA @ \u2265220 keV<br \/>\nB+ \u2265 1000 \u03bcA @ \u2265220 keV<br \/>\nP+ \u2265 1300 \u03bcA @ \u2265220 keV<br \/>\nN+ \u2265 1000 \u03bcA @ \u2265220 keV<\/td>\n<\/tr>\n<tr data-start=\"2105\" data-end=\"2187\">\n<td data-start=\"2105\" data-end=\"2122\" data-col-size=\"sm\">Palkin vakaus<\/td>\n<td data-col-size=\"md\" data-start=\"2122\" data-end=\"2187\">\u2264 15% \/ tunti (s\u00e4teen katkeaminen ja valokaari \u2264 1 kerta tunnissa)<\/td>\n<\/tr>\n<tr data-start=\"2188\" data-end=\"2217\">\n<td data-start=\"2188\" data-end=\"2207\" data-col-size=\"sm\">Palkin rinnakkaisuus<\/td>\n<td data-col-size=\"md\" data-start=\"2207\" data-end=\"2217\">\u2264 0.2\u00b0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"ieoahx\" data-start=\"2219\" data-end=\"2244\">Istutuksen tarkkuus<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2246\" data-end=\"2436\">\n<thead data-start=\"2246\" data-end=\"2270\">\n<tr data-start=\"2246\" data-end=\"2270\">\n<th class=\"\" data-start=\"2246\" data-end=\"2253\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2253\" data-end=\"2270\" data-col-size=\"sm\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2295\" data-end=\"2436\">\n<tr data-start=\"2295\" data-end=\"2327\">\n<td data-start=\"2295\" data-end=\"2317\" data-col-size=\"sm\">Implantin kulma-alue<\/td>\n<td data-col-size=\"sm\" data-start=\"2317\" data-end=\"2327\">0\u00b0-45\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2328\" data-end=\"2355\">\n<td data-start=\"2328\" data-end=\"2345\" data-col-size=\"sm\">Kulman tarkkuus<\/td>\n<td data-col-size=\"sm\" data-start=\"2345\" data-end=\"2355\">\u2264 0.2\u00b0<\/td>\n<\/tr>\n<tr data-start=\"2356\" data-end=\"2404\">\n<td data-start=\"2356\" data-end=\"2374\" data-col-size=\"sm\">Tasaisuus (1\u03c3)<\/td>\n<td data-col-size=\"sm\" data-start=\"2374\" data-end=\"2404\">\u2264 0,5% (B+, 2E14, 150 keV)<\/td>\n<\/tr>\n<tr data-start=\"2405\" data-end=\"2436\">\n<td data-start=\"2405\" data-end=\"2426\" data-col-size=\"sm\">Toistettavuus (1\u03c3)<\/td>\n<td data-col-size=\"sm\" data-start=\"2426\" data-end=\"2436\">\u2264 0,5%<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h3 data-section-id=\"1i84h7f\" data-start=\"2438\" data-end=\"2460\">J\u00e4rjestelm\u00e4n suorituskyky<\/h3>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2462\" data-end=\"2740\">\n<thead data-start=\"2462\" data-end=\"2486\">\n<tr data-start=\"2462\" data-end=\"2486\">\n<th class=\"\" data-start=\"2462\" data-end=\"2469\" data-col-size=\"sm\">Kohde<\/th>\n<th class=\"\" data-start=\"2469\" data-end=\"2486\" data-col-size=\"md\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2511\" data-end=\"2740\">\n<tr data-start=\"2511\" data-end=\"2549\">\n<td data-start=\"2511\" data-end=\"2524\" data-col-size=\"sm\">L\u00e4p\u00e4isykyky<\/td>\n<td data-col-size=\"md\" data-start=\"2524\" data-end=\"2549\">\u2265 200 kiekkoa tunnissa<\/td>\n<\/tr>\n<tr data-start=\"2550\" data-end=\"2580\">\n<td data-start=\"2550\" data-end=\"2565\" data-col-size=\"sm\">Tyhji\u00f6taso<\/td>\n<td data-col-size=\"md\" data-start=\"2565\" data-end=\"2580\">&lt; 5E-7 Torr<\/td>\n<\/tr>\n<tr data-start=\"2581\" data-end=\"2612\">\n<td data-start=\"2581\" data-end=\"2597\" data-col-size=\"sm\">R\u00f6ntgens\u00e4teilyvuoto<\/td>\n<td data-col-size=\"md\" data-start=\"2597\" data-end=\"2612\">\u2264 0,6 \u03bcSv\/h<\/td>\n<\/tr>\n<tr data-start=\"2613\" data-end=\"2697\">\n<td data-start=\"2613\" data-end=\"2629\" data-col-size=\"sm\">Skannaustila<\/td>\n<td data-col-size=\"md\" data-start=\"2629\" data-end=\"2697\">Vaakasuora