![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\")
WG-1261-sarja on eritt\u00e4in tarkka, t\u00e4ysin automaattinen kiekon ohennuskone, joka on suunniteltu 12 tuuman ja pienempi\u00e4 SiC-kiekkoja sek\u00e4 safiiri-, kvartsi- ja keraamisia materiaaleja varten. Luotettavan puolijohdelaitteiden toimittajan kattavana ratkaisuna t\u00e4m\u00e4 sarja yhdist\u00e4\u00e4 edistyksellisen karateknologian, korkean kuormituksen kiekkokannattimet ja automaatio-ominaisuudet varmistaakseen vakaan, tarkan ja tehokkaan kiekkojen ohentamisen.<\/p>\n
WG-1261 on varustettu suuritehoisilla ja eritt\u00e4in tarkoilla ilmalaakeroitavilla karoilla ja uuden sukupolven korkean kuormituksen ja alhaisen t\u00e4rin\u00e4n omaavalla ilmalaakeroidulla kiekkokannattimella, joten se takaa erinomaisen j\u00e4ykkyyden ja paremman prosessin vakauden. Kiert\u00e4v\u00e4, eritt\u00e4in j\u00e4ykk\u00e4 karaveto lis\u00e4\u00e4 koneen j\u00e4ykkyytt\u00e4 entisest\u00e4\u00e4n, mik\u00e4 mahdollistaa tarkan hallinnan my\u00f6s haastaville materiaaleille, kuten SiC:lle ja safiirille.<\/p>\n
Autosetup-toiminnon ansiosta kone voi suorittaa py\u00f6r\u00e4npinnan muokkauksen automaattisesti vaihdon j\u00e4lkeen, jolloin manuaaliset toimenpiteet j\u00e4\u00e4v\u00e4t pois ja tuottavuus ja johdonmukaisuus paranevat. Lis\u00e4ksi online-mittausyksikk\u00f6 (alue 0-1800\u03bcm) takaa tarkan paksuudenvalvonnan, ja SECS\/GEM-liitett\u00e4vyys mahdollistaa saumattoman integroinnin nykyaikaisiin \u00e4lykk\u00e4isiin tehtaisiin.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
Tekniset ominaisuudet<\/span><\/h2>\nWG-1261-sarja on ihanteellinen:<\/p>\n
| Kohde<\/th>\n | Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Rakenne<\/td>\n | Kara \u00d72 \/ kiekkokannatin \u00d73 \/ ty\u00f6p\u00f6yt\u00e4 \u00d71 \/ t\u00e4ysautomaattinen siirto- ja puhdistusj\u00e4rjestelm\u00e4 \u00d71<\/td>\n<\/tr>\n |
| Karan teho<\/td>\n | 7,5 kW \/ 11 kW (valinnainen)<\/td>\n<\/tr>\n |
| Hionnan halkaisija<\/td>\n | \u03c66\u2033, \u03c68\u2033, \u03c612\u2033.<\/td>\n<\/tr>\n |
| Mitat (W\u00d7D\u00d7H)<\/td>\n | 1450mm \u00d7 3380mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Usein kysytyt kysymykset (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> Kone tukee jopa 12 tuuman kiekkoja, mukaan lukien SiC-, safiiri-, kvartsi- ja keraamiset materiaalit, ja tarjoaa monipuolisia k\u00e4sittelyvaihtoehtoja useille tuotantolinjoille.<\/li>\n A:<\/strong> Automaattinen asennus suorittaa automaattisesti py\u00f6r\u00e4npinnan muokkauksen vaihdon j\u00e4lkeen, jolloin manuaaliset toimenpiteet j\u00e4\u00e4v\u00e4t pois, asennusvirheet v\u00e4henev\u00e4t ja tuotantoaikaa s\u00e4\u00e4styy merkitt\u00e4v\u00e4sti.<\/li>\n A:<\/strong> Kyll\u00e4, se on varustettu online-mittausyksik\u00f6ll\u00e4 (0-1800\u03bcm), joka varmistaa kiekon ohenemisen tarkan seurannan ja valvonnan k\u00e4sittelyn aikana.<\/li>\n A:<\/strong> Ehdottomasti. Kone tukee SECS\/GEM-yhteys<\/strong>, mik\u00e4 mahdollistaa reaaliaikaisen seurannan, tiedonkeruun ja integroinnin \u00e4lykk\u00e4isiin valmistusj\u00e4rjestelmiin.<\/li>\n A:<\/strong> Suuritehoisten ilmalaakeroitujen karojen, alhaisen t\u00e4rin\u00e4n ja korkean kuormituksen kiekkokannattimen sek\u00e4 ymp\u00e4r\u00f6iv\u00e4n, eritt\u00e4in j\u00e4yk\u00e4n karan aseman ansiosta WG-1261 s\u00e4ilytt\u00e4\u00e4 erinomaisen prosessivakauden my\u00f6s SiC- ja safiirikiekkojen kohdalla.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" WG-1261-sarjan t\u00e4ysautomaattinen kiekon ohennuskone on t\u00e4ydellinen ratkaisu nykyaikaiseen puolijohteiden ja optisten kiekkojen k\u00e4sittelyyn. Korkean tarkkuuden, kehittyneen automaation ja monimateriaalien yhteensopivuuden ansiosta se tarjoaa johdonmukaisen, tehokkaan ja luotettavan kiekon ohentamisen SiC-, safiiri-, kvartsi- ja keraamisille kiekoille jopa 12 tuuman kiekoille. WG-1261-sarja on ihanteellinen tutkimus- ja kehitysty\u00f6h\u00f6n, pilottituotantoon ja keskisuuriin ja suuriin tehtaisiin, ja se takaa korkeamman tuoton, alhaisemmat ty\u00f6voimakustannukset ja optimoidun tuotannon tehokkuuden.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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|
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Miksi valita WG-1261-sarja?<\/span><\/h2>\n