{"id":2134,"date":"2026-04-08T06:21:36","date_gmt":"2026-04-08T06:21:36","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2134"},"modified":"2026-04-08T06:21:37","modified_gmt":"2026-04-08T06:21:37","slug":"wg-1261-series-fully-automatic-wafer-thinning-machine","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/es\/product\/wg-1261-series-fully-automatic-wafer-thinning-machine\/","title":{"rendered":"M\u00e1quina adelgazadora de obleas totalmente autom\u00e1tica serie WG-1261"},"content":{"rendered":"<p data-start=\"205\" data-end=\"638\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-medium wp-image-2135 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WG-1261-Series-Fully-Automatic-Wafer-Thinning-Machine22.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>La serie WG-1261 es una m\u00e1quina de adelgazamiento de obleas totalmente autom\u00e1tica y de alta precisi\u00f3n dise\u00f1ada para obleas de SiC de 12 pulgadas y m\u00e1s peque\u00f1as, as\u00ed como para materiales de zafiro, cuarzo y cer\u00e1mica. Como soluci\u00f3n integral de un proveedor de equipos de semiconductores de confianza, esta serie integra tecnolog\u00eda de husillo avanzada, portadores de obleas de alta carga y funciones de automatizaci\u00f3n para garantizar un adelgazamiento de obleas estable, preciso y eficaz.<\/p>\n<p data-start=\"640\" data-end=\"1014\">Equipada con husillos de alta potencia y alta precisi\u00f3n con cojinetes de aire y un soporte de obleas de nueva generaci\u00f3n con cojinetes de aire de alta carga y baja vibraci\u00f3n, la WG-1261 garantiza una rigidez superior y una mayor estabilidad del proceso. Su accionamiento de husillo envolvente de alta rigidez aumenta a\u00fan m\u00e1s la rigidez de la m\u00e1quina, permitiendo un control preciso incluso para materiales dif\u00edciles como el SiC y el zafiro.<\/p>\n<p data-start=\"1016\" data-end=\"1402\">La inclusi\u00f3n de la funci\u00f3n Autosetup permite a la m\u00e1quina completar autom\u00e1ticamente el reavivado de la muela tras la sustituci\u00f3n, lo que elimina la intervenci\u00f3n manual y mejora tanto la productividad como la uniformidad. Adem\u00e1s, una unidad de medici\u00f3n en l\u00ednea (rango 0-1800\u03bcm) garantiza un control preciso del espesor, mientras que la conectividad SECS\/GEM permite una integraci\u00f3n perfecta en las modernas f\u00e1bricas inteligentes.<\/p>\n<h2 data-section-id=\"14yhrip\" data-start=\"1409\" data-end=\"1434\"><span role=\"text\"><img decoding=\"async\" class=\"size-medium wp-image-2132 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WGP-1271C-Fully-Automatic-Wafer-Thinning-Machine.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Caracter\u00edsticas t\u00e9cnicas<\/span><\/h2>\n<ul data-start=\"1436\" data-end=\"2260\">\n<li data-section-id=\"1xc0mkx\" data-start=\"1436\" data-end=\"1563\">Husillos neum\u00e1ticos de alta precisi\u00f3n: Proporcionan un adelgazamiento de obleas estable y sin vibraciones para materiales dif\u00edciles de procesar.<\/li>\n<li data-section-id=\"37t7uh\" data-start=\"1564\" data-end=\"1698\">Soporte de obleas de baja vibraci\u00f3n y alta carga: Soporta obleas con una tensi\u00f3n m\u00ednima, mejorando el rendimiento y reduciendo los defectos.