{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fi\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"Puoliautomaattinen huoneenl\u00e4mp\u00f6tilan kiekon liimauskone 2-12 tuuman kiekon k\u00e4sittelyyn"},"content":{"rendered":"

\"\"Puoliautomaattinen huoneenl\u00e4mp\u00f6tilassa toimiva kiekon liimauskone on eritt\u00e4in tarkka j\u00e4rjestelm\u00e4 kiekko- ja sirutason liimaukseen. Yhdist\u00e4m\u00e4ll\u00e4 mekaanisen paineen ja in situ -pinta-aktivointitekniikan se mahdollistaa pysyv\u00e4n liimauksen huoneenl\u00e4mm\u00f6ss\u00e4 (20-30 \u00b0C) ilman liimoja tai korkean l\u00e4mp\u00f6tilan k\u00e4sittely\u00e4. T\u00e4m\u00e4 minimoi l\u00e4mp\u00f6j\u00e4nnityksen ja materiaalin muodonmuutokset, joten se on ihanteellinen l\u00e4mp\u00f6herkille ja heterogeenisille materiaaleille. Laite tukee kiekkokokoja 2 tuuman ja 12 tuuman v\u00e4lill\u00e4, ja se soveltuu tutkimukseen, pilottituotantoon sek\u00e4 pienen ja keskisuuren mittakaavan valmistukseen.<\/p>\n

\"\"T\u00e4rkeimm\u00e4t ominaisuudet<\/strong><\/h2>\n
    \n
  1. Liimaus huoneenl\u00e4mp\u00f6tilassa<\/strong> - Toimii 25 \u00b1 5 \u00b0C:n l\u00e4mp\u00f6tilassa l\u00e4mp\u00f6erojen ja kiekon v\u00e4\u00e4ntymisen est\u00e4miseksi.<\/li>\n
  2. Pinnan aktivointi<\/strong> - Plasma- tai kemiallinen aktivointi parantaa liimauslujuutta; valinnainen sputterointi parantaa rajapinnan laatua.<\/li>\n
  3. Korkean tarkkuuden kohdistaminen<\/strong> - Visuaalinen kohdistusj\u00e4rjestelm\u00e4 ja tarkkuusliikealusta \u00b10,5 \u03bcm:n tarkkuudella.<\/li>\n
  4. Laaja materiaaliyhteensopivuus<\/strong> - Tukee Si, SiC, GaAs, GaN, InP, safiiri, lasi, LiNbO\u2083, LiTaO\u2083, timantti ja tietyt polymeerit.<\/li>\n
  5. Puoliautomaattinen toiminta<\/strong> - Kiekkojen manuaalinen lataus automaattisella liimausprosessilla; ohjelmoitavat reseptit toistettavien tulosten saavuttamiseksi.<\/li>\n
  6. Puhdas ja vakaa ymp\u00e4rist\u00f6<\/strong> - Sis\u00e4\u00e4nrakennettu luokan 100 puhdistusj\u00e4rjestelm\u00e4 takaa alhaisen kontaminaation ja rajapinnan tyhj\u00e4tilavuuden <0,1%.<\/li>\n<\/ol>\n

    Tekniset tiedot<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Parametri<\/th>\nTekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n
    Kiekon koko<\/td>\n2\u2033 - 12\u2033, yhteensopiva ep\u00e4s\u00e4\u00e4nn\u00f6llisten n\u00e4ytteiden kanssa<\/td>\n<\/tr>\n
    Liimausl\u00e4mp\u00f6tila<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Maksimipaine<\/td>\n80 kN<\/td>\n<\/tr>\n
    Paineen s\u00e4\u00e4t\u00f6<\/td>\n0-5000 N s\u00e4\u00e4dett\u00e4viss\u00e4, \u00b11 N resoluutio<\/td>\n<\/tr>\n
    Kohdistustarkkuus<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Sidoksen lujuus<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Pintak\u00e4sittely<\/td>\nIn situ -aktivointi + sputterointipinnoitus<\/td>\n<\/tr>\n
    Sy\u00f6tt\u00f6tila<\/td>\nManuaalinen<\/td>\n<\/tr>\n
    Puhtaustaso<\/td>\nLuokka 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Ydinteknologia<\/strong><\/h2>\n
      \n
    1. Suora liimaus huoneenl\u00e4mp\u00f6tilassa<\/strong> - Aktivoidut pinnat ovat kosketuksissa kontrolloidussa paineessa muodostaen vakaita sidoksia ilman l\u00e4mp\u00f6hehkutusta.<\/li>\n
    2. Pinnan aktivointi<\/strong> - Lis\u00e4\u00e4 pintaenergiaa, poistaa ep\u00e4puhtauksia ja parantaa materiaalien yhten\u00e4ist\u00e4 liimautumista.<\/li>\n<\/ol>\n

