![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting6.png\")
<\/p>\nPln\u011b automatick\u00e1 p\u0159esn\u00e1 kostkovac\u00ed pila ZMSH je pokro\u010dil\u00fd syst\u00e9m pro \u0159ez\u00e1n\u00ed polovodi\u010d\u016f a k\u0159ehk\u00fdch materi\u00e1l\u016f ur\u010den\u00fd pro vysoce p\u0159esn\u00e9 kostkov\u00e1n\u00ed desti\u010dek. Podporuje 8palcov\u00e9 a 12palcov\u00e9 desti\u010dky a \u0161irokou \u0161k\u00e1lu k\u0159ehk\u00fdch materi\u00e1l\u016f, v\u010detn\u011b keramiky, skla, nitridu hlin\u00edku, PZT a epoxidov\u00fdch substr\u00e1t\u016f. Syst\u00e9m vyu\u017e\u00edv\u00e1 technologii diamantov\u00fdch kotou\u010d\u016f s rychlost\u00ed a\u017e 60 000 ot\u00e1\u010dek za minutu a dosahuje p\u0159esnosti \u0159ez\u00e1n\u00ed na \u00farovni mikron\u016f (\u00b12 \u03bcm) p\u0159i minimalizaci t\u0159\u00edsek (<5 \u03bcm), tak\u017ee je ide\u00e1ln\u00ed pro aplikace, kde je rozhoduj\u00edc\u00ed v\u00fdt\u011b\u017enost, p\u0159esnost a integrita povrchu.<\/p>\n
<\/p>\n
Tento pln\u011b automatizovan\u00fd syst\u00e9m integruje dvouos\u00e1 v\u0159etena s vysokou tuhost\u00ed, nanometrick\u00e9 polohovac\u00ed stupn\u011b a inteligentn\u00ed vizu\u00e1ln\u00ed zarovn\u00e1v\u00e1n\u00ed, aby bylo mo\u017en\u00e9 prov\u00e1d\u011bt v\u0161echny kl\u00ed\u010dov\u00e9 operace - v\u010detn\u011b nakl\u00e1d\u00e1n\u00ed, polohov\u00e1n\u00ed, \u0159ez\u00e1n\u00ed a kontroly - bez manu\u00e1ln\u00edho z\u00e1sahu. Synchronn\u00ed re\u017eim \u0159ez\u00e1n\u00ed se dv\u011bma v\u0159eteny v\u00fdrazn\u011b zvy\u0161uje v\u00fdkonnost zpracov\u00e1n\u00ed a\u017e o 80% ve srovn\u00e1n\u00ed s b\u011b\u017en\u00fdmi jednov\u0159etenov\u00fdmi syst\u00e9my. Prvot\u0159\u00eddn\u00ed dov\u00e1\u017een\u00e9 komponenty, v\u010detn\u011b kuli\u010dkov\u00fdch \u0161roub\u016f, line\u00e1rn\u00edch veden\u00ed a uzav\u0159en\u00e9ho \u0159\u00edzen\u00ed m\u0159\u00ed\u017eky v ose Y, zaji\u0161\u0165uj\u00ed konzistentn\u00ed dlouhodobou stabilitu a spolehlivost obr\u00e1b\u011bn\u00ed, a to i v prost\u0159ed\u00ed velkos\u00e9riov\u00e9 v\u00fdroby.<\/p>\n
![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/fully_automatic_precision_dicing_saw_equipment_for_8inch_12inch_wafer_cutting3-300x223.webp\")
Technick\u00e9 specifikace<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting4-300x240.jpg\")
Hlavn\u00ed v\u00fdhody<\/h3>\n![\"\"](\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/03\/Fully-Automatic-Precision-Dicing-Saw-Equipment-For-8inch-12inch-Wafer-Cutting5-300x240.jpg\")
Z\u00e1kladn\u00ed funkce<\/h3>\nP\u0159esn\u00e1 kr\u00e1jec\u00ed pila ZMSH je kompatibiln\u00ed se \u0161irokou \u0161k\u00e1lou materi\u00e1l\u016f a poskytuje \u0159e\u0161en\u00ed \u0159ez\u00e1n\u00ed na m\u00edru pro modern\u00ed polovodi\u010dov\u00e9 a elektronick\u00e9 obaly:<\/p>\n
| Materi\u00e1l<\/th>\n | Typick\u00e9 aplikace<\/th>\n | Po\u017eadavky na zpracov\u00e1n\u00ed<\/th>\n<\/tr>\n<\/thead>\n |
|---|---|---|
| Nitrid hlin\u00edku (AlN)<\/td>\n | LED substr\u00e1ty, vysoce v\u00fdkonn\u00e9 tepeln\u00e9 substr\u00e1ty<\/td>\n | N\u00edzk\u00e9 nam\u00e1h\u00e1n\u00ed p\u0159i kr\u00e1jen\u00ed na kostky, prevence delaminace<\/td>\n<\/tr>\n |
| Keramika PZT<\/td>\n | 5G filtry, SAW za\u0159\u00edzen\u00ed<\/td>\n | Vysokofrekven\u010dn\u00ed \u0159ez\u00e1n\u00ed stability<\/td>\n<\/tr>\n |
| Telurid vizmutu (Bi\u2082Te\u2083)<\/td>\n | Termoelektrick\u00e9 moduly<\/td>\n | Zpracov\u00e1n\u00ed p\u0159i n\u00edzk\u00fdch teplot\u00e1ch<\/td>\n<\/tr>\n |
| Monokrystalick\u00fd k\u0159em\u00edk (Si)<\/td>\n | \u010dipy IC<\/td>\n | Submikronov\u00e1 p\u0159esnost d\u011blen\u00ed<\/td>\n<\/tr>\n |
| Epoxidov\u00e1 formovac\u00ed sm\u011bs<\/td>\n | Substr\u00e1ty BGA<\/td>\n | Kompatibilita v\u00edcevrstv\u00fdch materi\u00e1l\u016f<\/td>\n<\/tr>\n |