<\/li>\n<li data-section-id=\"1p2b5xc\" data-start=\"1699\" data-end=\"1804\">Accionamiento de husillo envolvente de alta rigidez: Mejora la rigidez general de la m\u00e1quina y la estabilidad del proceso.<\/li>\n<li data-section-id=\"y6q890\" data-start=\"1805\" data-end=\"1928\">Funci\u00f3n Autosetup: Realiza autom\u00e1ticamente el reavivado de la rueda tras la sustituci\u00f3n, minimizando el tiempo de preparaci\u00f3n y los errores humanos.<\/li>\n<li data-section-id=\"1p8d75e\" data-start=\"1929\" data-end=\"2032\">Unidad de medici\u00f3n en l\u00ednea: Controla con precisi\u00f3n el grosor de la oblea durante el procesamiento, rango 0-1800\u03bcm.<\/li>\n<li data-section-id=\"msisd3\" data-start=\"2033\" data-end=\"2155\">Conectividad SECS\/GEM: Admite la integraci\u00f3n en sistemas de fabricaci\u00f3n inteligentes para la supervisi\u00f3n y el control en tiempo real.<\/li>\n<li data-section-id=\"iot4di\" data-start=\"2156\" data-end=\"2260\">Compatibilidad con m\u00faltiples materiales: manipula obleas de SiC, zafiro, cuarzo y cer\u00e1mica de hasta 12 pulgadas.<\/li>\n<\/ul>\n<h2 data-section-id=\"k0zlak\" data-start=\"2267\" data-end=\"2286\"><span role=\"text\">Aplicaciones<\/span><\/h2>\n<p data-start=\"2288\" data-end=\"2320\">La serie WG-1261 es ideal para:<\/p>\n<ul data-start=\"2322\" data-end=\"2877\">\n<li data-section-id=\"kfu30m\" data-start=\"2322\" data-end=\"2432\">Adelgazamiento de obleas de SiC: Adelgazamiento de alta precisi\u00f3n para dispositivos de potencia, automoci\u00f3n y electr\u00f3nica industrial.<\/li>\n<li data-section-id=\"1fri4ex\" data-start=\"2433\" data-end=\"2534\">Procesado de obleas de zafiro: Ventanas \u00f3pticas, sustratos para LED y electr\u00f3nica de alto rendimiento.<\/li>\n<li data-section-id=\"9h80h3\" data-start=\"2535\" data-end=\"2649\">Procesado de obleas de cuarzo y cer\u00e1mica: Componentes de alta precisi\u00f3n para aplicaciones \u00f3pticas y de semiconductores.<\/li>\n<li data-section-id=\"111ewvs\" data-start=\"2650\" data-end=\"2751\">I+D y producci\u00f3n piloto: Para centros de investigaci\u00f3n y f\u00e1bricas que desarrollan materiales de nueva generaci\u00f3n.<\/li>\n<li data-section-id=\"3yqhm1\" data-start=\"2752\" data-end=\"2877\">Producci\u00f3n de alto rendimiento: El sistema automatizado garantiza resultados uniformes para la fabricaci\u00f3n de obleas a media y gran escala.<\/li>\n<\/ul>\n<h2 data-section-id=\"14caze6\" data-start=\"2884\" data-end=\"2913\"><span role=\"text\">Especificaciones de la m\u00e1quina<\/span><\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"2915\" data-end=\"3222\">\n<thead data-start=\"2915\" data-end=\"2947\">\n<tr data-start=\"2915\" data-end=\"2947\">\n<th class=\"\" data-start=\"2915\" data-end=\"2926\" data-col-size=\"sm\">Art\u00edculo<\/th>\n<th class=\"\" data-start=\"2926\" data-end=\"2947\" data-col-size=\"md\">Especificaci\u00f3n<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"2979\" data-end=\"3222\">\n<tr data-start=\"2979\" data-end=\"3087\">\n<td data-start=\"2979\" data-end=\"2991\" data-col-size=\"sm\">Estructura<\/td>\n<td data-start=\"2991\" data-end=\"3087\" data-col-size=\"md\">Husillo \u00d72 \/ Soporte de obleas \u00d73 \/ Mesa de trabajo \u00d71 \/ Sistema de transferencia y limpieza totalmente autom\u00e1tico \u00d71<\/td>\n<\/tr>\n<tr data-start=\"3088\" data-end=\"3133\">\n<td