{"id":2558,"date":"2026-06-16T01:53:41","date_gmt":"2026-06-16T01:53:41","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2558"},"modified":"2026-06-16T01:53:46","modified_gmt":"2026-06-16T01:53:46","slug":"what-is-wafer-tir-and-how-is-it-different-from-ttv","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/cs\/what-is-wafer-tir-and-how-is-it-different-from-ttv\/","title":{"rendered":"Co je to TIR u wafer\u016f a v \u010dem se li\u0161\u00ed od TTV?"},"content":{"rendered":"<p>V <a href=\"https:\/\/www.zmsh-semitech.com\/cs\/products\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">v\u00fdroba polovodi\u010d\u016f<\/mark><\/a>, geometrie desti\u010dky hraje kl\u00ed\u010dovou roli p\u0159i ur\u010dov\u00e1n\u00ed stability procesu, p\u0159esnosti litografie, kvality spojov\u00e1n\u00ed a v kone\u010dn\u00e9m d\u016fsledku i v\u00fdt\u011b\u017enosti za\u0159\u00edzen\u00ed. Vzhledem k tomu, \u017ee se pr\u016fm\u011bry desti\u010dek neust\u00e1le zv\u011bt\u0161uj\u00ed a pokro\u010dil\u00e9 technologie balen\u00ed kladou st\u00e1le vy\u0161\u0161\u00ed n\u00e1roky, je pot\u0159eba p\u0159esn\u00e9 metrologie desti\u010dek v\u011bt\u0161\u00ed ne\u017e kdykoli p\u0159edt\u00edm.<\/p>\n\n\n\n<p>Mezi \u010detn\u00fdmi parametry, kter\u00e9 se pou\u017e\u00edvaj\u00ed k hodnocen\u00ed kvality polovodi\u010dov\u00fdch desti\u010dek, <strong>Celkov\u00e1 odchylka tlou\u0161\u0165ky (TTV)<\/strong> a <strong>Celkov\u00e1 indikovan\u00e1 hodnota (TIR)<\/strong> se vyskytuj\u00ed pom\u011brn\u011b \u010dasto. A\u010dkoli se ob\u011b veli\u010diny vztahuj\u00ed k tlou\u0161\u0165ce a rovinnosti desti\u010dky, popisuj\u00ed odli\u0161n\u00e9 fyzik\u00e1ln\u00ed vlastnosti a jsou \u010dasto nespr\u00e1vn\u011b ch\u00e1p\u00e1ny.<\/p>\n\n\n\n<p>Tento \u010dl\u00e1nek vysv\u011btluje definice, metody m\u011b\u0159en\u00ed, oblasti pou\u017eit\u00ed a hlavn\u00ed rozd\u00edly mezi veli\u010dinami TIR a TTV, \u010d\u00edm\u017e pom\u00e1h\u00e1 in\u017een\u00fdr\u016fm l\u00e9pe porozum\u011bt specifikac\u00edm geometrie polovodi\u010dov\u00fdch desti\u010dek.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"512\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1024x512.png\" alt=\"\" class=\"wp-image-2559\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1024x512.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-300x150.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-768x384.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-1536x768.png 1536w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-2048x1024.png 2048w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-18x9.