      \"\"Sovellukset<\/strong><\/h2>\n
        \n
      1. Kehittyneet puolijohdepakkaukset<\/strong> - 3D IC-pinoaminen, TSV-liimaus, logiikka- ja muistisirujen heterogeeninen integrointi.<\/li>\n
      2. MEMS-valmistus<\/strong> - Kiekkotason tyhji\u00f6pakkaus antureille, kuten kiihtyvyysmittareille ja gyroskoopeille.<\/li>\n
      3. Optoelektroniikka ja n\u00e4yt\u00f6t<\/strong> - LED-liimaus, safiiri- ja lasialustojen liimaus, AR\/VR-optisten moduulien kokoonpano.<\/li>\n
      4. Mikrofluidiikka ja biosirut<\/strong> - PDMS:n ja lasin liimaus s\u00e4ilytt\u00e4en samalla biologisen aktiivisuuden.<\/li>\n
      5. Tutkimus ja uudet laitteet<\/strong> - Joustava elektroniikka, kvanttilaitteet ja heterogeenisten materiaalien integrointi.<\/li>\n<\/ol>\n

        Palvelu ja tuki<\/strong><\/h2>\n
          \n
        1. Prosessin kehitt\u00e4minen<\/strong> - Liimausparametrien optimointi ja pinta-aktivointiratkaisut eri materiaaleille.<\/li>\n
        2. Laitteiden r\u00e4\u00e4t\u00e4l\u00f6inti<\/strong> - Korkean tarkkuuden linjausmoduulit, tyhji\u00f6- tai valvotun ilmakeh\u00e4n kammiot.<\/li>\n
        3. Tekninen koulutus<\/strong> - Paikan p\u00e4\u00e4ll\u00e4 tapahtuva k\u00e4yt\u00f6n opastus ja prosessin virheenkorjaus.<\/li>\n
        4. Myynnin j\u00e4lkeinen tuki<\/strong> - 12 kuukauden takuu, t\u00e4rkeimpien komponenttien nopea vaihto, et\u00e4diagnostiikka ja ohjelmistop\u00e4ivitykset.<\/li>\n<\/ol>\n

          FAQ<\/h2>\n

          K: Mik\u00e4 on huoneenl\u00e4mp\u00f6tilassa tapahtuvan liimauksen t\u00e4rkein etu?
          V: Se poistaa l\u00e4mp\u00f6j\u00e4nnityksen ja mahdollistaa l\u00e4mp\u00f6herkkien ja heterogeenisten materiaalien luotettavan liimauksen.<\/p>\n

          K: Mit\u00e4 materiaaleja voidaan liimata?
          A: Pii, piikarbidi, galliumnitridi, galliumarsenidi, indiumfosfidi, safiiri, lasi, litiumniobaatti, timantti ja tietyt polymeerit.<\/p>","protected":false},"excerpt":{"rendered":"

          Puoliautomaattinen huoneenl\u00e4mp\u00f6tilassa toimiva kiekon liimauskone on eritt\u00e4in tarkka j\u00e4rjestelm\u00e4 kiekko- ja sirutason liimaukseen. Yhdist\u00e4m\u00e4ll\u00e4 mekaanisen paineen ja in situ -pinta-aktivointitekniikan se mahdollistaa pysyv\u00e4n liimauksen huoneenl\u00e4mm\u00f6ss\u00e4 (20-30 \u00b0C) ilman liimoja tai korkean l\u00e4mp\u00f6tilan k\u00e4sittely\u00e4.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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