{"id":2030,"date":"2026-03-27T01:57:48","date_gmt":"2026-03-27T01:57:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?post_type=product&#038;p=2030"},"modified":"2026-03-27T02:00:00","modified_gmt":"2026-03-27T02:00:00","slug":"semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing","status":"publish","type":"product","link":"https:\/\/www.zmsh-semitech.com\/cs\/product\/semi-automatic-room-temperature-wafer-bonding-machine-for-2-to-12-inch-wafer-processing\/","title":{"rendered":"Poloautomatick\u00fd stroj na lepen\u00ed oplatek p\u0159i pokojov\u00e9 teplot\u011b pro zpracov\u00e1n\u00ed 2 a\u017e 12palcov\u00fdch oplatek"},"content":{"rendered":"<p data-start=\"183\" data-end=\"783\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-medium wp-image-2031 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-03.webp 750w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Poloautomatick\u00fd stroj na lepen\u00ed desti\u010dek p\u0159i pokojov\u00e9 teplot\u011b je vysoce p\u0159esn\u00fd syst\u00e9m pro lepen\u00ed na \u00farovni desti\u010dek a \u010dip\u016f. Kombinac\u00ed mechanick\u00e9ho tlaku a technologie aktivace povrchu in situ umo\u017e\u0148uje trval\u00e9 lepen\u00ed p\u0159i pokojov\u00e9 teplot\u011b (20-30 \u00b0C) bez pou\u017eit\u00ed lepidel nebo vysokoteplotn\u00edho zpracov\u00e1n\u00ed. T\u00edm se minimalizuje tepeln\u00e9 nam\u00e1h\u00e1n\u00ed a deformace materi\u00e1lu, co\u017e je ide\u00e1ln\u00ed pro tepeln\u011b citliv\u00e9 a heterogenn\u00ed materi\u00e1ly. Stroj podporuje velikosti desti\u010dek od 2 do 12 palc\u016f a je vhodn\u00fd pro v\u00fdzkum, pilotn\u00ed v\u00fdrobu a malou a\u017e st\u0159edn\u00ed v\u00fdrobu.<\/p>\n<h2 data-start=\"785\" data-end=\"803\"><strong data-start=\"785\" data-end=\"801\"><img decoding=\"async\" class=\"size-medium wp-image-2034 alignleft\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/wafer_bonding_equipment_room_temperature_bondin_hydrophilic_bonding_si_sic_si_si_bonding_2_12_inch2-01.webp 750w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Kl\u00ed\u010dov\u00e9 vlastnosti<\/strong><\/h2>\n<ol data-start=\"804\" data-end=\"1556\">\n<li data-section-id=\"1qr4pz0\" data-start=\"804\" data-end=\"907\"><strong data-start=\"807\" data-end=\"835\">Lepen\u00ed p\u0159i pokojov\u00e9 teplot\u011b<\/strong> - Pracuje p\u0159i teplot\u011b 25 \u00b1 5 \u00b0C, aby se zabr\u00e1nilo tepeln\u00e9mu nesouladu a deformaci desti\u010dek.<\/li>\n<li data-section-id=\"3272ys\" data-start=\"908\" data-end=\"1042\"><strong data-start=\"911\" data-end=\"933\">Povrchov\u00e1 aktivace<\/strong> - Plazmov\u00e1 nebo chemick\u00e1 aktivace zvy\u0161uje pevnost spoje; voliteln\u00e9 napra\u0161ov\u00e1n\u00ed zvy\u0161uje kvalitu rozhran\u00ed.<\/li>\n<li data-section-id=\"14ugk5g\" data-start=\"1043\" data-end=\"1155\"><strong data-start=\"1046\" data-end=\"1074\">Vysoce p\u0159esn\u00e9 zarovn\u00e1n\u00ed<\/strong> - Syst\u00e9m vizu\u00e1ln\u00edho vyrovn\u00e1n\u00ed a p\u0159esn\u00e1 pohybov\u00e1 platforma s p\u0159esnost\u00ed \u00b10,5 \u03bcm.