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Is-Wafer-TIR-and-How-Is-It-Different-from-TTV-600x300.png 600w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Z\u00e1klady m\u011b\u0159en\u00ed tlou\u0161\u0165ky wafer\u016f<\/h2>\n\n\n\n<p><a href=\"https:\/\/www.zmsh-semitech.com\/cs\/kategorie-produktu\/wafer\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">Polovodi\u010dov\u00e1 desti\u010dka<\/mark>s<\/a> by m\u011bly m\u00edt po cel\u00e9 plo\u0161e velmi rovnom\u011brnou tlou\u0161\u0165ku. I nepatrn\u00e9 odchylky mohou m\u00edt vliv na:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>P\u0159esnost zaost\u0159en\u00ed p\u0159i litografii<\/li>\n\n\n\n<li>Manipulace s desti\u010dkami a jejich p\u0159eprava<\/li>\n\n\n\n<li>Procesy spojov\u00e1n\u00ed wafer\u016f<\/li>\n\n\n\n<li>V\u00fdkon CMP<\/li>\n\n\n\n<li>Spolehlivost za\u0159\u00edzen\u00ed a v\u00fdt\u011b\u017enost<\/li>\n<\/ul>\n\n\n\n<p>K posouzen\u00ed rovnom\u011brnosti tlou\u0161\u0165ky pou\u017e\u00edvaj\u00ed v\u00fdrobci n\u011bkolik geometrick\u00fdch parametr\u016f, mezi n\u011b\u017e pat\u0159\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tlou\u0161\u0165ka<\/li>\n\n\n\n<li>TTV (celkov\u00e1 odchylka tlou\u0161\u0165ky)<\/li>\n\n\n\n<li>Luk<\/li>\n\n\n\n<li>Warp<\/li>\n\n\n\n<li>TIR (celkov\u00e1 indikovan\u00e1 hodnota)<\/li>\n<\/ul>\n\n\n\n<p>Ka\u017ed\u00fd parametr poskytuje jedine\u010dn\u00e9 informace o fyzick\u00e9m stavu desti\u010dky.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je to <a href=\"https:\/\/www.zmsh-semitech.com\/cs\/what-are-wafer-ttv-bow-and-warp\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">TTV (celkov\u00e1 odchylka tlou\u0161\u0165ky)<\/mark><\/a>?<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Definice<\/h3>\n\n\n\n<p>TTV p\u0159edstavuje rozd\u00edl mezi maxim\u00e1ln\u00ed a minim\u00e1ln\u00ed tlou\u0161\u0165kou nam\u011b\u0159enou na plo\u0161e desti\u010dky.<\/p>\n\n\n\n<p>Matematicky:<\/p>\n\n\n\n<p><strong>TTV = maxim\u00e1ln\u00ed tlou\u0161\u0165ka \u2212 minim\u00e1ln\u00ed tlou\u0161\u0165ka<\/strong><\/p>\n\n\n\n<p>Metoda TTV se zam\u011b\u0159uje v\u00fdhradn\u011b na rovnom\u011brnost tlou\u0161\u0165ky a nezohled\u0148uje orientaci desti\u010dky ani jej\u00ed rota\u010dn\u00ed chov\u00e1n\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Princip m\u011b\u0159en\u00ed<\/h3>\n\n\n\n<p>M\u011b\u0159en\u00ed tlou\u0161\u0165ky se prov\u00e1d\u00ed v n\u011bkolika bodech po cel\u00e9m povrchu desti\u010dky pomoc\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kapacitn\u00ed senzory<\/li>\n\n\n\n<li>Optick\u00e9 interferometry<\/li>\n\n\n\n<li>Kontaktn\u00ed tlou\u0161\u0165kom\u011bry<\/li>\n\n\n\n<li>Laserov\u00e9 m\u011b\u0159ic\u00ed syst\u00e9my<\/li>\n<\/ul>\n\n\n\n<p>Zjist\u00ed se nejvy\u0161\u0161\u00ed a nejni\u017e\u0161\u00ed hodnota tlou\u0161\u0165ky a jejich rozd\u00edl se stane hodnotou TTV.