![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting6.png\")
<\/p>\nDie vollautomatische Pr\u00e4zisionss\u00e4ge ZMSH ist ein fortschrittliches System zum Schneiden von Halbleitern und spr\u00f6den Materialien, das f\u00fcr das hochpr\u00e4zise Trennen von Wafern entwickelt wurde. Sie eignet sich f\u00fcr 8-Zoll- und 12-Zoll-Wafer sowie f\u00fcr eine breite Palette empfindlicher Materialien wie Keramik, Glas, Aluminiumnitrid, PZT und Epoxid-Substrate. Durch den Einsatz von Diamantbl\u00e4ttern mit Geschwindigkeiten von bis zu 60.000 Umdrehungen pro Minute erreicht das System eine Schnittgenauigkeit im Mikrometerbereich (\u00b12\u03bcm) bei gleichzeitiger Minimierung von Ausbr\u00fcchen (<5\u03bcm) und ist damit ideal f\u00fcr Anwendungen, bei denen Ausbeute, Pr\u00e4zision und Oberfl\u00e4chenintegrit\u00e4t entscheidend sind.<\/p>\n
<\/p>\n
Dieses vollautomatische System integriert zweiachsige Spindeln mit hoher Steifigkeit, nanometrische Positioniertische und eine intelligente Bildausrichtung, um alle wichtigen Vorg\u00e4nge - einschlie\u00dflich Laden, Positionieren, Schneiden und Pr\u00fcfen - ohne manuelle Eingriffe durchzuf\u00fchren. Der zweispindlige Synchronschnittmodus verbessert den Bearbeitungsdurchsatz um bis zu 80% im Vergleich zu herk\u00f6mmlichen einspindligen Systemen. Hochwertige importierte Komponenten, darunter Kugelumlaufspindeln, Linearf\u00fchrungen und eine geschlossene Steuerung der Y-Achse mit Gitterrosten, sorgen f\u00fcr gleichbleibende Langzeitstabilit\u00e4t und Bearbeitungszuverl\u00e4ssigkeit, selbst in Produktionsumgebungen mit hohen St\u00fcckzahlen.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/fully_automatic_precision_dicing_saw_equipment_for_8inch_12inch_wafer_cutting3-300x223.webp\")
Technische Daten<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting4-300x240.jpg\")
Die wichtigsten Vorteile<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting5-300x240.jpg\")
Wesentliche Merkmale<\/h3>\nDie ZMSH-Pr\u00e4zisionss\u00e4ge ist mit einer Vielzahl von Materialien kompatibel und bietet ma\u00dfgeschneiderte Schnittl\u00f6sungen f\u00fcr das moderne Halbleiter- und Elektronikgeh\u00e4use:<\/p>\n
| Material<\/th>\n | Typische Anwendungen<\/th>\n | Anforderungen an die Verarbeitung<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|---|
| Aluminiumnitrid (AlN)<\/td>\n | LED-Substrate, thermische Substrate mit hoher Leistung<\/td>\n | Spannungsarmes W\u00fcrfeln, Vermeidung von Delamination<\/td>\n<\/tr>\n |
| PZT-Keramik<\/td>\n | 5G-Filter, SAW-Bauelemente<\/td>\n | Hochfrequenzstabiles Schneiden<\/td>\n<\/tr>\n |
| Bismut-Tellurid (Bi\u2082Te\u2083)<\/td>\n | Thermoelektrische Module<\/td>\n | Verarbeitung bei niedrigen Temperaturen<\/td>\n<\/tr>\n |
| Monokristallines Silizium (Si)<\/td>\n | IC-Chips<\/td>\n | Submikron-Dicing-Genauigkeit<\/td>\n<\/tr>\n |
| Epoxidharz-Formmasse<\/td>\n | BGA-Substrate<\/td>\n | Kompatibilit\u00e4t von Multilayer-Materialien<\/td>\n<\/tr>\n |
| Cu-S\u00e4ulen \/ PI-Dielektrikum<\/td>\n | WLCSP<\/td>\n | Verarbeitung ultrad\u00fcnner Wafer<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\nAnwendungen und Vorteile<\/h3>\nDie vollautomatische ZMSH-S\u00e4ge eignet sich f\u00fcr die Halbleiterherstellung, fortschrittliches Packaging, LED-Produktion, MEMS-Bauteile und thermoelektrische Module. Ihre Pr\u00e4zision gew\u00e4hrleistet eine hohe Ausbeute, minimale Besch\u00e4digung der Wafer und eine gleichbleibende Schnittqualit\u00e4t, selbst bei der Verarbeitung empfindlicher oder ultrad\u00fcnner Wafer. Die Kombination aus Automatisierung, Doppelspindelschneiden und Echtzeit-Fehlerkorrektur macht ihn ideal f\u00fcr industrielle Anwendungen mit hohem Durchsatz.<\/p>\n H\u00e4ufig gestellte Fragen<\/h3>\nF1: Welche Materialien k\u00f6nnen mit diesem System geschnitten werden? F2: Wie verbessert der Zweispindelmodus die Produktion? F3: Ist das System vollst\u00e4ndig automatisiert? F4: Wie d\u00fcnn sind die Wafer, die damit verarbeitet werden k\u00f6nnen? F5: Kann das System in bestehende Fabrikautomationslinien integriert werden? Die vollautomatische Pr\u00e4zisionss\u00e4ge ZMSH ist ein fortschrittliches System zum Schneiden von Halbleitern und spr\u00f6den Materialien, das f\u00fcr das hochpr\u00e4zise Trennen von Wafern entwickelt wurde.<\/p>","protected":false},"featured_media":2007,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[21],"product_tag":[557,541,540,554,555,553,564,543,563,545,546,565,538,544,556,561,548,549,559,562,552,558,542,551,547,560,550,539],"class_list":{"0":"post-2000","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-laser-cutting","7":"product_tag-2m-accuracy","8":"product_tag-12-inch-wafer-cutting","9":"product_tag-8-inch-wafer-cutting","10":"product_tag-advanced-packaging","11":"product_tag-automated-wafer-dicing","12":"product_tag-bga-substrates","13":"product_tag-blade-breakage-monitoring","14":"product_tag-ceramic-wafer-cutting","15":"product_tag-cut-mark-inspection","16":"product_tag-diamond-blade-technology","17":"product_tag-dual-spindle-cutting","18":"product_tag-factory-automation-integration","19":"product_tag-fully-automatic-precision-dicing-saw","20":"product_tag-glass-wafer-cutting","21":"product_tag-high-precision-cutting","22":"product_tag-high-throughput-wafer-cutting","23":"product_tag-ic-chips","24":"product_tag-led-substrates","25":"product_tag-nanometric-positioning","26":"product_tag-non-contact-height-measurement","27":"product_tag-pzt-ceramic","28":"product_tag-rohs-certified","29":"product_tag-semiconductor-dicing","30":"product_tag-thermoelectric-modules","31":"product_tag-ultra-thin-wafer-processing","32":"product_tag-vision-alignment","33":"product_tag-wlcsp","34":"product_tag-zmsh","35":"desktop-align-left","36":"tablet-align-left","37":"mobile-align-left","38":"ast-product-gallery-layout-horizontal-slider","39":"ast-product-tabs-layout-horizontal","41":"first","42":"instock","43":"shipping-taxable","44":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2000","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/comments?post=2000"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2000\/revisions"}],"predecessor-version":[{"id":2009,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product\/2000\/revisions\/2009"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/media\/2007"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/media?parent=2000"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_brand?post=2000"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_cat?post=2000"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/de\/wp-json\/wp\/v2\/product_tag?post=2000"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}} |