{"id":1968,"date":"2026-03-23T06:01:20","date_gmt":"2026-03-23T06:01:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=1968"},"modified":"2026-03-23T06:03:52","modified_gmt":"2026-03-23T06:03:52","slug":"lpcvd-oxidation-furnace","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/fi\/product\/lpcvd-oxidation-furnace\/","title":{"rendered":"6\/8\/12-tuumainen LPCVD-hapetusuunin eritt\u00e4in tasainen ohutkalvopinnoitus kehittyneeseen puolijohdevalmistukseen"},"content":{"rendered":"<p data-start=\"295\" data-end=\"716\">6\/8\/12-tuumainen LPCVD-hapetusuuni on huipputekninen puolijohteiden valmistusty\u00f6kalu, joka on suunniteltu tarkkaan ja tasaiseen ohutkalvopinnoitukseen. Sit\u00e4 k\u00e4ytet\u00e4\u00e4n laajalti korkealaatuisten polysilicon-, piidinitridi- ja piioksidikerrosten kasvattamiseen kiekoille, mik\u00e4 takaa tasaisen suorituskyvyn tehopuolijohteissa, kehittyneiss\u00e4 substraateissa ja muissa korkean tarkkuuden sovelluksissa.<\/p>\n<p data-start=\"718\" data-end=\"1176\">T\u00e4ss\u00e4 laitteistossa yhdistyv\u00e4t kehittynyt matalapainepinnoitustekniikka, \u00e4lyk\u00e4s l\u00e4mp\u00f6tilan s\u00e4\u00e4t\u00f6 ja eritt\u00e4in puhdas prosessisuunnittelu, joiden avulla saavutetaan poikkeuksellinen ohutkalvojen tasaisuus ja suuri l\u00e4pimeno. Sen pystysuora reaktorikokoonpano mahdollistaa tehokkaan er\u00e4k\u00e4sittelyn, ja sen terminen laskeutusprosessi v\u00e4ltt\u00e4\u00e4 plasman aiheuttamat vauriot, mink\u00e4 vuoksi se on ihanteellinen kriittisiin prosesseihin, kuten portin dielektrisen materiaalin muodostamiseen, j\u00e4nnityspuskurikerroksiin ja suojaoksideihin.<\/p>\n<p data-start=\"718\" data-end=\"1176\"><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone wp-image-1978 size-full aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/20250422163156_56112.png\" alt=\"\" width=\"680\" height=\"382\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/20250422163156_56112.png 680w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/20250422163156_56112-300x169.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/20250422163156_56112-18x10.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/20250422163156_56112-600x337.png 600w\" sizes=\"(max-width: 680px) 100vw, 680px\" \/><\/p>\n<p data-start=\"718\" data-end=\"1176\">\n<h2 data-section-id=\"52xoay\" data-start=\"1183\" data-end=\"1206\"><span role=\"text\"><strong data-start=\"1186\" data-end=\"1204\">T\u00e4rkeimm\u00e4t edut<\/strong><\/span><\/h2>\n<ul data-start=\"1207\" data-end=\"2119\">\n<li data-section-id=\"5aaqq\" data-start=\"1207\" data-end=\"1402\"><strong data-start=\"1209\" data-end=\"1250\">Eritt\u00e4in tasainen ohutkalvop\u00e4\u00e4llystys:<\/strong> Matalapaineinen ymp\u00e4rist\u00f6 (0,1-10 Torr) takaa kiekkojen v\u00e4lisen ja kiekon sis\u00e4isen tasaisuuden \u00b11,5%, mik\u00e4 on kriittinen tekij\u00e4 suorituskykyisten laitteiden valmistuksessa.<\/li>\n<li data-section-id=\"1gd7krr\" data-start=\"1403\" data-end=\"1564\"><strong data-start=\"1405\" data-end=\"1433\">Pystysuoran reaktorin suunnittelu:<\/strong> K\u00e4sittelee 150-200 kiekkoa per er\u00e4, mik\u00e4 parantaa l\u00e4pimenoa ja tuotannon tehokkuutta teollisen mittakaavan puolijohdevalmistuksessa.