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">P\u0159\u00edklad<\/h3>\n\n\n\n<p>Pokud se tlou\u0161\u0165ka desti\u010dky pohybuje v rozmez\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Maxim\u00e1ln\u00ed tlou\u0161\u0165ka: 726 \u03bcm<\/li>\n\n\n\n<li>Minim\u00e1ln\u00ed tlou\u0161\u0165ka: 721 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p>Potom:<\/p>\n\n\n\n<p><strong>TTV = 726 \u2212 721 = 5 \u03bcm<\/strong><\/p>\n\n\n\n<p>\u010c\u00edm men\u0161\u00ed je hodnota TTV, t\u00edm lep\u0161\u00ed je rovnom\u011brnost tlou\u0161\u0165ky.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je TIR (celkov\u00e1 indikovan\u00e1 hodnota)?<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Definice<\/h3>\n\n\n\n<p>Ukazatel TIR m\u011b\u0159\u00ed celkovou odchylku pozorovanou p\u0159i ot\u00e1\u010den\u00ed desti\u010dky kolem jej\u00ed st\u0159edov\u00e9 osy.<\/p>\n\n\n\n<p>Na rozd\u00edl od TTV odr\u00e1\u017e\u00ed TIR kombinovan\u00fd vliv:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kol\u00eds\u00e1n\u00ed tlou\u0161\u0165ky<\/li>\n\n\n\n<li>Nerovnosti povrchu<\/li>\n\n\n\n<li>Excentricita desti\u010dky<\/li>\n\n\n\n<li>Chyby v zarovn\u00e1n\u00ed up\u00ednac\u00edch prvk\u016f<\/li>\n\n\n\n<li>Povrchov\u00e9 vybo\u010den\u00ed<\/li>\n<\/ul>\n\n\n\n<p>Technologie TIR se b\u011b\u017en\u011b pou\u017e\u00edv\u00e1 v oblasti p\u0159esn\u00e9ho stroj\u00edrenstv\u00ed a metrologie.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Princip m\u011b\u0159en\u00ed<\/h3>\n\n\n\n<p>D\u0159\u00edk je upevn\u011bn na v\u0159etenu a ot\u00e1\u010d\u00ed se o 360 stup\u0148\u016f, p\u0159i\u010dem\u017e sn\u00edma\u010d posunu nep\u0159etr\u017eit\u011b zaznamen\u00e1v\u00e1 pohyb povrchu.<\/p>\n\n\n\n<p>Rozd\u00edl mezi nejvy\u0161\u0161\u00ed a nejni\u017e\u0161\u00ed nam\u011b\u0159enou hodnotou b\u011bhem ot\u00e1\u010den\u00ed se definuje jako:<\/p>\n\n\n\n<p><strong>TIR = maxim\u00e1ln\u00ed hodnota na m\u011b\u0159idle \u2212 minim\u00e1ln\u00ed hodnota na m\u011b\u0159idle<\/strong><\/p>\n\n\n\n<h3 class=\"wp-block-heading\">P\u0159\u00edklad<\/h3>\n\n\n\n<p>B\u011bhem rotace:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Nejvy\u0161\u0161\u00ed nam\u011b\u0159en\u00e1 hodnota: +3 \u03bcm<\/li>\n\n\n\n<li>Nejni\u017e\u0161\u00ed nam\u011b\u0159en\u00e1 hodnota: \u22124 \u03bcm<\/li>\n<\/ul>\n\n\n\n<p>Potom:<\/p>\n\n\n\n<p><strong>TIR = 3 \u2212 (\u22124) = 7 \u03bcm<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TTV vs. TIR: Hlavn\u00ed rozd\u00edly<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th>Parametr<\/th><th>TTV<\/th><th>TIR<\/th><\/tr><tr><td>Cel\u00e9 jm\u00e9no<\/td><td>Celkov\u00e1 odchylka tlou\u0161\u0165ky<\/td><td>Celkov\u00e1 indikovan\u00e1 hodnota<\/td><\/tr><tr><td>Hlavn\u00ed \u00fa\u010del<\/td><td>Rovnom\u011brnost tlou\u0161\u0165ky<\/td><td>Zm\u011bna rota\u010dn\u00edho povrchu<\/td><\/tr><tr><td>M\u011b\u0159\u00ed tlou\u0161\u0165ku?<\/td><td>Ano<\/td><td>\u010c\u00e1ste\u010dn\u011b<\/td><\/tr><tr><td>Z\u00e1vis\u00ed to na tvaru povrchu?<\/td><td>Ne<\/td><td>Ano<\/td><\/tr><tr><td>Je to ovlivn\u011bno excentricitou desti\u010dky?