![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\")
WGP-1271C on eritt\u00e4in tehokas, t\u00e4ysin automaattinen kiekon ohennuskone, joka on suunniteltu erityisesti suurihalkaisijaisten SiC-substraattien ja laitekiekkojen haasteisiin. Tarkkuutta ja tuottavuutta silm\u00e4ll\u00e4 pit\u00e4en suunniteltu kehittynyt GGG:n kolmikarainen, nelipaikkainen j\u00e4rjestelm\u00e4 takaa vakaan, johdonmukaisen ja laadukkaan kiekkojen ohentamisen sek\u00e4 8 tuuman SiC-laitekiekkoille ett\u00e4 12 tuuman SiC-substraateille.<\/p>\n
WGP-1271C on varustettu eritt\u00e4in suuren v\u00e4\u00e4nt\u00f6momentin karoilla ja nelj\u00e4nnen sukupolven korkean kuormituksen kiekkokannattimella, ja sill\u00e4 on helppo hallita monimutkainen ja vaativa SiC:n ohennusprosessi, joka on yksi haastavimmista puolijohdemateriaaleista. Automaatio on koneen ytimess\u00e4, ja se yhdist\u00e4\u00e4 kiekon siirron, puhdistuksen ja hionnan yhdeksi virtaviivaistetuksi ty\u00f6nkuluksi, mik\u00e4 parantaa merkitt\u00e4v\u00e4sti tuotannon tehokkuutta ja v\u00e4hent\u00e4\u00e4 samalla ihmisen toimenpiteit\u00e4.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-1-300x300.png\")
<\/span><\/h2>\nWGP-1271C soveltuu erinomaisesti:<\/p>\n
Sen kyky k\u00e4sitell\u00e4 sek\u00e4 laitekiekkoja ett\u00e4 substraatteja tekee siit\u00e4 monipuolisen valinnan laitoksille, joiden tavoitteena on v\u00e4hent\u00e4\u00e4 seisokkiaikoja, lis\u00e4t\u00e4 tuottoa ja alentaa yleisi\u00e4 k\u00e4ytt\u00f6kustannuksia.<\/p>\n
| Kohde<\/th>\n | Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Rakenne<\/td>\n | Kara \u00d73 \/ kiekkokannatin \u00d74 \/ ty\u00f6p\u00f6yt\u00e4 \u00d71 \/ t\u00e4ysautomaattinen siirto- ja puhdistusj\u00e4rjestelm\u00e4 \u00d71<\/td>\n<\/tr>\n |
| Karan teho<\/td>\n | 11 kW<\/td>\n<\/tr>\n |
| Hionnan halkaisija<\/td>\n | \u03c66\u2033, \u03c68\u2033, \u03c612\u2033.<\/td>\n<\/tr>\n |
| Mitat (W\u00d7D\u00d7H)<\/td>\n | 1900mm \u00d7 3530mm \u00d7 1900mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
Usein kysytyt kysymykset (FAQ)<\/strong><\/span><\/h2>\nA:<\/strong> Laite tukee \u03c66\u2033, \u03c68\u2033 ja \u03c612\u2033 kiekkoja, mukaan lukien sek\u00e4 8-tuumaiset SiC-laitekiekot ett\u00e4 12-tuumaiset SiC-substraatit, mik\u00e4 tarjoaa joustavuutta erilaisiin tuotantotarpeisiin.<\/li>\n A:<\/strong> Autosetup suorittaa automaattisesti py\u00f6r\u00e4npinnan muokkauksen vaihdon j\u00e4lkeen, jolloin manuaaliset toimenpiteet j\u00e4\u00e4v\u00e4t pois, asennusvirheet v\u00e4henev\u00e4t ja arvokasta tuotantoaikaa s\u00e4\u00e4styy.<\/li>\n A:<\/strong> Kyll\u00e4, eritt\u00e4in suuren v\u00e4\u00e4nt\u00f6momentin karojen ja nelj\u00e4nnen sukupolven korkean kuormituksen kiekkokannattimen ansiosta kone takaa vakaan ohentamisen jopa vaikeasti k\u00e4sitelt\u00e4ville SiC-kiekkoille ja minimoi stressin ja viat.<\/li>\n A:<\/strong> Ehdottomasti. T\u00e4ysin automatisoitu siirto- ja puhdistusj\u00e4rjestelm\u00e4 yhdistettyn\u00e4 huipputarkkoihin karoihin tekee siit\u00e4 ihanteellisen sek\u00e4 tutkimuskehitykseen ett\u00e4 laajamittaiseen valmistukseen.<\/li>\n A:<\/strong> Kone tarjoaa optimoidut tarvikekokoonpanot ja korkean prosessitehokkuuden, mik\u00e4 v\u00e4hent\u00e4\u00e4 materiaalihukkaa ja ty\u00f6voimakustannuksia samalla kun se yll\u00e4pit\u00e4\u00e4 suurta l\u00e4pimenoa ja tasaista kiekkojen laatua.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":" WGP-1271C t\u00e4ysautomaattinen kiekon ohennuskone on lopullinen ratkaisu nykyaikaiseen SiC-kiekkojen k\u00e4sittelyyn. Yhdist\u00e4m\u00e4ll\u00e4 tarkan suunnittelun, korkean automaation ja monipuolisen yhteensopivuuden se vastaa tehokkaasti ja luotettavasti suurten SiC-substraattien ja laitekiekkojen ohentamisen haasteisiin. WGP-1271C takaa tasaiset tulokset, paremman tuoton ja alhaisemmat k\u00e4ytt\u00f6kustannukset, olipa kyseess\u00e4 sitten suursarjatuotanto tai tutkimuskehitys, mik\u00e4 tekee siit\u00e4 v\u00e4ltt\u00e4m\u00e4tt\u00f6m\u00e4n apuv\u00e4lineen puolijohteita valmistaville laitoksille.<\/p>","protected":false},"featured_media":2132,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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|
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Miksi valita WGP-1271C?<\/span><\/h2>\n