{"id":2327,"date":"2026-04-21T06:21:20","date_gmt":"2026-04-21T06:21:20","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2327"},"modified":"2026-04-21T06:21:21","modified_gmt":"2026-04-21T06:21:21","slug":"wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/cs\/product\/wafer-thinning-system-precision-back-grinding-equipment-for-si-sic-and-4-to-12-inch-semiconductor-wafers\/","title":{"rendered":"Syst\u00e9m pro zten\u010dov\u00e1n\u00ed desti\u010dek P\u0159esn\u00e9 za\u0159\u00edzen\u00ed pro zp\u011btn\u00e9 brou\u0161en\u00ed Si SiC a polovodi\u010dov\u00fdch desti\u010dek o velikosti 4 a\u017e 12 palc\u016f"},"content":{"rendered":"

\"Syst\u00e9mZa\u0159\u00edzen\u00ed pro p\u0159esn\u00e9 zp\u011btn\u00e9 brou\u0161en\u00ed Wafer Thinning System je vysoce p\u0159esn\u00e9 \u0159e\u0161en\u00ed pro zpracov\u00e1n\u00ed wafer\u016f ur\u010den\u00e9 pro pokro\u010dilou v\u00fdrobu polovodi\u010d\u016f. Podporuje 4palcov\u00e9 a\u017e 12palcov\u00e9 desti\u010dky, v\u010detn\u011b k\u0159em\u00edku (Si), karbidu k\u0159em\u00edku (SiC), arsenidu galia (GaAs), saf\u00edru a dal\u0161\u00edch k\u0159ehk\u00fdch polovodi\u010dov\u00fdch materi\u00e1l\u016f.<\/p>\n

Tento syst\u00e9m je navr\u017een pro velmi p\u0159esn\u00e9 zten\u010den\u00ed zadn\u00ed strany desti\u010dky, co\u017e umo\u017e\u0148uje sn\u00ed\u017een\u00ed tlou\u0161\u0165ky na mikronovou a submikronovou \u00farove\u0148 p\u0159i zachov\u00e1n\u00ed vynikaj\u00edc\u00ed integrity povrchu. Hraje kl\u00ed\u010dovou roli p\u0159i v\u00fdrob\u011b pokro\u010dil\u00fdch obal\u016f, v\u00fdkonov\u00fdch za\u0159\u00edzen\u00ed, MEMS a slo\u017een\u00fdch polovodi\u010d\u016f.<\/p>\n

D\u00edky integraci mechanick\u00e9 konstrukce s vysokou tuhost\u00ed, p\u0159esn\u00e9mu \u0159\u00edzen\u00ed osy Z a monitorov\u00e1n\u00ed tlou\u0161\u0165ky v re\u00e1ln\u00e9m \u010dase zaji\u0161\u0165uje za\u0159\u00edzen\u00ed stabiln\u00ed a opakovateln\u00fd v\u00fdkon zpracov\u00e1n\u00ed pro pr\u016fmyslovou v\u00fdrobu.<\/p>\n

\n

Kl\u00ed\u010dov\u00e9 technick\u00e9 vlastnosti<\/span><\/h2>\n

Vysoce p\u0159esn\u00e1 kontrola tlou\u0161\u0165ky<\/span><\/h3>\n
    \n
  • P\u0159esnost m\u011b\u0159en\u00ed tlou\u0161\u0165ky: \u00b11 \u03bcm<\/li>\n
  • Celkov\u00e1 odchylka tlou\u0161\u0165ky (TTV): \u22642 \u03bcm<\/li>\n
  • Pokro\u010dil\u00e9 modely dosahuj\u00ed submikronov\u00e9 kontroly a\u017e \u00b10,5 \u03bcm<\/li>\n<\/ul>\n

    \"\"\u0160irok\u00e1 kompatibilita materi\u00e1l\u016f<\/span><\/h3>\n

    Podporuje \u0161irokou \u0161k\u00e1lu polovodi\u010dov\u00fdch a k\u0159ehk\u00fdch materi\u00e1l\u016f:<\/p>\n