data-start=\"3088\" data-end=\"3104\" data-col-size=\"sm\">Potencia del husillo<\/td>\n<td data-col-size=\"md\" data-start=\"3104\" data-end=\"3133\">7,5 kW \/ 11 kW (opcional)<\/td>\n<\/tr>\n<tr data-start=\"3134\" data-end=\"3172\">\n<td data-start=\"3134\" data-end=\"3154\" data-col-size=\"sm\">Di\u00e1metro de rectificado<\/td>\n<td data-start=\"3154\" data-end=\"3172\" data-col-size=\"md\">\u03c66\u2033, \u03c68\u2033, \u03c612\u2033<\/td>\n<\/tr>\n<tr data-start=\"3173\" data-end=\"3222\">\n<td data-start=\"3173\" data-end=\"3194\" data-col-size=\"sm\">Dimensiones (An\u00d7P\u00d7Al)<\/td>\n<td data-start=\"3194\" data-end=\"3222\" data-col-size=\"md\">1450 mm \u00d7 3380 mm \u00d7 1900 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h2 data-section-id=\"y4d6ir\" data-start=\"3229\" data-end=\"3262\"><span role=\"text\"><img decoding=\"async\" class=\"size-medium wp-image-2128 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-150x150.png 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-768x768.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-12x12.png 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-600x600.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-100x100.png 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1.png 1000w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>\u00bfPor qu\u00e9 elegir la serie WG-1261?<\/span><\/h2>\n<ol data-start=\"3264\" data-end=\"3951\">\n<li data-section-id=\"i7vjnt\" data-start=\"3264\" data-end=\"3417\">Alta precisi\u00f3n y estabilidad: Los avanzados husillos con cojinetes de aire y los soportes de oblea de baja vibraci\u00f3n garantizan un adelgazamiento preciso de los materiales dif\u00edciles de procesar.<\/li>\n<li data-section-id=\"xan0nk\" data-start=\"3418\" data-end=\"3537\">Automatizaci\u00f3n y eficiencia: La configuraci\u00f3n autom\u00e1tica y los sistemas completos de transferencia\/limpieza de obleas reducen los costes de mano de obra y el tiempo de configuraci\u00f3n.<\/li>\n<li data-section-id=\"1af4sw8\" data-start=\"3538\" data-end=\"3671\">Soporte de materiales vers\u00e1til: Admite SiC, zafiro, cuarzo y cer\u00e1mica, lo que ofrece flexibilidad para m\u00faltiples l\u00edneas de producci\u00f3n.<\/li>\n<li data-section-id=\"1qwgi9o\" data-start=\"3672\" data-end=\"3826\">Medici\u00f3n integrada y conectividad inteligente: La medici\u00f3n de espesores en l\u00ednea combinada con SECS\/GEM garantiza la fiabilidad del proceso y la integraci\u00f3n en la f\u00e1brica.<\/li>\n<li data-section-id=\"1oxdc5b\" data-start=\"3827\" data-end=\"3951\">Reducci\u00f3n de los costes operativos: El dise\u00f1o optimizado y el uso de consumibles reducen el desperdicio de material y mejoran el rendimiento de la producci\u00f3n.<\/li>\n<\/ol>\n<h2 data-section-id=\"1nqqsko\" data-start=\"64\" data-end=\"103\"><span role=\"text\"><strong data-start=\"67\" data-end=\"103\">Preguntas m\u00e1s frecuentes (FAQ)<\/strong><\/span><\/h2>\n<ol data-start=\"105\" data-end=\"1366\">\n<li data-section-id=\"vtppo7\" data-start=\"105\" data-end=\"354\"><strong data-start=\"108\" data-end=\"171\">P: \u00bfQu\u00e9 tama\u00f1os y materiales de oblea admite la WG-1261?