{"id":2512,"date":"2026-06-02T06:04:17","date_gmt":"2026-06-02T06:04:17","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2512"},"modified":"2026-07-08T09:47:29","modified_gmt":"2026-07-08T09:47:29","slug":"sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/cs\/product\/sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging\/","title":{"rendered":"Do\u010dasn\u00fd nosi\u010d desti\u010dek Sapphire pro pokro\u010dil\u00e9 balen\u00ed polovodi\u010d\u016f"},"content":{"rendered":"

Do\u010dasn\u00fd nosi\u010d desti\u010dek ze saf\u00edru je vysoce v\u00fdkonn\u00fd substr\u00e1t navr\u017een\u00fd pro pokro\u010dil\u00e9 procesy balen\u00ed polovodi\u010d\u016f, zejm\u00e9na pro manipulaci s ultratenk\u00fdmi desti\u010dkami a aplikace v oblasti heterogenn\u00ed integrace.<\/p>\n

\u0160iroce se vyu\u017e\u00edv\u00e1 p\u0159i balen\u00ed integrovan\u00fdch obvod\u016f 2,5D\/3D, v procesech TSV a RDL, p\u0159i balen\u00ed typu fan-out na \u00farovni desti\u010dek a panel\u016f (FOWLP\/FOPLP) a v pracovn\u00edch postupech do\u010dasn\u00e9ho spojov\u00e1n\u00ed a odpojov\u00e1n\u00ed.<\/p>\n

Tento nosi\u010d, navr\u017een\u00fd s ohledem na mimo\u0159\u00e1dnou tuhost a vynikaj\u00edc\u00ed tepelnou stabilitu, poskytuje p\u0159esnou a stabiln\u00ed mechanickou platformu pro zten\u010dov\u00e1n\u00ed desti\u010dek a zpracov\u00e1n\u00ed jejich zadn\u00ed strany. Umo\u017e\u0148uje tak spolehlivou manipulaci s desti\u010dkami o tlou\u0161\u0165ce ni\u017e\u0161\u00ed ne\u017e 50 \u03bcm p\u0159i zachov\u00e1n\u00ed rozm\u011brov\u00e9 stability i za n\u00e1ro\u010dn\u00fdch podm\u00ednek teplotn\u00edch cykl\u016f.<\/p>\n

\"\"<\/p>\n

\n

\"\"V\u00fdzvy v odv\u011btv\u00ed<\/strong><\/span><\/h2>\n

Pokro\u010dil\u00e9 balen\u00ed se neust\u00e1le vyv\u00edj\u00ed sm\u011brem k ten\u010d\u00edm struktur\u00e1m, v\u011bt\u0161\u00edm form\u00e1t\u016fm a vy\u0161\u0161\u00ed hustot\u011b integrace. Nestabilita v\u00fdrobn\u00edho procesu v\u0161ak z\u016fst\u00e1v\u00e1 z\u00e1sadn\u00edm \u00faskal\u00edm.<\/p>\n

Mezi hlavn\u00ed technick\u00e9 v\u00fdzvy pat\u0159\u00ed:<\/p>\n

    \n
  • Nesoulad koeficient\u016f tepeln\u00e9 rozta\u017enosti (CTE) u r\u016fzn\u00fdch obalov\u00fdch materi\u00e1l\u016f<\/li>\n
  • Hromad\u011bn\u00ed nap\u011bt\u00ed p\u0159i opakovan\u00fdch teplotn\u00edch cyklech<\/li>\n
  • Smr\u0161\u0165ov\u00e1n\u00ed lepidla p\u0159i vytvrzov\u00e1n\u00ed a deformace na rozhran\u00ed<\/li>\n
  • Nerovnom\u011brn\u00e9 rozlo\u017een\u00ed tlou\u0161\u0165ky v souborech ultratenk\u00fdch desti\u010dek<\/li>\n
  • Odchylka vyrovn\u00e1n\u00ed zp\u016fsoben\u00e1 deformac\u00ed a ztr\u00e1ta v\u00fdt\u011b\u017enosti<\/li>\n
  • Mechanick\u00e1 k\u0159ehkost ultratenk\u00fdch desti\u010dek p\u0159i manipulaci a p\u0159enosu<\/li>\n<\/ul>\n

    Tyto probl\u00e9my maj\u00ed v\u00fdznamn\u00fd dopad na v\u00fdt\u011b\u017enost, spolehlivost a \u0161k\u00e1lovatelnost proces\u016f p\u0159i v\u00fdrob\u011b modern\u00edch obalov\u00fdch syst\u00e9m\u016f.<\/p>\n