      \n
    • K\u0159em\u00edk (Si)<\/li>\n
    • Karbid k\u0159em\u00edku (SiC)<\/li>\n
    • Arsenid galia (GaAs)<\/li>\n
    • Saf\u00edr (Al\u2082O\u2083)<\/li>\n
    • Ostatn\u00ed polovodi\u010dov\u00e9 desti\u010dky<\/li>\n<\/ul>\n

      Kompatibilita velikosti desti\u010dek<\/span><\/h3>\n
        \n
      • 4palcov\u00e9 \/ 6palcov\u00e9 \/ 8palcov\u00e9 \/ 10palcov\u00e9 \/ 12palcov\u00e9 oplatky<\/li>\n
      • Flexibiln\u00ed manipulace se standardn\u00edmi i p\u0159izp\u016fsoben\u00fdmi substr\u00e1ty<\/li>\n<\/ul>\n

        Mechanick\u00fd syst\u00e9m s vysokou stabilitou<\/span><\/h3>\n
          \n
        • V\u0159eteno s vysokou tuhost\u00ed a vzduchov\u00fdm lo\u017eiskem<\/li>\n
        • P\u0159esn\u00e1 brusn\u00e1 plo\u0161ina s n\u00edzk\u00fdmi vibracemi<\/li>\n
        • Dov\u00e1\u017een\u00fd kuli\u010dkov\u00fd \u0161roub + line\u00e1rn\u00ed vodic\u00ed syst\u00e9m<\/li>\n
        • Vysoce p\u0159esn\u00e9 \u0159\u00edzen\u00ed servomotoru (rozli\u0161en\u00ed 0,1 \u03bcm)<\/li>\n<\/ul>\n

          Pokro\u010dil\u00fd chladic\u00ed syst\u00e9m<\/span><\/h3>\n
            \n
          • Vodou chlazen\u00fd syst\u00e9m v\u0159etena zaji\u0161\u0165uje tepelnou stabilitu<\/li>\n
          • Zabra\u0148uje deformaci p\u0159i vysokorychlostn\u00edm brou\u0161en\u00ed<\/li>\n<\/ul>\n
            \n

            Konfigurace syst\u00e9mu<\/span><\/h2>\n

            Syst\u00e9m pro zten\u010dov\u00e1n\u00ed pl\u00e1tk\u016f integruje n\u011bkolik funk\u010dn\u00edch modul\u016f:<\/p>\n

            1. Modul p\u0159esn\u00e9ho brou\u0161en\u00ed<\/span><\/h3>\n

            Prov\u00e1d\u00ed \u0159\u00edzen\u00fd \u00fab\u011br materi\u00e1lu s vysokou rovnom\u011brnost\u00ed povrchu.<\/p>\n

            2. Syst\u00e9m p\u0159esn\u00e9ho \u0159\u00edzen\u00ed osy Z<\/span><\/h3>\n

            Umo\u017e\u0148uje velmi p\u0159esn\u00e9 vertik\u00e1ln\u00ed nastaven\u00ed pro konzistentn\u00ed tlou\u0161\u0165ku pl\u00e1tk\u016f.<\/p>\n

            3. Syst\u00e9m m\u011b\u0159en\u00ed tlou\u0161\u0165ky<\/span><\/h3>\n

            Kontaktn\u00ed\/bezkontaktn\u00ed m\u011b\u0159en\u00ed v re\u00e1ln\u00e9m \u010dase zaji\u0161\u0165uje stabilitu procesu.<\/p>\n

            4. Vakuov\u00e9 skl\u00ed\u010didlo<\/span><\/h3>\n

            Bezpe\u010dn\u00e1 fixace desti\u010dek, v\u010detn\u011b \u0159e\u0161en\u00ed na m\u00edru pro nepravideln\u00e9 desti\u010dky.<\/p>\n

            5. \u0158\u00eddic\u00ed syst\u00e9m automatizace<\/span><\/h3>\n
              \n
            • Pln\u011b automatick\u00e9 \/ poloautomatick\u00e9 provozn\u00ed re\u017eimy<\/li>\n
            • Z\u00e1znam do provozn\u00edho den\u00edku<\/li>\n
            • \u0158\u00edzen\u00ed procesu na z\u00e1klad\u011b receptury<\/li>\n<\/ul>\n
              \n