<\/li>\n<li data-section-id=\"1fnxkbi\" data-start=\"1156\" data-end=\"1293\"><strong data-start=\"1159\" data-end=\"1190\">\u0160irok\u00e1 kompatibilita materi\u00e1l\u016f<\/strong> - Podporuje Si, SiC, GaAs, GaN, InP, saf\u00edr, sklo, LiNbO\u2083, LiTaO\u2083, diamant a vybran\u00e9 polymery.<\/li>\n<li data-section-id=\"17l1ons\" data-start=\"1294\" data-end=\"1427\"><strong data-start=\"1297\" data-end=\"1325\">Poloautomatick\u00fd provoz<\/strong> - Ru\u010dn\u00ed vkl\u00e1d\u00e1n\u00ed desti\u010dek s automatizovan\u00fdm procesem lepen\u00ed; programovateln\u00e9 receptury pro opakovateln\u00e9 v\u00fdsledky.<\/li>\n<li data-section-id=\"14hlwba\" data-start=\"1428\" data-end=\"1556\"><strong data-start=\"1431\" data-end=\"1463\">\u010cist\u00e9 a stabiln\u00ed prost\u0159ed\u00ed<\/strong> - Vestav\u011bn\u00fd \u010distic\u00ed syst\u00e9m t\u0159\u00eddy 100 zaji\u0161\u0165uje n\u00edzkou m\u00edru kontaminace a pr\u00e1zdnotu rozhran\u00ed &lt;0,1%.<\/li>\n<\/ol>\n<h2 data-start=\"1558\" data-end=\"1588\"><strong data-start=\"1558\" data-end=\"1586\">Technick\u00e9 specifikace<\/strong><\/h2>\n<div class=\"TyagGW_tableContainer\">\n<div class=\"group TyagGW_tableWrapper flex flex-col-reverse w-fit\" tabindex=\"-1\">\n<table class=\"w-fit min-w-(--thread-content-width)\" data-start=\"1590\" data-end=\"2023\">\n<thead data-start=\"1590\" data-end=\"1619\">\n<tr data-start=\"1590\" data-end=\"1619\">\n<th class=\"\" data-start=\"1590\" data-end=\"1602\" data-col-size=\"sm\">Parametr<\/th>\n<th class=\"\" data-start=\"1602\" data-end=\"1619\" data-col-size=\"md\">Specifikace<\/th>\n<\/tr>\n<\/thead>\n<tbody data-start=\"1650\" data-end=\"2023\">\n<tr data-start=\"1650\" data-end=\"1710\">\n<td data-start=\"1650\" data-end=\"1663\" data-col-size=\"sm\">Velikost oplatky<\/td>\n<td data-start=\"1663\" data-end=\"1710\" data-col-size=\"md\">2\u2033 - 12\u2033, kompatibiln\u00ed s nepravideln\u00fdmi vzorky<\/td>\n<\/tr>\n<tr data-start=\"1711\" data-end=\"1744\">\n<td data-start=\"1711\" data-end=\"1733\" data-col-size=\"sm\">Teplota lepen\u00ed<\/td>\n<td data-col-size=\"md\" data-start=\"1733\" data-end=\"1744\">20-30\u00b0C<\/td>\n<\/tr>\n<tr data-start=\"1745\" data-end=\"1773\">\n<td data-start=\"1745\" data-end=\"1764\" data-col-size=\"sm\">Maxim\u00e1ln\u00ed tlak<\/td>\n<td data-col-size=\"md\" data-start=\"1764\" data-end=\"1773\">80 kN<\/td>\n<\/tr>\n<tr data-start=\"1774\" data-end=\"1833\">\n<td data-start=\"1774\" data-end=\"1793\" data-col-size=\"sm\">\u0158\u00edzen\u00ed tlaku<\/td>\n<td data-col-size=\"md\" data-start=\"1793\" data-end=\"1833\">0-5000 N nastaviteln\u00fd, rozli\u0161en\u00ed \u00b11 N<\/td>\n<\/tr>\n<tr data-start=\"1834\" data-end=\"1866\">\n<td data-start=\"1834\" data-end=\"1855\" data-col-size=\"sm\">P\u0159esnost zarovn\u00e1n\u00ed<\/td>\n<td data-col-size=\"md\" data-start=\"1855\" data-end=\"1866\">\u00b10,5 \u03bcm<\/td>\n<\/tr>\n<tr