{"id":2048,"date":"2026-04-01T05:59:16","date_gmt":"2026-04-01T05:59:16","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&p=2048"},"modified":"2026-04-01T06:04:59","modified_gmt":"2026-04-01T06:04:59","slug":"microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/cs\/product\/microfluidic-laser-equipment-for-high-precision-semiconductor-wafer-processing\/","title":{"rendered":"Mikrofluidn\u00ed laserov\u00e9 za\u0159\u00edzen\u00ed pro vysoce p\u0159esn\u00e9 zpracov\u00e1n\u00ed polovodi\u010dov\u00fdch desti\u010dek"},"content":{"rendered":"

\"\"Mikrofluidn\u00ed laserov\u00e1 za\u0159\u00edzen\u00ed vyu\u017e\u00edvaj\u00ed pokro\u010dilou technologii mikrotryskov\u00e9ho laseru k vysoce p\u0159esn\u00e9mu zpracov\u00e1n\u00ed polovodi\u010dov\u00fdch desti\u010dek a jin\u00fdch tvrd\u00fdch, k\u0159ehk\u00fdch nebo \u0161irokop\u00e1smov\u00fdch materi\u00e1l\u016f s n\u00edzk\u00fdm tepeln\u00fdm po\u0161kozen\u00edm. Kombinac\u00ed submikronov\u00e9ho vodn\u00edho paprsku s laserov\u00fdm paprskem vede syst\u00e9m laserovou energii p\u0159esn\u011b na povrch obrobku, zat\u00edmco proud vody pr\u016fb\u011b\u017en\u011b chlad\u00ed a odstra\u0148uje ne\u010distoty. Tato technologie \u00fa\u010dinn\u011b \u0159e\u0161\u00ed b\u011b\u017en\u00e9 probl\u00e9my konven\u010dn\u00edho laserov\u00e9ho a mechanick\u00e9ho zpracov\u00e1n\u00ed, v\u010detn\u011b tepeln\u00e9ho po\u0161kozen\u00ed, mikrotrhlin, kontaminace, z\u00fa\u017een\u00ed a deformace.<\/p>\n

\"\"Kl\u00ed\u010dov\u00e9 vlastnosti<\/strong><\/span><\/h2>\n
    \n
  • Typ laseru:<\/strong> Diodov\u011b \u010derpan\u00fd pevnol\u00e1tkov\u00fd Nd:YAG laser, vlnov\u00e1 d\u00e9lka 532\/1064 nm, \u0161\u00ed\u0159ka pulzu v \u03bcs\/ns, pr\u016fm\u011brn\u00fd v\u00fdkon 10-200 W.<\/li>\n
  • Syst\u00e9m vodn\u00edho paprsku:<\/strong> N\u00edzkotlak\u00e1, deionizovan\u00e1, filtrovan\u00e1 voda; ultrajemn\u00e1 mikrotryska spot\u0159ebuje pouze 1 l\/h p\u0159i tlaku 300 bar\u016f, zanedbateln\u00e1 s\u00edla (<0,1 N).<\/li>\n
  • Tryska:<\/strong> Saf\u00edr nebo diamant, pr\u016fm\u011br 30-150 \u03bcm pro p\u0159esn\u00e9 nav\u00e1d\u011bn\u00ed laseru<\/li>\n
  • Pomocn\u00fd syst\u00e9m:<\/strong> Vysokotlak\u00e1 \u010derpadla a jednotky na \u00fapravu vody zaji\u0161\u0165uj\u00ed stabiln\u00ed v\u00fdkon proudu.<\/li>\n
  • P\u0159esnost:<\/strong> P\u0159esnost polohov\u00e1n\u00ed \u00b15 \u03bcm, p\u0159esnost opakovan\u00e9ho polohov\u00e1n\u00ed \u00b12 \u03bcm<\/li>\n
  • Schopnost zpracov\u00e1n\u00ed:<\/strong> Drsnost povrchu Ra \u22641,2-1,6 \u03bcm, line\u00e1rn\u00ed \u0159ezn\u00e1 rychlost \u226550 mm\/s, rychlost otev\u00edr\u00e1n\u00ed \u22651,25 mm\/s, obvodov\u00e9 \u0159ez\u00e1n\u00ed \u22656 mm\/s.<\/li>\n<\/ul>\n