    \n

    \"\"\u0158e\u0161en\u00ed: Platforma Sapphire Carrier<\/strong><\/span><\/h2>\n

    Saf\u00edr p\u0159edstavuje ide\u00e1ln\u00ed materi\u00e1lovou platformu pro do\u010dasn\u00e9 nosi\u010de desti\u010dek d\u00edky sv\u00e9 p\u0159irozen\u00e9 kombinaci mechanick\u00e9 pevnosti, optick\u00e9 pr\u016fhlednosti a tepeln\u00e9 stability.<\/p>\n

    Umo\u017e\u0148uje:<\/p>\n

      \n
    • Vysoce p\u0159esn\u00e1 mechanick\u00e1 podpora pro ultratenk\u00e9 desti\u010dky<\/li>\n
    • Men\u0161\u00ed zkroucen\u00ed a deformace b\u011bhem zpracov\u00e1n\u00ed<\/li>\n
    • Kompatibilita s technologiemi odlepov\u00e1n\u00ed vyu\u017e\u00edvaj\u00edc\u00edmi laser<\/li>\n
    • Rovnom\u011brn\u00e9 rozlo\u017een\u00ed nap\u011bt\u00ed na podkladech s velkou plochou<\/li>\n
    • Stabiln\u00ed v\u00fdkon v prost\u0159ed\u00ed s vysok\u00fdmi teplotami a v chemick\u00e9m prost\u0159ed\u00ed<\/li>\n<\/ul>\n
      \n

      Hlavn\u00ed v\u00fdhody z hlediska v\u00fdkonu<\/strong><\/span><\/h2>\n

      Vysok\u00fd modul pru\u017enosti (345\u2013420 GPa)<\/strong>
      Zaji\u0161\u0165uje mimo\u0159\u00e1dnou tuhost a \u00fa\u010dinn\u011b potla\u010duje oh\u00fdb\u00e1n\u00ed desti\u010dek a deformaci konstrukce b\u011bhem tepeln\u00fdch a mechanick\u00fdch proces\u016f.<\/p>\n

      Vysok\u00e1 mechanick\u00e1 pevnost (1800\u20132200 HV)<\/strong>
      Zaji\u0161\u0165uje vysokou odolnost proti po\u0161kozen\u00ed povrchu a mechanick\u00e9mu opot\u0159eben\u00ed, co\u017e umo\u017e\u0148uje dlouhodob\u00e9 opakovan\u00e9 pou\u017eit\u00ed v pr\u016fmyslov\u00e9m prost\u0159ed\u00ed.<\/p>\n

      Vysok\u00e1 optick\u00e1 propustnost (>83%, 300\u20131200 nm)<\/strong>
      Umo\u017e\u0148uje efektivn\u00ed p\u0159enos laserov\u00e9ho z\u00e1\u0159en\u00ed a podporuje pokro\u010dil\u00e9 procesy odlepov\u00e1n\u00ed laserem i do\u010dasn\u00e9ho lepen\u00ed.<\/p>\n

      Vynikaj\u00edc\u00ed rovnom\u011brnost materi\u00e1lu<\/strong>
      Minimalizuje lok\u00e1ln\u00ed kol\u00eds\u00e1n\u00ed nap\u011bt\u00ed na velkoform\u00e1tov\u00fdch nosi\u010d\u00edch, \u010d\u00edm\u017e zvy\u0161uje konzistenci procesu a stabilitu v\u00fdt\u011b\u017enosti.<\/p>\n

      Vynikaj\u00edc\u00ed tepeln\u00e1 a chemick\u00e1 stabilita<\/strong>
      Zachov\u00e1v\u00e1 si struktur\u00e1ln\u00ed integritu i p\u0159i opakovan\u00fdch teplotn\u00edch cyklech a chemick\u00e9m \u010di\u0161t\u011bn\u00ed.<\/p>\n