data-start=\"1867\" data-end=\"1896\">\n<td data-start=\"1867\" data-end=\"1883\" data-col-size=\"sm\">Pevnost spoje<\/td>\n<td data-start=\"1883\" data-end=\"1896\" data-col-size=\"md\">\u22652,0 J\/m\u00b2<\/td>\n<\/tr>\n<tr data-start=\"1897\" data-end=\"1963\">\n<td data-start=\"1897\" data-end=\"1917\" data-col-size=\"sm\">Povrchov\u00e1 \u00faprava<\/td>\n<td data-start=\"1917\" data-end=\"1963\" data-col-size=\"md\">Aktivace in situ + nan\u00e1\u0161en\u00ed napra\u0161ov\u00e1n\u00edm<\/td>\n<\/tr>\n<tr data-start=\"1964\" data-end=\"1989\">\n<td data-start=\"1964\" data-end=\"1979\" data-col-size=\"sm\">Re\u017eim krmen\u00ed<\/td>\n<td data-start=\"1979\" data-end=\"1989\" data-col-size=\"md\">Manu\u00e1ln\u00ed<\/td>\n<\/tr>\n<tr data-start=\"1990\" data-end=\"2023\">\n<td data-start=\"1990\" data-end=\"2010\" data-col-size=\"sm\">\u00darove\u0148 \u010distoty<\/td>\n<td data-col-size=\"md\" data-start=\"2010\" data-end=\"2023\">T\u0159\u00edda 100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<h2 data-start=\"2025\" data-end=\"2046\"><strong data-start=\"2025\" data-end=\"2044\">Z\u00e1kladn\u00ed technologie<\/strong><\/h2>\n<ol data-start=\"2047\" data-end=\"2318\">\n<li data-section-id=\"1ynif5v\" data-start=\"2047\" data-end=\"2190\"><strong data-start=\"2050\" data-end=\"2085\">P\u0159\u00edm\u00e9 lepen\u00ed p\u0159i pokojov\u00e9 teplot\u011b<\/strong> - Aktivovan\u00e9 povrchy se dot\u00fdkaj\u00ed pod \u0159\u00edzen\u00fdm tlakem a vytv\u00e1\u0159ej\u00ed stabiln\u00ed vazby bez tepeln\u00e9ho \u017e\u00edh\u00e1n\u00ed.<\/li>\n<li data-section-id=\"1j5fo5j\" data-start=\"2191\" data-end=\"2318\"><strong data-start=\"2194\" data-end=\"2216\">Povrchov\u00e1 aktivace<\/strong> - Zvy\u0161uje povrchovou energii, odstra\u0148uje ne\u010distoty a zlep\u0161uje rovnom\u011brnost lepen\u00ed nap\u0159\u00ed\u010d materi\u00e1ly.<\/li>\n<\/ol>\n<h2 data-start=\"2320\" data-end=\"2338\"><strong data-start=\"2320\" data-end=\"2336\"><img decoding=\"async\" class=\"size-medium wp-image-2033 alignright\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-300x300.webp\" alt=\"\" width=\"300\" height=\"300\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-300x300.webp 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-150x150.webp 150w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-12x12.webp 12w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-600x600.webp 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02-100x100.webp 100w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/semi_automatic_room_temperature_bonding_machine_2_4_6_8_12inch_compatible_material_sapphire_si_sic_inp_gaas_gan_lt_ln_diamond_glass-02.webp 750w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/>Aplikace<\/strong><\/h2>\n<ol data-start=\"2339\" data-end=\"2915\">\n<li data-section-id=\"1r305i3\" data-start=\"2339\" data-end=\"2464\"><strong data-start=\"2342\" data-end=\"2378\">Pokro\u010dil\u00e9 balen\u00ed polovodi\u010d\u016f<\/strong> - 3D stohov\u00e1n\u00ed integrovan\u00fdch obvod\u016f, lepen\u00ed TSV, heterogenn\u00ed integrace logick\u00fdch a pam\u011b\u0165ov\u00fdch \u010dip\u016f.