| Cu pil\u00ed\u0159e \/ PI dielektrikum<\/td>\n | WLCSP<\/td>\n | Zpracov\u00e1n\u00ed ultratenk\u00fdch pl\u00e1tk\u016f<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\nAplikace a v\u00fdhody<\/h3>\nPln\u011b automatick\u00e1 kostkovac\u00ed pila ZMSH je vhodn\u00e1 pro v\u00fdrobu polovodi\u010d\u016f, pokro\u010dil\u00fdch obal\u016f, LED diod, MEMS za\u0159\u00edzen\u00ed a termoelektrick\u00fdch modul\u016f. Jej\u00ed p\u0159esnost zaji\u0161\u0165uje vysokou v\u00fdt\u011b\u017enost, minim\u00e1ln\u00ed po\u0161kozen\u00ed desti\u010dek a konzistentn\u00ed kvalitu \u0159ezu, a to i p\u0159i zpracov\u00e1n\u00ed k\u0159ehk\u00fdch nebo ultratenk\u00fdch desti\u010dek. D\u00edky kombinaci automatizace, \u0159ez\u00e1n\u00ed ve dvou v\u0159etenech a korekci chyb v re\u00e1ln\u00e9m \u010dase je ide\u00e1ln\u00ed pro vysoce v\u00fdkonn\u00e9 pr\u016fmyslov\u00e9 aplikace.<\/p>\n \u010casto kladen\u00e9 ot\u00e1zky<\/h3>\nOt\u00e1zka 1: Jak\u00e9 materi\u00e1ly lze \u0159ezat pomoc\u00ed tohoto syst\u00e9mu? Ot\u00e1zka 2: Jak re\u017eim dvou v\u0159eten zlep\u0161uje v\u00fdrobu? Ot\u00e1zka 3: Je syst\u00e9m pln\u011b automatizovan\u00fd? Ot\u00e1zka 4: Jak tenk\u00fd pl\u00e1tek dok\u00e1\u017ee zpracovat? Ot\u00e1zka 5: Lze syst\u00e9m integrovat do st\u00e1vaj\u00edc\u00edch v\u00fdrobn\u00edch automatiza\u010dn\u00edch linek? Pln\u011b automatick\u00e1 p\u0159esn\u00e1 kostkovac\u00ed pila ZMSH je pokro\u010dil\u00fd syst\u00e9m pro \u0159ez\u00e1n\u00ed polovodi\u010d\u016f a k\u0159ehk\u00fdch materi\u00e1l\u016f ur\u010den\u00fd pro vysoce p\u0159esn\u00e9 kostkov\u00e1n\u00ed desti\u010dek.<\/p>","protected":false},"featured_media":2007,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"product_brand":[],"product_cat":[21],"product_tag":[557,541,540,554,555,553,564,543,563,545,546,565,538,544,556,561,548,549,559,562,552,558,542,551,547,560,550,539],"class_list":{"0":"post-2000","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-laser-cutting","7":"product_tag-2m-accuracy","8":"product_tag-12-inch-wafer-cutting","9":"product_tag-8-inch-wafer-cutting","10":"product_tag-advanced-packaging","11":"product_tag-automated-wafer-dicing","12":"product_tag-bga-substrates","13":"product_tag-blade-breakage-monitoring","14":"product_tag-ceramic-wafer-cutting","15":"product_tag-cut-mark-inspection","16":"product_tag-diamond-blade-technology","17":"product_tag-dual-spindle-cutting","18":"product_tag-factory-automation-integration","19":"product_tag-fully-automatic-precision-dicing-saw","20":"product_tag-glass-wafer-cutting","21":"product_tag-high-precision-cutting","22":"product_tag-high-throughput-wafer-cutting","23":"product_tag-ic-chips","24":"product_tag-led-substrates","25":"product_tag-nanometric-positioning","26":"product_tag-non-contact-height-measurement","27":"product_tag-pzt-ceramic","28":"product_tag-rohs-certified","29":"product_tag-semiconductor-dicing","30":"product_tag-thermoelectric-modules","31":"product_tag-ultra-thin-wafer-processing","32":"product_tag-vision-alignment","33":"product_tag-wlcsp","34":"product_tag-zmsh","35":"desktop-align-left","36":"tablet-align-left","37":"mobile-align-left","38":"ast-product-gallery-layout-horizontal-slider","39":"ast-product-tabs-layout-horizontal","41":"first","42":"instock","43":"shipping-taxable","44":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2000","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2000"}],"version-history":[{"count":3,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2000\/revisions"}],"predecessor-version":[{"id":2009,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product\/2000\/revisions\/2009"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2007"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2000"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_brand?post=2000"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_cat?post=2000"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/product_tag?post=2000"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}} |