<\/li>\n<li data-section-id=\"k1g5ie\" data-start=\"1565\" data-end=\"1716\"><strong data-start=\"1567\" data-end=\"1610\">L\u00e4mp\u00f6pinnoitusprosessi (500-900 \u00b0C):<\/strong> Tarjoaa hell\u00e4varaisen, plasmattoman laskeutumisen, joka suojaa herkki\u00e4 substraatteja ja yll\u00e4pit\u00e4\u00e4 korkeaa kalvon laatua.<\/li>\n<li data-section-id=\"15vtswb\" data-start=\"1717\" data-end=\"1844\"><strong data-start=\"1719\" data-end=\"1755\">\u00c4lyk\u00e4s l\u00e4mp\u00f6tilan s\u00e4\u00e4t\u00f6:<\/strong> Reaaliaikainen seuranta ja s\u00e4\u00e4t\u00f6 \u00b11 \u00b0C:n tarkkuudella vakaiden ja toistettavien tulosten saavuttamiseksi.<\/li>\n<li data-section-id=\"5qswig\" data-start=\"1845\" data-end=\"1966\"><strong data-start=\"1847\" data-end=\"1879\">Eritt\u00e4in puhdas prosessikammio:<\/strong> Minimoi hiukkaskontaminaation ja tukee SiC:t\u00e4 ja muita kehittyneit\u00e4 kiekkomateriaaleja.<\/li>\n<li data-section-id=\"13dmie4\" data-start=\"1967\" data-end=\"2119\"><strong data-start=\"1969\" data-end=\"2000\">Mukautettava kokoonpano:<\/strong> Joustava rakenne mukautuu erilaisiin prosessivaatimuksiin, kuten kuiva- tai m\u00e4rk\u00e4hapetukseen ja eri kiekkokokoihin.<\/li>\n<\/ul>\n<h2 data-section-id=\"10oaxfc\" data-start=\"2126\" data-end=\"2159\"><span role=\"text\"><strong data-start=\"2129\" data-end=\"2157\">Tekniset tiedot<\/strong><\/span><\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2161\" data-end=\"2686\">\n<thead data-start=\"2161\" data-end=\"2188\">\n<tr data-start=\"2161\" data-end=\"2188\">\n<th class=\"\" data-start=\"2161\" data-end=\"2171\" data-col-size=\"sm\">Ominaisuus<\/th>\n<th class=\"\" data-start=\"2171\" data-end=\"2188\" data-col-size=\"md\">Tekniset tiedot<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2217\" data-end=\"2686\">\n<tr data-start=\"2217\" data-end=\"2245\">\n<td data-start=\"2217\" data-end=\"2230\" data-col-size=\"sm\">Kiekon koko<\/td>\n<td data-col-size=\"md\" data-start=\"2230\" data-end=\"2245\">6\/8\/12 tuumaa<\/td>\n<\/tr>\n<tr data-start=\"2246\" data-end=\"2316\">\n<td data-start=\"2246\" data-end=\"2269\" data-col-size=\"sm\">Yhteensopivat materiaalit<\/td>\n<td data-col-size=\"md\" data-start=\"2269\" data-end=\"2316\">Polysilicon, piidinitridi, piioksidi, piioksidi<\/td>\n<\/tr>\n<tr data-start=\"2317\" data-end=\"2372\">\n<td data-start=\"2317\" data-end=\"2334\" data-col-size=\"sm\">Hapettumistyyppi<\/td>\n<td data-col-size=\"md\" data-start=\"2334\" data-end=\"2372\">Kuiva happi \/ m\u00e4rk\u00e4 happi (DCE, HCL)<\/td>\n<\/tr>\n<tr data-start=\"2373\" data-end=\"2416\">\n<td data-start=\"2373\" data-end=\"2401\" data-col-size=\"sm\">Prosessin l\u00e4mp\u00f6tila-alue<\/td>\n<td data-col-size=\"md\" data-start=\"2401\" data-end=\"2416\">500\u00b0C-900\u00b0C<\/td>\n<\/tr>\n<tr data-start=\"2417\" data-end=\"2456\">\n<td data-start=\"2417\" data-end=\"2445\" data-col-size=\"sm\">Vakiol\u00e4mp\u00f6tilavy\u00f6hyke<\/td>\n<td data-col-size=\"md\" data-start=\"2445\" data-end=\"2456\">\u2265800 