<\/li>\n<li data-section-id=\"1275240\" data-start=\"2465\" data-end=\"2574\"><strong data-start=\"2468\" data-end=\"2490\">V\u00fdroba MEMS<\/strong> - Vakuov\u00e9 balen\u00ed na \u00farovni desti\u010dek pro senzory, jako jsou akcelerometry a gyroskopy.<\/li>\n<li data-section-id=\"vq54gb\" data-start=\"2575\" data-end=\"2696\"><strong data-start=\"2578\" data-end=\"2610\">Optoelektronika a displeje<\/strong> - Lepen\u00ed LED, lepen\u00ed saf\u00edrov\u00fdch a sklen\u011bn\u00fdch substr\u00e1t\u016f, mont\u00e1\u017e optick\u00fdch modul\u016f AR\/VR.<\/li>\n<li data-section-id=\"15fq9o1\" data-start=\"2697\" data-end=\"2795\"><strong data-start=\"2700\" data-end=\"2730\">Mikrofluidika a bio\u010dipy<\/strong> - PDMS a lepen\u00ed skla p\u0159i zachov\u00e1n\u00ed biologick\u00e9 aktivity.<\/li>\n<li data-section-id=\"1hrgg45\" data-start=\"2796\" data-end=\"2915\"><strong data-start=\"2799\" data-end=\"2832\">V\u00fdzkum a nov\u00e1 za\u0159\u00edzen\u00ed<\/strong> - Ohebn\u00e1 elektronika, kvantov\u00e1 za\u0159\u00edzen\u00ed a integrace heterogenn\u00edch materi\u00e1l\u016f.<\/li>\n<\/ol>\n<h2 data-start=\"2917\" data-end=\"2942\"><strong data-start=\"2917\" data-end=\"2940\">Servis a podpora<\/strong><\/h2>\n<ol data-start=\"2943\" data-end=\"3382\">\n<li data-section-id=\"uiqlfa\" data-start=\"2943\" data-end=\"3062\"><strong data-start=\"2946\" data-end=\"2969\">V\u00fdvoj procesu<\/strong> - Optimalizace parametr\u016f lepen\u00ed a \u0159e\u0161en\u00ed aktivace povrchu pro r\u016fzn\u00e9 materi\u00e1ly.<\/li>\n<li data-section-id=\"zjufb1\" data-start=\"3063\" data-end=\"3173\"><strong data-start=\"3066\" data-end=\"3093\">P\u0159izp\u016fsoben\u00ed za\u0159\u00edzen\u00ed<\/strong> - Vysoce p\u0159esn\u00e9 se\u0159izovac\u00ed moduly, vakuov\u00e9 komory nebo komory s \u0159\u00edzenou atmosf\u00e9rou.<\/li>\n<li data-section-id=\"1qni85g\" data-start=\"3174\" data-end=\"3253\"><strong data-start=\"3177\" data-end=\"3199\">Technick\u00e9 \u0161kolen\u00ed<\/strong> - Veden\u00ed provozu na m\u00edst\u011b a lad\u011bn\u00ed proces\u016f.<\/li>\n<li data-section-id=\"cek539\" data-start=\"3254\" data-end=\"3382\"><strong data-start=\"3257\" data-end=\"3280\">Poprodejn\u00ed podpora<\/strong> - 12m\u011bs\u00ed\u010dn\u00ed z\u00e1ruka, rychl\u00e1 v\u00fdm\u011bna kl\u00ed\u010dov\u00fdch komponent, vzd\u00e1len\u00e1 diagnostika a aktualizace softwaru.<\/li>\n<\/ol>\n<h2>\u010cASTO KLADEN\u00c9 DOTAZY<\/h2>\n<p data-start=\"3384\" data-end=\"3564\">Ot\u00e1zka: Jak\u00e1 je hlavn\u00ed v\u00fdhoda lepen\u00ed p\u0159i pokojov\u00e9 teplot\u011b?<br data-start=\"3452\" data-end=\"3455\" \/>Odpov\u011b\u010f: Eliminuje tepeln\u00e9 nam\u00e1h\u00e1n\u00ed a umo\u017e\u0148uje spolehliv\u00e9 lepen\u00ed tepeln\u011b citliv\u00fdch a heterogenn\u00edch materi\u00e1l\u016f.