      \n

      Technick\u00e9 specifikace<\/strong><\/span><\/h2>\n

      Geometrie a form\u00e1ty<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n
      Parametr<\/th>\nSpecifikace<\/th>\n<\/tr>\n<\/thead>\n
      Velikost oplatky<\/td>\n8 palc\u016f \/ 12 palc\u016f<\/td>\n<\/tr>\n
      Velikost panelu<\/td>\n100 \u00d7 100 mm a\u017e 510 \u00d7 515 mm<\/td>\n<\/tr>\n
      Rozsah tlou\u0161\u0165ky<\/td>\n0,7 \u2013 2,0 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      Rozm\u011brov\u00e9 a povrchov\u00e9 vlastnosti<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n
      Majetek<\/th>\nStandardn\u00ed kvalita<\/th>\nVysoce p\u0159esn\u00e1 t\u0159\u00edda<\/th>\n<\/tr>\n<\/thead>\n
      Celkov\u00e1 odchylka tlou\u0161\u0165ky (TTV)<\/td>\n\u2264 3 \u03bcm<\/td>\n\u2264 2 \u03bcm<\/td>\n<\/tr>\n
      Warp<\/td>\n\u2264 100 \u03bcm<\/td>\n\u2264 50 \u03bcm<\/td>\n<\/tr>\n
      Tolerance tlou\u0161\u0165ky<\/td>\n\u00b10,010 mm<\/td>\n\u00b10,005 mm<\/td>\n<\/tr>\n
      Drsnost povrchu (Ra)<\/td>\n< 1,0 nm<\/td>\n< 1,0 nm<\/td>\n<\/tr>\n
      \u0160kr\u00e1bat\/kopat<\/td>\n60\/40<\/td>\n40\/20<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      Vlastnosti materi\u00e1lu<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n\n
      Majetek<\/th>\nHodnota<\/th>\n<\/tr>\n<\/thead>\n
      Young\u016fv modul<\/td>\n345\u2013420 GPa<\/td>\n<\/tr>\n
      Vickersova tvrdost<\/td>\n1800\u20132200 HV<\/td>\n<\/tr>\n
      Optick\u00e1 propustnost<\/td>\n>83% (300\u20131200 nm)<\/td>\n<\/tr>\n
      Hustota<\/td>\n3,98 g\/cm\u00b3<\/td>\n<\/tr>\n
      Tepeln\u00e1 vodivost<\/td>\n30\u201340 W\/m\u00b7K<\/td>\n<\/tr>\n
      CTE (20 \u00b0C)<\/td>\n5,6 \u2013 7,7 \u00d7 10\u207b\u2076\/K<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      \"\"Oblasti pou\u017eit\u00ed<\/strong><\/span><\/h2>\n
        \n
      • Zpracov\u00e1n\u00ed zadn\u00ed strany ultratenk\u00fdch desti\u010dek<\/li>\n
      • 2,5D \/ 3D heterogenn\u00ed integrace<\/li>\n
      • V\u00fdroba TSV (pr\u016fchoz\u00ed k\u0159em\u00edkov\u00e9 propojky)<\/li>\n
      • Vytvo\u0159en\u00ed vrstvy RDL (Redistribution Layer)<\/li>\n
      • Syst\u00e9my pro do\u010dasn\u00e9 spojov\u00e1n\u00ed a odd\u011blov\u00e1n\u00ed desti\u010dek<\/li>\n
      • Balen\u00ed typu Fan-out na \u00farovni desti\u010dky (FOWLP)<\/li>\n
      • Balen\u00ed na \u00farovni panelu s rozv\u011btven\u00edm v\u00fdvod\u016f (FOPLP)<\/li>\n
      • Pokro\u010dil\u00e9 zten\u010dov\u00e1n\u00ed a manipulace s desti\u010dkami (desti\u010dky <50 \u03bcm)<\/li>\n<\/ul>\n
        \n

        Technick\u00e1 hodnota<\/strong><\/span><\/h2>\n

        D\u00edky do\u010dasn\u00e9mu nosi\u010di z saf\u00edru mohou v\u00fdrobci pokro\u010dil\u00fdch obalov\u00fdch \u0159e\u0161en\u00ed dos\u00e1hnout:<\/p>\n

          \n
        • V\u00fdrazn\u00e9 sn\u00ed\u017een\u00ed proh\u00fdb\u00e1n\u00ed desti\u010dek a struktur\u00e1ln\u00edch deformac\u00ed<\/li>\n
        • Zv\u00fd\u0161en\u00e1 p\u0159esnost vyrovn\u00e1n\u00ed p\u0159i mont\u00e1\u017ei sou\u010d\u00e1stek s mal\u00fdm rozte\u010dem<\/li>\n
        • Spolehliv\u00e1 manipulace s ultratenk\u00fdmi desti\u010dkami o tlou\u0161\u0165ce pod 50 \u03bcm<\/li>\n
        • Vy\u0161\u0161\u00ed konzistence v\u00fdt\u011b\u017enosti p\u0159i v\u00fdrob\u011b ve velk\u00e9m m\u011b\u0159\u00edtku<\/li>\n
        • Zlep\u0161en\u00e1 opakovatelnost procesu a stabilita v\u00fdroby<\/li>\n
        • Kompatibilita s heterogenn\u00edmi integra\u010dn\u00edmi platformami nov\u00e9 generace<\/li>\n<\/ul>\n
          \n

