{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/es\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"M\u00e1quina semiautom\u00e1tica de pegado de obleas a temperatura ambiente para el procesamiento de obleas de 2 a 12 pulgadas"},"content":{"rendered":"

\"\"La m\u00e1quina semiautom\u00e1tica de uni\u00f3n de obleas a temperatura ambiente es un sistema de alta precisi\u00f3n para la uni\u00f3n de obleas y chips. Al combinar la presi\u00f3n mec\u00e1nica con la tecnolog\u00eda de activaci\u00f3n de superficies in situ, permite la uni\u00f3n permanente a temperatura ambiente (20-30 \u00b0C) sin adhesivos ni procesamiento a alta temperatura. Esto minimiza el estr\u00e9s t\u00e9rmico y la deformaci\u00f3n del material, por lo que resulta ideal para materiales heterog\u00e9neos y sensibles al calor. La m\u00e1quina admite tama\u00f1os de oblea de 2 a 12 pulgadas y es adecuada para investigaci\u00f3n, producci\u00f3n piloto y fabricaci\u00f3n a peque\u00f1a y mediana escala.<\/p>\n

\"\"Caracter\u00edsticas principales<\/strong><\/h2>\n
    \n
  1. Adhesi\u00f3n a temperatura ambiente<\/strong> - Funciona a 25 \u00b1 5\u00b0C para evitar el desajuste t\u00e9rmico y el alabeo de las obleas.<\/li>\n
  2. Activaci\u00f3n de la superficie<\/strong> - La activaci\u00f3n qu\u00edmica o por plasma mejora la resistencia de la uni\u00f3n; la pulverizaci\u00f3n cat\u00f3dica opcional mejora la calidad de la interfaz.<\/li>\n
  3. Alineaci\u00f3n de alta precisi\u00f3n<\/strong> - Sistema de alineaci\u00f3n visual y plataforma de movimiento de precisi\u00f3n con una exactitud de \u00b10,5 \u03bcm.<\/li>\n
  4. Amplia compatibilidad de materiales<\/strong> - Soporta Si, SiC, GaAs, GaN, InP, zafiro, vidrio, LiNbO\u2083, LiTaO\u2083, diamante y pol\u00edmeros seleccionados.<\/li>\n
  5. Funcionamiento semiautom\u00e1tico<\/strong> - Carga manual de obleas con proceso de pegado automatizado; recetas programables para resultados repetibles.<\/li>\n
  6. Entorno limpio y estable<\/strong> - El sistema de limpieza Clase 100 incorporado garantiza una baja contaminaci\u00f3n y una tasa de vac\u00edo de la interfaz <0,1%.<\/li>\n<\/ol>\n

    Especificaciones t\u00e9cnicas<\/strong><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Par\u00e1metro<\/th>\nEspecificaci\u00f3n<\/th>\n<\/tr>\n<\/thead>\n
    Tama\u00f1o de la oblea<\/td>\n2\u2033 - 12\u2033, compatible con muestras irregulares<\/td>\n<\/tr>\n
    Temperatura de adhesi\u00f3n<\/td>\n20-30\u00b0C<\/td>\n<\/tr>\n
    Presi\u00f3n m\u00e1xima<\/td>\n80 kN<\/td>\n<\/tr>\n
    Control de la presi\u00f3n<\/td>\n0-5000 N ajustable, \u00b11 N de resoluci\u00f3n<\/td>\n<\/tr>\n
    Precisi\u00f3n de alineaci\u00f3n<\/td>\n\u00b10,5 \u03bcm<\/td>\n<\/tr>\n
    Fuerza de adhesi\u00f3n<\/td>\n\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n
    Tratamiento de superficies<\/td>\nActivaci\u00f3n in situ + deposici\u00f3n por pulverizaci\u00f3n cat\u00f3dica<\/td>\n<\/tr>\n
    Modo de alimentaci\u00f3n<\/td>\nManual<\/td>\n<\/tr>\n
    Nivel de limpieza<\/td>\nClase 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Tecnolog\u00eda b\u00e1sica<\/strong><\/h2>\n
      \n
    1. Adhesi\u00f3n directa a temperatura ambiente<\/strong> - Las superficies activadas contactan bajo presi\u00f3n controlada formando uniones estables sin recocido t\u00e9rmico.<\/li>\n
    2. Activaci\u00f3n de la superficie<\/strong> - Aumenta la energ\u00eda superficial, elimina los contaminantes y mejora la uniformidad de adhesi\u00f3n entre los materiales.<\/li>\n<\/ol>\n