              \"\" Schopnosti zpracov\u00e1n\u00ed<\/span><\/h2>\n

              Syst\u00e9m je ur\u010den pro vysoce v\u00fdkonn\u00e9 zpracov\u00e1n\u00ed zadn\u00ed strany desti\u010dek:<\/p>\n

                \n
              • Brou\u0161en\u00ed k\u0159em\u00edkov\u00fdch desti\u010dek<\/li>\n
              • Zten\u010dov\u00e1n\u00ed SiC desti\u010dek pro v\u00fdkonov\u00e1 za\u0159\u00edzen\u00ed<\/li>\n
              • Zten\u010den\u00ed substr\u00e1tu GaN a GaAs<\/li>\n
              • P\u0159esn\u00e9 zten\u010dov\u00e1n\u00ed saf\u00edrov\u00fdch desti\u010dek<\/li>\n
              • P\u0159\u00edprava ultratenk\u00fdch pl\u00e1tk\u016f pro 3D balen\u00ed<\/li>\n<\/ul>\n
                \n

                Aplikace<\/span><\/h2>\n

                1. V\u00fdkonov\u00e9 polovodi\u010dov\u00e9 sou\u010d\u00e1stky<\/span><\/h3>\n

                Pou\u017e\u00edv\u00e1 se v SiC MOSFETech, IGBT a vysokonap\u011b\u0165ov\u00fdch za\u0159\u00edzen\u00edch vy\u017eaduj\u00edc\u00edch ultratenk\u00e9 desti\u010dky.<\/p>\n

                \"\"2. Pokro\u010dil\u00e9 balen\u00ed<\/span><\/h3>\n

                Podporuje zten\u010dov\u00e1n\u00ed desti\u010dek pro:<\/p>\n

                  \n
                • Obal na flipov\u00e9 \u010dipy<\/li>\n
                • 2,5D \/ 3D integrace integrovan\u00fdch obvod\u016f<\/li>\n
                • Procesy TSV (Through Silicon Via)<\/li>\n<\/ul>\n

                  3. Slo\u017een\u00e9 polovodi\u010de<\/span><\/h3>\n

                  Pou\u017eiteln\u00e9 pro v\u00fdrobu za\u0159\u00edzen\u00ed GaN, GaAs a InP.<\/p>\n

                  4. LED a optoelektronika<\/span><\/h3>\n

                  Zten\u010dov\u00e1n\u00ed saf\u00edrov\u00fdch a sm\u011bsn\u00fdch desti\u010dek pro LED \u010dipy a optick\u00e1 za\u0159\u00edzen\u00ed.<\/p>\n

                  \n

                  V\u00fdhody<\/span><\/h2>\n
                    \n
                  • Vysp\u011bl\u00e1 a stabiln\u00ed technologie zten\u010dov\u00e1n\u00ed pl\u00e1tk\u016f<\/li>\n
                  • Vysoce p\u0159esn\u00fd syst\u00e9m brou\u0161en\u00ed na vstupu<\/li>\n
                  • Vynikaj\u00edc\u00ed kontrola drsnosti povrchu<\/li>\n
                  • Vysok\u00e1 UPH (a\u017e 30 desti\u010dek\/hodinu u standardn\u00edch proces\u016f)<\/li>\n
                  • Siln\u00e1 p\u0159izp\u016fsobivost pro k\u0159ehk\u00e9 a tvrd\u00e9 materi\u00e1ly<\/li>\n
                  • Pln\u011b automatizovan\u00e1 schopnost integrace proces\u016f<\/li>\n<\/ul>\n
                    \n

                    Nejd\u016fle\u017eit\u011bj\u0161\u00ed informace o v\u00fdkonu<\/span><\/h2>\n
                      \n
                    • Minim\u00e1ln\u00ed rozli\u0161en\u00ed: 0,1 \u03bcm\/s \u0158\u00edzen\u00ed osy Z<\/li>\n
                    • Rovnom\u011brnost tlou\u0161\u0165ky: \u22641-2 \u03bcm TTV<\/li>\n
                    • Vysokorychlostn\u00ed v\u0159eteno s velmi n\u00edzk\u00fdmi vibracemi<\/li>\n
                    • Monitorov\u00e1n\u00ed a protokolov\u00e1n\u00ed proces\u016f v re\u00e1ln\u00e9m \u010dase<\/li>\n
                    • Kompatibiln\u00ed s prost\u0159ed\u00edm v\u00fdzkumu a v\u00fdvoje i s\u00e9riov\u00e9 v\u00fdroby.<\/li>\n<\/ul>\n
                      \n