          \u010cASTO KLADEN\u00c9 DOTAZY<\/strong><\/span><\/h2>\n

          Ot\u00e1zka 1: Jak\u00e1 je hlavn\u00ed v\u00fdhoda pou\u017eit\u00ed saf\u00edru v do\u010dasn\u00fdch nosi\u010d\u00edch desti\u010dek?<\/strong>
          Odpov\u011b\u010f: Saf\u00edr se vyzna\u010duje mimo\u0159\u00e1dn\u011b vysokou tuhost\u00ed, tvrdost\u00ed a tepelnou stabilitou, co\u017e umo\u017e\u0148uje vynikaj\u00edc\u00ed kontrolu nad deformacemi a mechanickou spolehlivost v pokro\u010dil\u00fdch procesech balen\u00ed.<\/p>\n

          Ot\u00e1zka 2: Je saf\u00edr vhodn\u00fd pro procesy laserov\u00e9ho odlepov\u00e1n\u00ed?<\/strong>
          Odpov\u011b\u010f: Ano. D\u00edky vysok\u00e9 optick\u00e9 propustnosti v rozsahu vlnov\u00fdch d\u00e9lek od UV a\u017e po st\u0159edn\u00ed infra\u010derven\u00e9 z\u00e1\u0159en\u00ed umo\u017e\u0148uje \u00fa\u010dinn\u00e9 pronik\u00e1n\u00ed laserov\u00e9ho paprsku, a je tak pln\u011b kompatibiln\u00ed se syst\u00e9my pro odlepov\u00e1n\u00ed pomoc\u00ed laseru.<\/p>\n

          Ot\u00e1zka 3: Jsou saf\u00edrov\u00e9 nosi\u010de vhodn\u00e9 pro balen\u00ed velkoform\u00e1tov\u00fdch panel\u016f?<\/strong>
          Odpov\u011b\u010f: Ano. Saf\u00edrov\u00e9 nosi\u010de lze vyr\u00e1b\u011bt ve velk\u00fdch rozm\u011brech p\u0159i zachov\u00e1n\u00ed vynikaj\u00edc\u00ed rovinnosti a rovnom\u011brn\u00e9ho rozlo\u017een\u00ed nap\u011bt\u00ed, d\u00edky \u010demu\u017e jsou vhodn\u00e9 pro technologii FOPLP a dal\u0161\u00ed pokro\u010dil\u00e9 aplikace v oblasti velkoplo\u0161n\u00e9ho balen\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"

          Do\u010dasn\u00fd nosi\u010d desti\u010dek ze saf\u00edru je vysoce v\u00fdkonn\u00fd substr\u00e1t navr\u017een\u00fd pro pokro\u010dil\u00e9 procesy balen\u00ed polovodi\u010d\u016f, zejm\u00e9na pro manipulaci s ultratenk\u00fdmi desti\u010dkami a aplikace v oblasti heterogenn\u00ed integrace.<\/p>","protected":false},"featured_media":2514,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[1212],"product_tag":[1425,601,1419,1433,1428,1430,1429,1438,1435,1434,1431,1427,1420,1424,1437,1421,1436,1426,1423,1439,1422,1432],"class_list":{"0":"post-2512","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-semiconductor-consumables","7":"product_tag-2-5d-ic-packaging","8":"product_tag-3d-ic-integration","9":"product_tag-advanced-packaging-materials","10":"product_tag-cte-mismatch-solution","11":"product_tag-fan-out-packaging","12":"product_tag-foplp","13":"product_tag-fowlp","14":"product_tag-heterogeneous-integration-platform","15":"product_tag-high-modulus-ceramics","16":"product_tag-high-rigidity-materials","17":"product_tag-laser-debonding-compatibility","18":"product_tag-rdl-process","19":"product_tag-sapphire-wafer-carrier","20":"product_tag-semiconductor-carrier-substrate","21":"product_tag-semiconductor-manufacturing-materials","22":"product_tag-temporary-wafer-bonding","23":"product_tag-thermal-stability-materials","24":"product_tag-tsv-process","25":"product_tag-ultra-thin-wafer-handling","26":"product_tag-ultra-thin-wafer-support-systems","27":"product_tag-wafer-debonding","28":"product_tag-wafer-warpage-control","29":"desktop-align-left","30":"tablet-align-left","31":"mobile-align-left","32":"ast-product-gallery-layout-horizontal-slider","33":"ast-product-tabs-layout-horizontal","35":"first","36":"instock","37":"shipping-taxable","38":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2512","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2512"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2512\/revisions"}],"predecessor-version":[{"id":2519,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2512\/revisions\/2519"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2514"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2512"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_brand?post=2512"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_cat?post=2512"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_tag?post=2512"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}