<\/strong><br data-start=\"171\" data-end=\"174\" \/><strong data-start=\"177\" data-end=\"183\">A:<\/strong> La m\u00e1quina admite obleas de hasta 12 pulgadas, incluidos materiales de SiC, zafiro, cuarzo y cer\u00e1mica, lo que proporciona opciones de procesamiento vers\u00e1tiles para m\u00faltiples l\u00edneas de producci\u00f3n.<\/li>\n<li data-section-id=\"1u7e5ll\" data-start=\"356\" data-end=\"596\"><strong data-start=\"359\" data-end=\"418\">P: \u00bfC\u00f3mo mejora la productividad la funci\u00f3n Autosetup?<\/strong><br data-start=\"418\" data-end=\"421\" \/><strong data-start=\"424\" data-end=\"430\">A:<\/strong> Autosetup completa autom\u00e1ticamente el reavivado de la rueda despu\u00e9s de la sustituci\u00f3n, eliminando la intervenci\u00f3n manual, reduciendo los errores de configuraci\u00f3n y ahorrando significativamente tiempo de producci\u00f3n.<\/li>\n<li data-section-id=\"1792hgl\" data-start=\"598\" data-end=\"825\"><strong data-start=\"601\" data-end=\"668\">P: \u00bfProporciona el WG-1261 un control preciso del grosor de las obleas?<\/strong><br data-start=\"668\" data-end=\"671\" \/><strong data-start=\"674\" data-end=\"680\">A:<\/strong> S\u00ed, est\u00e1 equipada con una unidad de medici\u00f3n en l\u00ednea (0-1800\u03bcm) que garantiza una supervisi\u00f3n y un control precisos del adelgazamiento de las obleas durante el procesamiento.<\/li>\n<li data-section-id=\"1e3mx58\" data-start=\"827\" data-end=\"1053\"><strong data-start=\"830\" data-end=\"883\">P: \u00bfPuede integrarse el WG-1261 en f\u00e1bricas inteligentes?<\/strong><br data-start=\"883\" data-end=\"886\" \/><strong data-start=\"889\" data-end=\"895\">A:<\/strong> Absolutamente. La m\u00e1quina soporta <strong data-start=\"929\" data-end=\"954\">Conectividad SECS\/GEM<\/strong>, que permite la supervisi\u00f3n en tiempo real, la recopilaci\u00f3n de datos y la integraci\u00f3n con sistemas de fabricaci\u00f3n inteligentes.<\/li>\n<li data-section-id=\"1bzwvfu\" data-start=\"1055\" data-end=\"1366\"><strong data-start=\"1058\" data-end=\"1144\">P: \u00bfC\u00f3mo garantiza la WG-1261 el procesamiento estable de obleas de materiales dif\u00edciles de adelgazar?<\/strong><br data-start=\"1144\" data-end=\"1147\" \/><strong data-start=\"1150\" data-end=\"1156\">A:<\/strong> Con husillos de alta potencia con cojinetes de aire, un portador de obleas de baja vibraci\u00f3n y alta carga, y un accionamiento de husillo envolvente de alta rigidez, la WG-1261 mantiene una excelente estabilidad de proceso incluso para obleas de SiC y zafiro.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"<p data-start=\"3977\" data-end=\"4488\">La m\u00e1quina de adelgazamiento de obleas totalmente autom\u00e1tica de la serie WG-1261 es la soluci\u00f3n perfecta para el procesamiento moderno de obleas \u00f3pticas y de semiconductores. Con alta precisi\u00f3n, automatizaci\u00f3n avanzada y compatibilidad multimaterial, ofrece un adelgazamiento de obleas consistente, eficiente y fiable para obleas de SiC, zafiro, cuarzo y cer\u00e1mica de hasta 12 pulgadas. Ideal para I+D, producci\u00f3n piloto y fabricaci\u00f3n a mediana y gran escala, la serie WG-1261 garantiza un mayor rendimiento, menores costes de mano de obra y una eficiencia de producci\u00f3n optimizada.<\/p>","protected":false},"featured_media":2135,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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