H\u00e4ufig gestellte Fragen (FAQ)<\/span><\/h3>\nQ1: Wof\u00fcr wird ein Pikosekunden-Infrarot-Laserschneidsystem verwendet?
A: Es wird f\u00fcr das Pr\u00e4zisionsschneiden von harten und spr\u00f6den Materialien wie Saphir, Quarz und optischem Glas verwendet, wobei eine Genauigkeit im Mikrometerbereich bei minimaler thermischer Besch\u00e4digung erreicht wird.<\/p>\n
F2: Warum sollte man Pikosekundenlaser den Nanosekundenlasern vorziehen?
A: Pikosekundenlaser bieten eine deutlich kleinere W\u00e4rmeeinflusszone (<1\u03bcm), eliminieren Mikrorisse und Abplatzungen und liefern eine hervorragende Kantenqualit\u00e4t, was sie ideal f\u00fcr hochpr\u00e4zise Anwendungen und ultrad\u00fcnne Materialien macht.<\/p>\n
F3: Welchen Dickenbereich kann das System verarbeiten?
A: Das System unterst\u00fctzt ein breites Spektrum von 0,03 mm ultrad\u00fcnnen Materialien bis hin zu 80 mm dicken Substraten und bietet somit eine hervorragende Flexibilit\u00e4t f\u00fcr verschiedene Anwendungen.<\/p>\n
F4: Ist das System f\u00fcr die Massenproduktion geeignet?
A: Ja, das Design mit zwei Plattformen erm\u00f6glicht einen kontinuierlichen Betrieb mit einer \u00fcber 30% h\u00f6heren Effizienz und ist damit ideal f\u00fcr Produktionsumgebungen mit hohen St\u00fcckzahlen.<\/p>\n
F5: Sind f\u00fcr das Verfahren Verbrauchsmaterialien oder eine Nachbearbeitung erforderlich?
A: Nein, das System ist verbrauchsmittelfrei und erzeugt glatte, gratfreie Kanten, so dass keine zus\u00e4tzlichen Polier- oder Endbearbeitungsprozesse erforderlich sind.<\/p>","protected":false},"excerpt":{"rendered":"
Das ZMSH Infrarot-Pikosekunden-Doppelplattform-Laserschneidsystem ist eine hochpr\u00e4zise Industriel\u00f6sung, die f\u00fcr die fortschrittliche Bearbeitung von harten und spr\u00f6den Materialien wie Saphir, Quarz und optischem Glas entwickelt wurde.<\/p>","protected":false},"featured_media":2017,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[21],"product_tag":[573,589,567,574,590,57,583,588,566,585,584,577,575,570,580,572,445,586,569,581,579,582,576,578,571,587,568],"class_list":{"0":"post-2010","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-laser-cutting","7":"product_tag-1064nm-laser-cutting","8":"product_tag-automation-laser-system","9":"product_tag-dual-platform-laser-cutting-system","10":"product_tag-glass-cold-processing","11":"product_tag-high-efficiency-glass-cutting","12":"product_tag-high-precision-laser-cutting","13":"product_tag-high-speed-laser-cutting","14":"product_tag-industrial-laser-equipment","15":"product_tag-infrared-picosecond-laser-cutting","16":"product_tag-low-heat-affected-zone","17":"product_tag-micron-level-precision-cutting","18":"product_tag-multiphoton-absorption-cutting","19":"product_tag-non-contact-laser-machining","20":"product_tag-optical-glass-processing","21":"product_tag-optical-lens-cutting","22":"product_tag-picosecond-laser-technology","23":"product_tag-quartz-glass-cutting","24":"product_tag-ra0-5m-surface-finish","25":"product_tag-sapphire-laser-cutting","26":"product_tag-semiconductor-wafer-laser-cutting","27":"product_tag-smartwatch-glass-cutting","28":"product_tag-tempered-glass-processing","29":"product_tag-transparent-material-laser-cutting","30":"product_tag-ultra-thin-glass-cutting","31":"product_tag-ultrafast-laser-cutting","32":"product_tag-zero-taper-cutting","33":"product_tag-zmsh-laser-equipment","34":"desktop-align-left","35":"tablet-align-left","36":"mobile-align-left","37":"ast-product-gallery-layout-horizontal-slider","38":"ast-product-tabs-layout-horizontal","40":"first","41":"instock","42":"shipping-taxable","43":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2010","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/comments?post=2010"}],"version-history":[{"count":4,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2010\/revisions"}],"predecessor-version":[{"id":2019,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2010\/revisions\/2019"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/media\/2017"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/media?parent=2010"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_brand?post=2010"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_cat?post=2010"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_tag?post=2010"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/11-300x265.jpg\")
Durch die Nutzung von Multiphotonen-Absorption und nichtlinearen optischen Effekten erreicht das System minimale W\u00e4rmeeinflusszonen (<1\u03bcm) und eine hervorragende Oberfl\u00e4chenqualit\u00e4t (Ra <0,5\u03bcm) bei gleichzeitiger Bearbeitungsgenauigkeit im Mikrometerbereich (\u00b12\u03bcm). Im Vergleich zu konventionellen thermischen Bearbeitungsmethoden werden dadurch Mikrorisse, Kantenausbr\u00fcche und innere Spannungen erheblich reduziert, was die strukturelle Integrit\u00e4t der bearbeiteten Komponenten gew\u00e4hrleistet.<\/p>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Laser-Cutting-System8-300x300.webp\")
Das System basiert auf fortschrittlichen Mechanismen der ultraschnellen Laser-Material-Wechselwirkung:<\/p>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/pl205574970-infrared_picosecond_dual_platform_laser_cutting_equipment_for_sapphire_quartz_optical_glass_processing9-300x272.webp\")
<\/p>\n