![\"WP-4300](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-4300-Precision-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Fragile-Substrates2-300x300.png\")
The WP-4300 Precision Grinding Machine is a high-performance system designed for precision surface grinding and polishing of fragile semiconductor materials. It is specifically engineered to process 4-inch and 6-inch substrates, making it suitable for both laboratory-scale research and small-batch production environments.<\/p>\n
This machine is widely used for materials such as CdZnTe (CZT), HgCdTe (MCT), GaAs, InP, and InSb, which are commonly applied in infrared detection, optoelectronics, and advanced semiconductor devices. With its optimized structural design and intelligent motion control, the WP-4300 ensures uniform material removal, excellent surface flatness, and minimal subsurface damage.<\/p>\n
The compact footprint of only 0.75 m\u00b2 makes it an ideal solution for facilities with limited space while maintaining high precision and operational flexibility.<\/p>\n
The WP-4300 is optimized for soft and brittle materials, ensuring stable processing without inducing cracks or excessive stress.<\/p>\n
Equipped with 4-inch and 6-inch carriers, the system supports multiple wafer sizes with:<\/p>\n
The machine features a precision-controlled swing arm that can operate independently with automatic positioning. The fixture can rotate along a fixed axis or follow the swing arm in a sector motion, enabling complex motion paths for improved surface uniformity.<\/p>\n
The integrated diaphragm pump provides:<\/p>\n
The machine adopts a magnetic suspension stirring system with a 5L tank capacity, ensuring uniform slurry mixing and stable process performance.<\/p>\n
| Item<\/th>\n | Specification<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|
| Workpiece Size<\/td>\n | 4 inch (compatible with 3 inch) \/ 6 inch<\/td>\n<\/tr>\n |
| Plate Diameter<\/td>\n | \u03a6420 mm<\/td>\n<\/tr>\n |
| Plate Speed<\/td>\n | 0 \u2013 150 rpm<\/td>\n<\/tr>\n |
| Cooling Method<\/td>\n | Water Cooling<\/td>\n<\/tr>\n |
| Fixture Quantity<\/td>\n | 2 (4 inch) \/ 1 (6 inch)<\/td>\n<\/tr>\n |
| Mounting Method<\/td>\n | Vacuum Adsorption<\/td>\n<\/tr>\n |
| Pressure Range<\/td>\n | 0.2 \u2013 5 kg \/ 0.2 \u2013 6.5 kg<\/td>\n<\/tr>\n |
| Swing Range<\/td>\n | -13\u00b0 ~ +6\u00b0 \/ -2\u00b0 ~ -7\u00b0<\/td>\n<\/tr>\n |
| Auxiliary Speed<\/td>\n | 0 \u2013 100 rpm<\/td>\n<\/tr>\n |
| Pump Flow Rate<\/td>\n | 0.07 \u2013 1481 ml\/min<\/td>\n<\/tr>\n |
| Drive Type<\/td>\n | DC Brushless Motor<\/td>\n<\/tr>\n |
| Stirring Method<\/td>\n | Magnetic Stirring<\/td>\n<\/tr>\n |
| Tank Capacity<\/td>\n | 5 L<\/td>\n<\/tr>\n |
| Machine Size<\/td>\n | 960 \u00d7 765 \u00d7 1601 mm<\/td>\n<\/tr>\n |
| Weight<\/td>\n | Approx. 600 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n \n
\n The WP-4300 operates by combining <\/span>controlled mechanical grinding with slurry-assisted material removal. The wafer is fixed onto a vacuum chuck, while the grinding plate rotates at a controlled speed.<\/span><\/div>\n<\/div>\n<\/div>\n The swing arm motion, combined with fixture rotation, ensures uniform distribution of contact pressure and abrasive action. This multi-directional motion helps achieve:<\/p>\n
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![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/WP-4300-Precision-Grinding-Machine-for-6-Inch-Semiconductor-Materials-and-Fragile-Substrates-300x189.jpg\")
Working Principle<\/h2>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/04\/Wafer-Back-Grinding-Machine-1-300x300.png\")
Core Advantages<\/h2>\n