<\/td><td>Ne<\/td><td>Ano<\/td><\/tr><tr><td>Je nutn\u00e1 rotace?<\/td><td>Ne<\/td><td>Ano<\/td><\/tr><tr><td>Typick\u00e9 pou\u017eit\u00ed<\/td><td>Kvalifikace polovodi\u010dov\u00fdch desti\u010dek<\/td><td>P\u0159esn\u00e1 metrologie a se\u0159izov\u00e1n\u00ed za\u0159\u00edzen\u00ed<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Nejd\u016fle\u017eit\u011bj\u0161\u00ed rozd\u00edl spo\u010d\u00edv\u00e1 v tom, \u017ee:<\/p>\n\n\n\n<p><strong>Metoda TTV m\u011b\u0159\u00ed p\u0159\u00edmo kol\u00eds\u00e1n\u00ed tlou\u0161\u0165ky, zat\u00edmco metoda TIR m\u011b\u0159\u00ed celkov\u00e9 kol\u00eds\u00e1n\u00ed polohy b\u011bhem ot\u00e1\u010den\u00ed.<\/strong><\/p>\n\n\n\n<p>V d\u016fsledku toho jsou hodnoty TIR \u010dasto v\u011bt\u0161\u00ed ne\u017e hodnoty TTV, proto\u017ee zahrnuj\u00ed i dal\u0161\u00ed geometrick\u00e9 chyby.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Vztah mezi TIR a TTV<\/h2>\n\n\n\n<p>A\u010dkoli jsou pojmy TIR a TTV p\u0159\u00edbuzn\u00e9, nejsou zam\u011bniteln\u00e9.<\/p>\n\n\n\n<p>V ide\u00e1ln\u00edm pl\u00e1tku:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Dokonal\u00e9 vycentrov\u00e1n\u00ed<\/li>\n\n\n\n<li>Dokonal\u00e9 vyrovn\u00e1n\u00ed v\u0159etena<\/li>\n\n\n\n<li>\u017d\u00e1dn\u00e9 nerovnosti povrchu<\/li>\n<\/ul>\n\n\n\n<p>Hodnota TIR se m\u016f\u017ee p\u0159ibl\u00ed\u017eit hodnot\u011b TTV.<\/p>\n\n\n\n<p>V re\u00e1ln\u00fdch v\u00fdrobn\u00edch podm\u00ednk\u00e1ch je v\u0161ak TIR obvykle ovliv\u0148ov\u00e1n dal\u0161\u00edmi faktory:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Odchylka povrchu<\/h3>\n\n\n\n<p>Mikroskopick\u00e9 zvln\u011bn\u00ed nebo lok\u00e1ln\u00ed vady mohou zv\u00fd\u0161it hodnoty na indik\u00e1toru.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Excentricita desti\u010dky<\/h3>\n\n\n\n<p>Pokud se st\u0159ed desti\u010dky neshoduje p\u0159esn\u011b s osou v\u0159etena, hodnota TIR se zvy\u0161uje.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Chyby v rozlosov\u00e1n\u00ed<\/h3>\n\n\n\n<p>K odchylk\u00e1m v m\u011b\u0159en\u00ed m\u016f\u017ee p\u0159isp\u00edvat rovinnost up\u00ednac\u00edho n\u00e1stavce a p\u0159esnost upevn\u011bn\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Mechanick\u00e9 vibrace<\/h3>\n\n\n\n<p>Nestabilita za\u0159\u00edzen\u00ed m\u016f\u017ee zp\u016fsobit \u0161um v m\u011b\u0159en\u00ed.<\/p>\n\n\n\n<p>Z toho vypl\u00fdv\u00e1:<\/p>\n\n\n\n<p><strong>Ve v\u011bt\u0161in\u011b praktick\u00fdch situac\u00ed plat\u00ed, \u017ee TIR \u2265 TTV.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Pro\u010d je technologie TIR d\u016fle\u017eit\u00e1 p\u0159i v\u00fdrob\u011b polovodi\u010d\u016f<\/h2>\n\n\n\n<p>S t\u00edm, jak se pr\u016fm\u011br wafer\u016f zv\u011bt\u0161uje ze 150 mm a 200 mm na 300 mm a v\u00edce, nab\u00fdv\u00e1 geometrick\u00e1 p\u0159esnost st\u00e1le v\u011bt\u0161\u00edho v\u00fdznamu.