    Technick\u00e9 specifikace<\/strong><\/span><\/h2>\n
    \n
    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Specifikace<\/th>\nMo\u017enost 1<\/th>\nMo\u017enost 2<\/th>\n<\/tr>\n<\/thead>\n
    Objem desky (mm)<\/td>\n300\u00d7300\u00d7150<\/td>\n400\u00d7400\u00d7200<\/td>\n<\/tr>\n
    Line\u00e1rn\u00ed osa XY<\/td>\nLine\u00e1rn\u00ed motor<\/td>\nLine\u00e1rn\u00ed motor<\/td>\n<\/tr>\n
    Line\u00e1rn\u00ed osa Z<\/td>\n150<\/td>\n200<\/td>\n<\/tr>\n
    P\u0159esnost polohov\u00e1n\u00ed (\u03bcm)<\/td>\n\u00b15<\/td>\n\u00b15<\/td>\n<\/tr>\n
    Opakovan\u00e1 p\u0159esnost ur\u010den\u00ed polohy (\u03bcm)<\/td>\n\u00b12<\/td>\n\u00b12<\/td>\n<\/tr>\n
    Zrychlen\u00ed (G)<\/td>\n1<\/td>\n0.29<\/td>\n<\/tr>\n
    \u010c\u00edslicov\u00e9 \u0159\u00edzen\u00ed<\/td>\n3 osy \/ 3+1 \/ 3+2 osy<\/td>\n3 osy \/ 3+1 \/ 3+2 osy<\/td>\n<\/tr>\n
    Vlnov\u00e1 d\u00e9lka (nm)<\/td>\n532\/1064<\/td>\n532\/1064<\/td>\n<\/tr>\n
    Jmenovit\u00fd v\u00fdkon (W)<\/td>\n50\/100\/200<\/td>\n50\/100\/200<\/td>\n<\/tr>\n
    Tlak vodn\u00edho paprsku (bar)<\/td>\n50-100<\/td>\n50-600<\/td>\n<\/tr>\n
    Velikost trysky (\u03bcm)<\/td>\n30-150<\/td>\n30-150<\/td>\n<\/tr>\n
    Rozm\u011bry stroje (mm)<\/td>\n1445\u00d71944\u00d72260<\/td>\n1700\u00d71500\u00d72120<\/td>\n<\/tr>\n
    Hmotnost (T)<\/td>\n2.5<\/td>\n3<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n

    Aplikace<\/strong><\/span><\/h2>\n
      \n
    1. Kr\u00e1jen\u00ed a \u0159ez\u00e1n\u00ed desti\u010dek<\/strong>\n
        \n
      • Materi\u00e1ly: K\u0159em\u00edk (Si), karbid k\u0159em\u00edku (SiC), nitrid galia (GaN) a dal\u0161\u00ed tvrd\u00e9\/k\u0159ehk\u00e9 desti\u010dky.<\/li>\n
      • V\u00fdhody: Nahrazuje tradi\u010dn\u00ed diamantov\u00e9 no\u017ee, sni\u017euje l\u00e1m\u00e1n\u00ed hran (20 \u03bcm), zvy\u0161uje rychlost \u0159ez\u00e1n\u00ed o 30%, umo\u017e\u0148uje skryt\u00e9 kr\u00e1jen\u00ed ultratenk\u00fdch desti\u010dek (<50 \u03bcm).<\/li>\n<\/ul>\n<\/li>\n
      • T\u0159\u00edskov\u00e9 vrt\u00e1n\u00ed a zpracov\u00e1n\u00ed mikrootvor\u016f<\/strong>\n
          \n
        • Aplikace: vrt\u00e1n\u00ed pr\u016fchodek skrz k\u0159em\u00edk (TSV), tepeln\u00e9 mikrootvory pro v\u00fdkonov\u00e1 za\u0159\u00edzen\u00ed<\/li>\n
        • Vlastnosti: Pom\u011br hloubky k \u0161\u00ed\u0159ce a\u017e 10:1, drsnost povrchu Ra <0,5 \u03bcm.<\/li>\n<\/ul>\n<\/li>\n
        • Pokro\u010dil\u00e9 balen\u00ed<\/strong>\n
            \n
          • Aplikace: Otev\u00edr\u00e1n\u00ed oken RDL, balen\u00ed na \u00farovni desti\u010dek (Fan-Out WLP)<\/li>\n
          • V\u00fdhody: Vyh\u00fdb\u00e1 se mechanick\u00e9mu nam\u00e1h\u00e1n\u00ed, zvy\u0161uje v\u00fdt\u011b\u017enost na >99,5%.<\/li>\n<\/ul>\n<\/li>\n
          • Zpracov\u00e1n\u00ed slo\u017een\u00fdch polovodi\u010d\u016f<\/strong>\n
              \n
            • Materi\u00e1ly: GaN, SiC a dal\u0161\u00ed polovodi\u010de se \u0161irok\u00fdm p\u00e1smem<\/li>\n
            • Vlastnosti: P\u0159esn\u00e9 \u0159\u00edzen\u00ed energie, aby se zabr\u00e1nilo tepeln\u00e9mu rozkladu.<\/li>\n<\/ul>\n<\/li>\n
            • Opravy z\u00e1vad a dola\u010fov\u00e1n\u00ed<\/strong>\n
                \n
              • Aplikace: Laserov\u00e9 taven\u00ed pro pam\u011b\u0165ov\u00e9 obvody, lad\u011bn\u00ed soustav mikro\u010do\u010dek pro optick\u00e9 senzory.<\/li>\n
              • P\u0159esnost: P\u0159esnost: kontrola energie \u00b11%, chyba polohov\u00e1n\u00ed p\u0159i oprav\u011b <0,1 \u03bcm<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n