s\u00e4hk\u00f6staattinen skannaus + pystysuora mekaaninen skannaus<\/td>\n<\/tr>\n<tr data-start=\"2698\" data-end=\"2740\">\n<td data-start=\"2698\" data-end=\"2715\" data-col-size=\"sm\">Laitteen koko<\/td>\n<td data-col-size=\"md\" data-start=\"2715\" data-end=\"2740\">5600 \u00d7 3300 \u00d7 2600 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<hr data-start=\"2742\" data-end=\"2745\" \/>\n<h2 data-section-id=\"1nd7jny\" data-start=\"2747\" data-end=\"2768\">Sovelluskent\u00e4t<\/h2>\n<h3 data-section-id=\"y2e8l1\" data-start=\"2770\" data-end=\"2808\">Puolijohdekomponenttien valmistus<\/h3>\n<p data-start=\"2809\" data-end=\"2910\">K\u00e4ytet\u00e4\u00e4n CMOS-logiikkalaitteiden tuotannossa, joka mahdollistaa tarkan dopingaineiden istutuksen transistorin muodostamista varten.<\/p>\n<h3 data-section-id=\"184zlsy\" data-start=\"2912\" data-end=\"2946\">Integroitujen piirien valmistus<\/h3>\n<p data-start=\"2947\" data-end=\"3042\">Sovelletaan LSI- ja kehittyneiss\u00e4 IC-valmistusprosesseissa, jotka edellytt\u00e4v\u00e4t eritt\u00e4in tarkkaa dopingin hallintaa.<\/p>\n<h3 data-section-id=\"l748la\" data-start=\"3044\" data-end=\"3083\">Matalan ja syv\u00e4n liittym\u00e4n muodostuminen<\/h3>\n<p data-start=\"3084\" data-end=\"3172\">Tukee implantaatioprosesseja source\/drain-tekniikkaa ja liitoksen syvyyden hallintaa varten.<\/p>\n<h3 data-section-id=\"oja97j\" data-start=\"3174\" data-end=\"3196\">Dopantti-tekniikka<\/h3>\n<p data-start=\"3197\" data-end=\"3292\">K\u00e4ytet\u00e4\u00e4n piikiekkojen s\u00e4hk\u00f6isten ominaisuuksien hallintaan tarkan ioni-implantaation avulla.<\/p>\n<h3 data-section-id=\"dpf9id\" data-start=\"3294\" data-end=\"3325\">Prosessikehitys ja T&amp;K<\/h3>\n<p data-start=\"3326\" data-end=\"3428\">Soveltuu puolijohdeprosessien kehitt\u00e4miseen, pilottituotantoon ja kokeelliseen laitevalmistukseen.<\/p>\n<hr data-start=\"3430\" data-end=\"3433\" \/>\n<h2 data-section-id=\"1r8frcv\" data-start=\"3435\" data-end=\"3464\">Usein kysytyt kysymykset<\/h2>\n<h3 data-section-id=\"kw7yja\" data-start=\"3466\" data-end=\"3512\">1. Mit\u00e4 kiekkokokoja Ai250 tukee<\/h3>\n<p data-start=\"3513\" data-end=\"3631\">J\u00e4rjestelm\u00e4 tukee 6 ja 8 tuuman piikiekkoja, ja se soveltuu yleisiin puolijohdevalmistuslinjoihin.<\/p>\n<h3 data-section-id=\"1ufru2j\" data-start=\"3633\" data-end=\"3678\">2. Mik\u00e4 on j\u00e4rjestelm\u00e4n energia-alue<\/h3>\n<p data-start=\"3679\" data-end=\"3810\">Energia-alue on 5 keV-250 keV, mik\u00e4 tukee sek\u00e4 matalia ett\u00e4 syvi\u00e4 implantointiprosesseja puolijohdekomponenttien valmistuksessa.<\/p>\n<h3 data-section-id=\"ce5nbe\" data-start=\"3812\" data-end=\"3873\">3. Millaisen prosessitarkkuuden j\u00e4rjestelm\u00e4 tarjoaa<\/h3>\n<p data-start=\"3874\" data-end=\"4052\">J\u00e4rjestelm\u00e4n kulmatarkkuus on 0,2\u00b0, s\u00e4teen yhdensuuntaisuus 0,2\u00b0 ja tasaisuus ja toistettavuus 0,5%, mik\u00e4 takaa vakaan ja tuottavan tuotannon.<\/p>","protected":false},"excerpt":{"rendered":"<p>Ai250 (Medium Beam) -ioni-implantointij\u00e4rjestelm\u00e4 on suunniteltu 6 ja 8 tuuman piikiekkojen puolijohteiden valmistuslinjoille. Se on keskivirtainen ioni-implantaattori, jota k\u00e4ytet\u00e4\u00e4n kehittyneiss\u00e4 integroitujen piirien valmistusprosesseissa ja joka tarjoaa vakaan s\u00e4teen suorituskyvyn, korkean implantointitarkkuuden ja luotettavan annoksen hallinnan.<\/p>","protected":false},"featured_media":2347,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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