mm<\/td>\n<\/tr>\n<tr data-start=\"2457\" data-end=\"2496\">\n<td data-start=\"2457\" data-end=\"2488\" data-col-size=\"sm\">L\u00e4mp\u00f6tilan s\u00e4\u00e4d\u00f6n tarkkuus<\/td>\n<td data-col-size=\"md\" data-start=\"2488\" data-end=\"2496\">\u00b11\u00b0C<\/td>\n<\/tr>\n<tr data-start=\"2497\" data-end=\"2573\">\n<td data-start=\"2497\" data-end=\"2516\" data-col-size=\"sm\">Hiukkasten hallinta<\/td>\n<td data-col-size=\"md\" data-start=\"2516\" data-end=\"2573\">0.32\u03bcm), 0.32\u03bcm), 0.226\u03bcm).<\/td>\n<\/tr>\n<tr data-start=\"2574\" data-end=\"2608\">\n<td data-start=\"2574\" data-end=\"2591\" data-col-size=\"sm\">Kalvon paksuus<\/td>\n<td data-col-size=\"md\" data-start=\"2591\" data-end=\"2608\">NIT1500 \u00b150 \u00c5<\/td>\n<\/tr>\n<tr data-start=\"2609\" data-end=\"2686\">\n<td data-start=\"2609\" data-end=\"2622\" data-col-size=\"sm\">Yhdenmukaisuus<\/td>\n<td data-start=\"2622\" data-end=\"2686\" data-col-size=\"md\">Kiekon sis\u00e4ll\u00e4 &lt;2.5%, kiekkojen v\u00e4lill\u00e4 &lt;2.5%, erien v\u00e4lill\u00e4 &lt;2%.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h2 data-section-id=\"5mln0p\" data-start=\"2693\" data-end=\"2718\"><span role=\"text\"><strong data-start=\"2696\" data-end=\"2716\">Tuotteen ominaisuudet<\/strong><\/span><\/h2>\n<ul data-start=\"2719\" data-end=\"3240\">\n<li data-section-id=\"1npssef\" data-start=\"2719\" data-end=\"2795\">Automaattinen kiekkojen k\u00e4sittely takaa korkean turvallisuuden ja toiminnan tehokkuuden.<\/li>\n<li data-section-id=\"1viv597\" data-start=\"2796\" data-end=\"2893\">Eritt\u00e4in puhdas prosessikammio v\u00e4hent\u00e4\u00e4 kontaminaatioriski\u00e4 ja yll\u00e4pit\u00e4\u00e4 tasaisen kalvon laadun.<\/li>\n<li data-section-id=\"h2e7ah\" data-start=\"2894\" data-end=\"2970\">Erinomainen kalvonpaksuuden tasaisuus tukee kehittynytt\u00e4 solmujen valmistusta.<\/li>\n<li data-section-id=\"i9qs80\" data-start=\"2971\" data-end=\"3065\">Reaaliaikainen \u00e4lyk\u00e4s l\u00e4mp\u00f6tilan ja paineen s\u00e4\u00e4t\u00f6 mahdollistaa tarkat prosessis\u00e4\u00e4d\u00f6t.<\/li>\n<li data-section-id=\"1vojhz5\" data-start=\"3066\" data-end=\"3155\">SiC-kiekon tuki v\u00e4hent\u00e4\u00e4 kitkaa ja hiukkasten muodostumista, mik\u00e4 pident\u00e4\u00e4 kiekon k\u00e4ytt\u00f6ik\u00e4\u00e4.<\/li>\n<li data-section-id=\"1efwava\" data-start=\"3156\" data-end=\"3240\">Modulaarinen rakenne mahdollistaa mukauttamisen erilaisiin sovelluksiin ja prosessitarpeisiin.<\/li>\n<\/ul>\n<h2 data-section-id=\"1s7c0bk\" data-start=\"3247\" data-end=\"3284\"><span role=\"text\"><strong data-start=\"3250\" data-end=\"3282\">Laskeutumisprosessin periaate<img decoding=\"async\" class=\"size-medium wp-image-1972 alignleft\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/LPCVD-deposition-principle-300x246.png\" alt=\"\" width=\"300\" height=\"246\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/LPCVD-deposition-principle-300x246.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/LPCVD-deposition-principle-15x12.png 15w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/LPCVD-deposition-principle-600x492.