                \"\"<\/p>\n

                Nejd\u016fle\u017eit\u011bj\u0161\u00ed informace a v\u00fdhody<\/strong><\/span><\/h2>\n
                  \n
                • Studen\u00e9, \u010dist\u00e9 a kontrolovan\u00e9 zpracov\u00e1n\u00ed minimalizuje tepeln\u00e9 po\u0161kozen\u00ed, mikrotrhliny a z\u00fa\u017een\u00ed.<\/li>\n
                • Ultrajemn\u00fd vodn\u00ed paprsek zaji\u0161\u0165uje p\u0159esn\u00e9 laserov\u00e9 nav\u00e1d\u011bn\u00ed a \u00fa\u010dinn\u00e9 odstra\u0148ov\u00e1n\u00ed ne\u010distot<\/li>\n
                • Vhodn\u00e9 pro tvrd\u00e9, k\u0159ehk\u00e9 a transparentn\u00ed materi\u00e1ly, jako jsou SiC, GaN, diamant, LTCC a fotovoltaick\u00e9 krystaly.<\/li>\n
                • Kompatibiln\u00ed s vysoce p\u0159esnou v\u00fdrobou polovodi\u010d\u016f, pokro\u010dil\u00fdmi obaly, leteck\u00fdmi sou\u010d\u00e1stkami a mikroelektronikou.<\/li>\n
                • Zvy\u0161uje v\u00fdt\u011b\u017enost, sni\u017euje pl\u00fdtv\u00e1n\u00ed materi\u00e1lem a zachov\u00e1v\u00e1 jeho vlastnosti.<\/li>\n<\/ul>\n

                  Certifikace a dodr\u017eov\u00e1n\u00ed p\u0159edpis\u016f<\/strong><\/span><\/h2>\n
                    \n
                  • V souladu s RoHS<\/li>\n
                  • Navr\u017eeno pro vysoce p\u0159esn\u00e9 polovodi\u010dov\u00e9 aplikace<\/li>\n
                  • Podporuje reprodukovateln\u00e9, opakovateln\u00e9 a automatizovan\u00e9 zpracov\u00e1n\u00ed.<\/li>\n<\/ul>\n

                    \u010cASTO KLADEN\u00c9 DOTAZY<\/strong><\/span><\/h2>\n

                    1. Jak\u00e9 typy materi\u00e1l\u016f lze zpracov\u00e1vat pomoc\u00ed mikrofluidn\u00edho laserov\u00e9ho za\u0159\u00edzen\u00ed?<\/strong>
                    Mikrofluidn\u00ed laserov\u00e1 technologie dok\u00e1\u017ee p\u0159esn\u011b zpracov\u00e1vat tvrd\u00e9, k\u0159ehk\u00e9 a \u0161irokop\u00e1smov\u00e9 polovodi\u010dov\u00e9 materi\u00e1ly, v\u010detn\u011b k\u0159em\u00edku (Si), karbidu k\u0159em\u00edku (SiC), nitridu galia (GaN), diamantu, uhl\u00edkov\u00fdch keramick\u00fdch substr\u00e1t\u016f LTCC, fotovoltaick\u00fdch krystal\u016f a dal\u0161\u00edch pokro\u010dil\u00fdch materi\u00e1l\u016f. Je ide\u00e1ln\u00ed pro aplikace vy\u017eaduj\u00edc\u00ed minim\u00e1ln\u00ed tepeln\u00e9 po\u0161kozen\u00ed a vysokou kvalitu povrchu.<\/p>\n