      \"\"Aplicaciones<\/strong><\/h2>\n
        \n
      1. Envasado avanzado de semiconductores<\/strong> - Apilamiento de circuitos integrados en 3D, uni\u00f3n de TSV, integraci\u00f3n heterog\u00e9nea de chips l\u00f3gicos y de memoria.<\/li>\n
      2. Fabricaci\u00f3n de MEMS<\/strong> - Envasado al vac\u00edo de obleas para sensores como aceler\u00f3metros y giroscopios.<\/li>\n
      3. Optoelectr\u00f3nica y pantallas<\/strong> - Pegado de LED, pegado de sustratos de zafiro y vidrio, montaje de m\u00f3dulos \u00f3pticos AR\/VR.<\/li>\n
      4. Microfluidos y biochips<\/strong> - uni\u00f3n de PDMS y vidrio preservando la actividad biol\u00f3gica.<\/li>\n
      5. Investigaci\u00f3n y dispositivos emergentes<\/strong> - Electr\u00f3nica flexible, dispositivos cu\u00e1nticos e integraci\u00f3n de materiales heterog\u00e9neos.<\/li>\n<\/ol>\n

        Servicio y asistencia<\/strong><\/h2>\n
          \n
        1. Desarrollo de procesos<\/strong> - Optimizaci\u00f3n de los par\u00e1metros de adhesi\u00f3n y soluciones de activaci\u00f3n superficial para distintos materiales.<\/li>\n
        2. Personalizaci\u00f3n de equipos<\/strong> - M\u00f3dulos de alineaci\u00f3n de alta precisi\u00f3n, c\u00e1maras de vac\u00edo o de atm\u00f3sfera controlada.<\/li>\n
        3. Formaci\u00f3n t\u00e9cnica<\/strong> - Orientaci\u00f3n sobre el funcionamiento in situ y depuraci\u00f3n de procesos.<\/li>\n
        4. Asistencia posventa<\/strong> - Garant\u00eda de 12 meses, sustituci\u00f3n r\u00e1pida de componentes clave, diagn\u00f3stico remoto y actualizaciones de software.<\/li>\n<\/ol>\n

          PREGUNTAS FRECUENTES<\/h2>\n

          P: \u00bfCu\u00e1l es la principal ventaja del encolado a temperatura ambiente?
          R: Elimina el estr\u00e9s t\u00e9rmico y permite una uni\u00f3n fiable de materiales termosensibles y heterog\u00e9neos.<\/p>\n

          P: \u00bfQu\u00e9 materiales pueden adherirse?
          A: Silicio, carburo de silicio, nitruro de galio, arseniuro de galio, fosfuro de indio, zafiro, vidrio, niobato de litio, diamante y pol\u00edmeros seleccionados.<\/p>","protected":false},"excerpt":{"rendered":"

          La m\u00e1quina semiautom\u00e1tica de uni\u00f3n de obleas a temperatura ambiente es un sistema de alta precisi\u00f3n para la uni\u00f3n de obleas y chips. Al combinar la presi\u00f3n mec\u00e1nica con la tecnolog\u00eda de activaci\u00f3n de superficies in situ, permite la uni\u00f3n permanente a temperatura ambiente (20-30 \u00b0C) sin adhesivos ni procesamiento a alta temperatura.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[23],"product_tag":[617,613,601,614,615,616,625,630,621,622,626,636,623,634,624,627,629,628,633,631,612,620,611,635,618,619,632],"class_list":{"0":"post-2030","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bonding-machine","7":"product_tag-12-inch-wafer","8":"product_tag-2-inch-wafer","9":"product_tag-3d-ic-integration","10":"product_tag-4-inch-wafer","11":"product_tag-6-inch-wafer","12":"product_tag-8-inch-wafer","13":"product_tag-diamond-wafer-bonding","14":"product_tag-flexible-electronics","15":"product_tag-gaas-bonding","16":"product_tag-gan-bonding","17":"product_tag-glass-wafer-bonding","18":"product_tag-high-precision-alignment","19":"product_tag-inp-bonding","20":"product_tag-low-temperature-bonding","21":"product_tag-lt-ln-bonding","22":"product_tag-mems-packaging","23":"product_tag-microfluidic-chip","24":"product_tag-optoelectronics","25":"product_tag-plasma-bonding","26":"product_tag-quantum-devices","27":"product_tag-room-temperature-bonding","28":"product_tag-sapphire-bonding","29":"product_tag-semi-automatic-wafer-bonding","30":"product_tag-semi-automatic-equipment","31":"product_tag-si-wafer-bonding","32":"product_tag-sic-wafer-bonding","33":"product_tag-surface-activation","34":"desktop-align-left","35":"tablet-align-left","36":"mobile-align-left","37":"ast-product-gallery-layout-horizontal-slider","38":"ast-product-tabs-layout-horizontal","40":"first","41":"instock","42":"shipping-taxable","43":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product\/2030","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/comments?post=2030"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product\/2030\/revisions"}],"predecessor-version":[{"id":2037,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product\/2030\/revisions\/2037"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/media\/2031"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/media?parent=2030"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product_brand?post=2030"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product_cat?post=2030"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/es\/wp-json\/wp\/v2\/product_tag?post=2030"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}