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/LPCVD-deposition-principle.png 680w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/strong><\/span><\/h2>\n<ol data-start=\"3285\" data-end=\"3910\">\n<li data-section-id=\"1jepk0v\" data-start=\"3285\" data-end=\"3400\"><strong data-start=\"3288\" data-end=\"3309\">Kaasun k\u00e4ytt\u00f6\u00f6notto:<\/strong> Reagenssikaasut johdetaan putkeen matalassa paineessa (0,25-1 Torr).<\/li>\n<li data-section-id=\"bjphum\" data-start=\"3401\" data-end=\"3506\"><strong data-start=\"3404\" data-end=\"3426\">Pintadiffuusio:<\/strong> Molekyylit diffundoituvat vapaasti kiekon pinnalla, mik\u00e4 takaa tasaisen peitt\u00e4vyyden.<\/li>\n<li data-section-id=\"yyrb2x\" data-start=\"3507\" data-end=\"3591\"><strong data-start=\"3510\" data-end=\"3525\">Adsorptio:<\/strong> Reagenssit tarttuvat kiekon pintaan ennen kemiallista reaktiota.<\/li>\n<li data-section-id=\"17r2njo\" data-start=\"3592\" data-end=\"3696\"><strong data-start=\"3595\" data-end=\"3617\">Kemiallinen reaktio:<\/strong> Terminen hajoaminen muodostaa halutun ohutkalvon suoraan alustalle.<\/li>\n<li data-section-id=\"joswp0\" data-start=\"3697\" data-end=\"3802\"><strong data-start=\"3700\" data-end=\"3722\">Sivutuotteiden poisto:<\/strong> Ei-reaktiiviset kaasut evakuoidaan puhtauden s\u00e4ilytt\u00e4miseksi ja h\u00e4iri\u00f6iden est\u00e4miseksi.<\/li>\n<li data-section-id=\"1nf7uqd\" data-start=\"3803\" data-end=\"3910\"><strong data-start=\"3806\" data-end=\"3825\">Elokuvan muodostuminen:<\/strong> Reaktiotuotteet ker\u00e4\u00e4ntyv\u00e4t v\u00e4hitellen muodostaen tasaisen, vakaan ohutkalvokerroksen.<\/li>\n<\/ol>\n<h2 data-section-id=\"3f2aoc\" data-start=\"3917\" data-end=\"3938\"><span role=\"text\"><strong data-start=\"3920\" data-end=\"3936\">Sovellukset<\/strong><\/span><\/h2>\n<ul data-start=\"3939\" data-end=\"4341\">\n<li data-section-id=\"88axke\" data-start=\"3939\" data-end=\"4064\"><strong data-start=\"3941\" data-end=\"3967\">Suojaava oksidikerros:<\/strong> Suojaa piikiekkoja kontaminaatiolta ja v\u00e4hent\u00e4\u00e4 ionien kanavoitumista dopingprosessien aikana.<\/li>\n<\/ul>\n<p><img decoding=\"async\" class=\"wp-image-1973 size-full aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process1.png\" alt=\"\" width=\"671\" height=\"273\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process1.png 671w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process1-300x122.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process1-18x7.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process1-600x244.png 600w\" sizes=\"(max-width: 671px) 100vw, 671px\" \/><\/p>\n<ul data-start=\"3939\" data-end=\"4341\">\n<li data-section-id=\"1o3mmvz\" data-start=\"4065\" data-end=\"4204\"><strong data-start=\"4067\" data-end=\"4087\">Pad-oksidikerros:<\/strong> Toimii j\u00e4nnityspuskurina pii- ja piinitridikerrosten v\u00e4lill\u00e4, est\u00e4\u00e4 kiekon halkeilua ja parantaa saantoa.