                    2. Jak laserov\u00e1 technologie microjet zlep\u0161uje v\u00fdrobu polovodi\u010dov\u00fdch desti\u010dek?<\/strong>
                    Kombinac\u00ed submikronov\u00e9ho vodn\u00edho paprsku s laserov\u00fdm paprskem dosahuje tato technologie submikronov\u00e9 p\u0159esnosti a z\u00e1rove\u0148 minimalizuje tepeln\u011b ovlivn\u011bn\u00e9 z\u00f3ny, zne\u010di\u0161t\u011bn\u00ed a l\u00e1m\u00e1n\u00ed hran. Nahrazuje tradi\u010dn\u00ed mechanick\u00e9 no\u017ee pro d\u011blen\u00ed, vrt\u00e1n\u00ed a mikrostrukturov\u00e1n\u00ed, \u010d\u00edm\u017e zlep\u0161uje v\u00fdt\u011b\u017enost a sni\u017euje pl\u00fdtv\u00e1n\u00ed materi\u00e1lem.<\/p>\n

                    3. Pro jak\u00e9 aplikace je mikrofluidn\u00ed laserov\u00e9 za\u0159\u00edzen\u00ed nejvhodn\u011bj\u0161\u00ed?<\/strong>
                    Toto za\u0159\u00edzen\u00ed je \u0161iroce pou\u017e\u00edv\u00e1no v:<\/p>\n

                      \n
                    • D\u011blen\u00ed desti\u010dek a skryt\u00e9 d\u011blen\u00ed ultratenk\u00fdch desti\u010dek (<50 \u03bcm)<\/li>\n
                    • Vrt\u00e1n\u00ed pr\u016fchodek skrz k\u0159em\u00edk (TSV) a pole mikrootvor\u016f pro 3D integrovan\u00e9 obvody a v\u00fdkonov\u00e1 za\u0159\u00edzen\u00ed<\/li>\n
                    • Pokro\u010dil\u00e9 balen\u00ed, nap\u0159\u00edklad otev\u00edr\u00e1n\u00ed oken RDL, balen\u00ed na \u00farovni desti\u010dky (Fan-Out WLP) a lept\u00e1n\u00ed\/laserov\u00e9 \u017e\u00edh\u00e1n\u00ed hradel pro polovodi\u010de GaN a SiC.<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

                      Mikrofluidn\u00ed laserov\u00e1 za\u0159\u00edzen\u00ed vyu\u017e\u00edvaj\u00ed pokro\u010dilou technologii mikrotryskov\u00e9ho laseru k vysoce p\u0159esn\u00e9mu zpracov\u00e1n\u00ed polovodi\u010dov\u00fdch desti\u010dek a jin\u00fdch tvrd\u00fdch, k\u0159ehk\u00fdch nebo \u0161irokop\u00e1smov\u00fdch materi\u00e1l\u016f s n\u00edzk\u00fdm tepeln\u00fdm po\u0161kozen\u00edm.<\/p>","protected":false},"featured_media":2049,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[21],"product_tag":[554,687,691,684,57,689,693,686,681,688,682,690,694,437,683,685,692],"class_list":{"0":"post-2048","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-laser-cutting","7":"product_tag-advanced-packaging","8":"product_tag-cold-laser-machining","9":"product_tag-diamond-wafer-cutting","10":"product_tag-gan-processing","11":"product_tag-high-precision-laser-cutting","12":"product_tag-laser-defect-repair","13":"product_tag-laser-micromachining","14":"product_tag-low-thermal-damage-laser","15":"product_tag-microfluidic-laser-equipment","16":"product_tag-microhole-processing","17":"product_tag-microjet-laser-technology","18":"product_tag-photovoltaic-crystal-processing","19":"product_tag-precision-microfabrication","20":"product_tag-semiconductor-wafer-processing","21":"product_tag-sic-wafer-dicing","22":"product_tag-tsv-drilling","23":"product_tag-wide-bandgap-semiconductor","24":"desktop-align-left","25":"tablet-align-left","26":"mobile-align-left","27":"ast-product-gallery-layout-horizontal-slider","28":"ast-product-tabs-layout-horizontal","30":"first","31":"instock","32":"shipping-taxable","33":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2048","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2048"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2048\/revisions"}],"predecessor-version":[{"id":2057,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2048\/revisions\/2057"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2049"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2048"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_brand?post=2048"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_cat?post=2048"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_tag?post=2048"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}