                      Mo\u017enosti p\u0159izp\u016fsoben\u00ed<\/span><\/h2>\n

                      Poskytujeme flexibiln\u00ed p\u0159izp\u016fsoben\u00ed pro r\u016fzn\u00e9 pr\u016fmyslov\u00e9 pot\u0159eby:<\/p>\n

                        \n
                      • Zak\u00e1zkov\u00e1 skl\u00ed\u010didla (nepravideln\u00e9 tvary)<\/li>\n
                      • Roz\u0161\u00ed\u0159en\u00fd rozsah m\u011b\u0159en\u00ed tlou\u0161\u0165ky (a\u017e 40 mm)<\/li>\n
                      • P\u0159izp\u016fsoben\u00ed procesn\u00edch receptur<\/li>\n
                      • Integrace automatizace s p\u0159edch\u00e1zej\u00edc\u00edm\/dol\u00e9haj\u00edc\u00edm za\u0159\u00edzen\u00edm<\/li>\n<\/ul>\n
                        \n

                        \u010cASTO KLADEN\u00c9 DOTAZY<\/span><\/h2>\n

                        Ot\u00e1zka 1: M\u016f\u017ee tento syst\u00e9m zpracov\u00e1vat SiC desti\u010dky?<\/span><\/h3>\n

                        Ano, je speci\u00e1ln\u011b optimalizov\u00e1n pro zten\u010dov\u00e1n\u00ed SiC desti\u010dek a brou\u0161en\u00ed zadn\u00ed strany, vhodn\u00e9 pro aplikace ve v\u00fdkonov\u00fdch za\u0159\u00edzen\u00edch.<\/p>\n

                        Ot\u00e1zka 2: Jak\u00e1 je dosa\u017eiteln\u00e1 p\u0159esnost tlou\u0161\u0165ky?<\/span><\/h3>\n

                        Standardn\u00ed modely dosahuj\u00ed \u00b11 \u03bcm a \u0161pi\u010dkov\u00e9 konfigurace mohou dos\u00e1hnout \u00b10,5 \u03bcm s TTV \u22641 \u03bcm.<\/p>\n

                        Ot\u00e1zka 3: Podporuje plnou automatizaci?<\/span><\/h3>\n

                        Ano, v z\u00e1vislosti na v\u00fdrobn\u00edch po\u017eadavc\u00edch jsou k dispozici jak pln\u011b automatick\u00e9, tak poloautomatick\u00e9 re\u017eimy.<\/p>","protected":false},"excerpt":{"rendered":"

                        Za\u0159\u00edzen\u00ed pro p\u0159esn\u00e9 zp\u011btn\u00e9 brou\u0161en\u00ed Wafer Thinning System je vysoce p\u0159esn\u00e9 \u0159e\u0161en\u00ed pro zpracov\u00e1n\u00ed wafer\u016f ur\u010den\u00e9 pro pokro\u010dilou v\u00fdrobu polovodi\u010d\u016f. Podporuje 4palcov\u00e9 a\u017e 12palcov\u00e9 desti\u010dky, v\u010detn\u011b k\u0159em\u00edku (Si), karbidu k\u0159em\u00edku (SiC), arsenidu galia (GaAs), saf\u00edru a dal\u0161\u00edch k\u0159ehk\u00fdch polovodi\u010dov\u00fdch materi\u00e1l\u016f.Tento syst\u00e9m je navr\u017een pro velmi p\u0159esn\u00e9 zten\u010den\u00ed zadn\u00ed strany desti\u010dky, co\u017e umo\u017e\u0148uje sn\u00ed\u017een\u00ed tlou\u0161\u0165ky na mikronovou a submikronovou \u00farove\u0148 p\u0159i zachov\u00e1n\u00ed vynikaj\u00edc\u00ed integrity povrchu.<\/p>","protected":false},"featured_media":2330,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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