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-1974 size-full aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process2.png\" alt=\"\" width=\"602\" height=\"307\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process2.png 602w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process2-300x153.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process2-18x9.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process2-600x306.png 600w\" sizes=\"(max-width: 602px) 100vw, 602px\" \/><\/p>\n<ul data-start=\"3939\" data-end=\"4341\">\n<li data-section-id=\"10l973e\" data-start=\"4205\" data-end=\"4341\"><strong data-start=\"4207\" data-end=\"4228\">Porttioksidikerros:<\/strong> Tarjoaa MOS-rakenteiden dielektrisen kerroksen, joka varmistaa tarkan virranjohtamisen ja kentt\u00e4efektin hallinnan.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-1975 size-full aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process3.png\" alt=\"\" width=\"680\" height=\"297\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process3.png 680w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process3-300x131.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process3-18x8.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/application-of-oxidation-process3-600x262.png 600w\" sizes=\"(max-width: 680px) 100vw, 680px\" \/><\/p>\n<h2 data-section-id=\"19sbner\" data-start=\"4348\" data-end=\"4378\"><span role=\"text\"><strong data-start=\"4351\" data-end=\"4376\">J\u00e4rjestelm\u00e4kokoonpanot<\/strong><\/span><\/h2>\n<ul data-start=\"4379\" data-end=\"4685\">\n<li data-section-id=\"29z8e\" data-start=\"4379\" data-end=\"4496\"><strong data-start=\"4381\" data-end=\"4400\">Vertikaalinen LPCVD:<\/strong> Prosessikaasut virtaavat ylh\u00e4\u00e4lt\u00e4 alasp\u00e4in, jolloin saadaan aikaan tasainen laskeuma kaikkiin er\u00e4n kiekkoihin.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-1976 aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Vertical-LPCVD-Systems-300x280.png\" alt=\"\" width=\"300\" height=\"280\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Vertical-LPCVD-Systems-300x280.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Vertical-LPCVD-Systems-13x12.png 13w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Vertical-LPCVD-Systems-600x560.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Vertical-LPCVD-Systems.png 680w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/p>\n<ul data-start=\"4379\" data-end=\"4685\">\n<li data-section-id=\"1dvx71j\" data-start=\"4497\" data-end=\"4685\"><strong data-start=\"4499\" data-end=\"4520\">Horisontaalinen LPCVD:<\/strong> Kaasut virtaavat substraattien pituussuunnassa, mik\u00e4 soveltuu jatkuvaan, suurivolyymiseen tuotantoon, vaikka laskeuman paksuus voi hieman vaihdella tulopuolen l\u00e4hell\u00e4.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-1977 size-full aligncenter\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Horizontal-LPCVD-Systems.png\" alt=\"\" width=\"680\" height=\"361\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Horizontal-LPCVD-Systems.png 680w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Horizontal-LPCVD-Systems-300x159.