<\/p>\n<p data-start=\"3566\" data-end=\"3750\">Ot\u00e1zka: Jak\u00e9 materi\u00e1ly lze lepit?<br data-start=\"3598\" data-end=\"3601\" \/>A: K\u0159em\u00edk, karbid k\u0159em\u00edku, nitrid galia, arsenid galia, fosfid india, saf\u00edr, sklo, niob\u00e1t lithia, diamant a vybran\u00e9 polymery.<\/p>","protected":false},"excerpt":{"rendered":"<p>Poloautomatick\u00fd stroj na lepen\u00ed desti\u010dek p\u0159i pokojov\u00e9 teplot\u011b je vysoce p\u0159esn\u00fd syst\u00e9m pro lepen\u00ed na \u00farovni desti\u010dek a \u010dip\u016f. Kombinac\u00ed mechanick\u00e9ho tlaku a technologie aktivace povrchu in situ umo\u017e\u0148uje trval\u00e9 lepen\u00ed p\u0159i pokojov\u00e9 teplot\u011b (20-30 \u00b0C) bez pou\u017eit\u00ed lepidel nebo vysokoteplotn\u00edho zpracov\u00e1n\u00ed.<\/p>","protected":false},"featured_media":2031,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[23],"product_tag":[617,613,601,614,615,616,625,630,621,622,626,636,623,634,624,627,629,628,633,631,612,620,611,635,618,619,632],"class_list":{"0":"post-2030","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bonding-machine","7":"product_tag-12-inch-wafer","8":"product_tag-2-inch-wafer","9":"product_tag-3d-ic-integration","10":"product_tag-4-inch-wafer","11":"product_tag-6-inch-wafer","12":"product_tag-8-inch-wafer","13":"product_tag-diamond-wafer-bonding","14":"product_tag-flexible-electronics","15":"product_tag-gaas-bonding","16":"product_tag-gan-bonding","17":"product_tag-glass-wafer-bonding","18":"product_tag-high-precision-alignment","19":"product_tag-inp-bonding","20":"product_tag-low-temperature-bonding","21":"product_tag-lt-ln-bonding","22":"product_tag-mems-packaging","23":"product_tag-microfluidic-chip","24":"product_tag-optoelectronics","25":"product_tag-plasma-bonding","26":"product_tag-quantum-devices","27":"product_tag-room-temperature-bonding","28":"product_tag-sapphire-bonding","29":"product_tag-semi-automatic-wafer-bonding","30":"product_tag-semi-automatic-equipment","31":"product_tag-si-wafer-bonding","32":"product_tag-sic-wafer-bonding","33":"product_tag-surface-activation","34":"desktop-align-left","35":"tablet-align-left","36":"mobile-align-left","37":"ast-product-gallery-layout-horizontal-slider","38":"ast-product-tabs-layout-horizontal","40":"first","41":"instock","42":"shipping-taxable","43":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2030","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2030"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2030\/revisions"}],"predecessor-version":[{"id":2037,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2030\/revisions\/2037"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2031"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2030"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_brand?post=2030"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_cat?post=2030"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_tag?post=2030"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}