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Horizontal-LPCVD-Systems-18x10.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Horizontal-LPCVD-Systems-600x319.png 600w\" sizes=\"(max-width: 680px) 100vw, 680px\" \/><\/p>\n<h2 data-section-id=\"4co5vj\" data-start=\"4692\" data-end=\"4727\"><span role=\"text\"><strong data-start=\"4695\" data-end=\"4725\">Usein kysytyt kysymykset<\/strong><\/span><\/h2>\n<p data-start=\"4728\" data-end=\"5009\"><strong data-start=\"4728\" data-end=\"4769\">Q1: Mihin LPCVD:t\u00e4 k\u00e4ytet\u00e4\u00e4n ensisijaisesti?<\/strong><br data-start=\"4769\" data-end=\"4772\" \/>V: LPCVD on matalapaineinen ohutkalvopinnoitusprosessi, jota k\u00e4ytet\u00e4\u00e4n laajalti puolijohteiden valmistuksessa polysilicon-, piidinitridi- ja piioksidipinnoitukseen. Se mahdollistaa tasalaatuisten ja korkealaatuisten kalvojen tuottamisen kehittyneiden laitteiden valmistukseen.<\/p>\n<p data-start=\"5011\" data-end=\"5252\"><strong data-start=\"5011\" data-end=\"5052\">Q2: Miten LPCVD eroaa PECVD:st\u00e4?<\/strong><br data-start=\"5052\" data-end=\"5055\" \/>V: LPCVD perustuu l\u00e4mp\u00f6aktivointiin matalassa paineessa eritt\u00e4in puhtaiden kalvojen tuottamiseksi, kun taas PECVD:ss\u00e4 k\u00e4ytet\u00e4\u00e4n plasmaa matalammissa l\u00e4mp\u00f6tiloissa nopeamman laskeutumisen aikaansaamiseksi, usein hieman heikommalla kalvon laadulla.<\/p>\n<p data-start=\"50\" data-end=\"348\"><strong data-start=\"50\" data-end=\"138\">Q3: Mitk\u00e4 kiekkokoot ja materiaalit ovat yhteensopivia t\u00e4m\u00e4n LPCVD-hapetusuunin kanssa?<\/strong><br data-start=\"138\" data-end=\"141\" \/>V: T\u00e4m\u00e4 uuni tukee 6 tuuman, 8 tuuman ja 12 tuuman kiekkoja ja on yhteensopiva polysilicon-, piinitridi-, piioksidi- ja SiC-kiekkojen kanssa, mik\u00e4 tarjoaa joustavuutta erilaisiin puolijohdesovelluksiin.<\/p>\n<p data-start=\"350\" data-end=\"673\"><strong data-start=\"350\" data-end=\"427\">Q4: Voidaanko LPCVD-hapetusuunia r\u00e4\u00e4t\u00e4l\u00f6id\u00e4 tiettyj\u00e4 prosesseja varten?<\/strong><br data-start=\"427\" data-end=\"430\" \/>V: Kyll\u00e4, j\u00e4rjestelm\u00e4 tarjoaa modulaarisia kokoonpanoja, mukaan lukien s\u00e4\u00e4dett\u00e4v\u00e4t l\u00e4mp\u00f6tilavy\u00f6hykkeet, kaasun virtauksen s\u00e4\u00e4t\u00f6 ja hapetusmuodot (kuiva tai m\u00e4rk\u00e4), joten se pystyy t\u00e4ytt\u00e4m\u00e4\u00e4n erilaiset prosessivaatimukset sek\u00e4 tutkimuksessa ett\u00e4 teollisen mittakaavan tuotannossa.<\/p>","protected":false},"excerpt":{"rendered":"<p>6\/8\/12-tuumainen LPCVD (Low Pressure Chemical Vapor Deposition) -hapetusuuni on huipputekninen puolijohteiden valmistusty\u00f6kalu, joka on suunniteltu tarkkaan ja tasaiseen ohutkalvopinnoitukseen. Sit\u00e4 k\u00e4ytet\u00e4\u00e4n laajalti korkealaatuisten polysilicon-, piidinitridi- ja piioksidikerrosten kasvattamiseen kiekoille, mik\u00e4 takaa tasaisen suorituskyvyn tehopuolijohteissa, kehittyneiss\u00e4 substraateissa ja muissa korkean tarkkuuden sovelluksissa.<\/p>","protected":false},"featured_media":1969,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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