<\/p>\n\n\n\n<p>M\u011b\u0159en\u00ed TIR se b\u011b\u017en\u011b pou\u017e\u00edvaj\u00ed v:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Brou\u0161en\u00ed desti\u010dek<\/h3>\n\n\n\n<p>Sledov\u00e1n\u00ed p\u0159esnosti v\u0159etena b\u011bhem proces\u016f zadn\u00edho brou\u0161en\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Le\u0161t\u011bn\u00ed desti\u010dek<\/h3>\n\n\n\n<p>Hodnocen\u00ed rota\u010dn\u00ed stability b\u011bhem operac\u00ed CMP.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Syst\u00e9my pro kontrolu polovodi\u010dov\u00fdch desti\u010dek<\/h3>\n\n\n\n<p>Zaji\u0161t\u011bn\u00ed p\u0159esn\u00e9ho um\u00edst\u011bn\u00ed a zaost\u0159en\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Spojov\u00e1n\u00ed desti\u010dek<\/h3>\n\n\n\n<p>Sn\u00ed\u017een\u00ed chyb zarovn\u00e1n\u00ed v aplikac\u00edch pokro\u010dil\u00e9ho balen\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">V\u00fdroba MEMS<\/h3>\n\n\n\n<p>Dodr\u017eov\u00e1n\u00ed p\u0159\u00edsn\u00fdch po\u017eadavk\u016f na rovinnost mikroelektromechanick\u00fdch struktur.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Typick\u00e9 po\u017eadavky v dan\u00e9m odv\u011btv\u00ed<\/h2>\n\n\n\n<p>P\u0159ijateln\u00e9 hodnoty TTV a TIR z\u00e1vis\u00ed na typu desti\u010dky a konkr\u00e9tn\u00edm pou\u017eit\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">K\u0159em\u00edkov\u00e9 desti\u010dky<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Pr\u016fm\u011br<\/td><td>Typick\u00e1 hodnota TTV<\/td><\/tr><tr><td>150 mm<\/td><td>&lt; 5 \u03bcm<\/td><\/tr><tr><td>200 mm<\/td><td>&lt; 3 \u03bcm<\/td><\/tr><tr><td>300 mm<\/td><td>&lt; 1 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Pokro\u010dil\u00e9 SiC desti\u010dky<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Pr\u016fm\u011br<\/td><td>Typick\u00e1 hodnota TTV<\/td><\/tr><tr><td>6 palc\u016f<\/td><td>&lt; 10 \u03bcm<\/td><\/tr><tr><td>8 palc\u016f<\/td><td>&lt; 5 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Specifikace TIR jsou obecn\u011b ur\u010dov\u00e1ny sp\u00ed\u0161e v\u00fdrobci za\u0159\u00edzen\u00ed a po\u017eadavky na proces ne\u017e pouze normami pro substr\u00e1ty.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">TIR, TTV, prohnut\u00ed a zkroucen\u00ed: ucelen\u00fd p\u0159ehled<\/h2>\n\n\n\n<p>\u017d\u00e1dn\u00fd jednotliv\u00fd parametr nedok\u00e1\u017ee geometrii desti\u010dky pln\u011b popsat.<\/p>\n\n\n\n<p>In\u017een\u00fd\u0159i obvykle posuzuj\u00ed:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Parametr<\/td><td>Popis<\/td><\/tr><tr><td>Tlou\u0161\u0165ka<\/td><td>Pr\u016fm\u011brn\u00e1 tlou\u0161\u0165ka desti\u010dky<\/td><\/tr><tr><td>TTV<\/td><td>Rovnom\u011brnost tlou\u0161\u0165ky<\/td><\/tr><tr><td>TIR<\/td><td>Rota\u010dn\u00ed odchylka<\/td><\/tr><tr><td>Luk<\/td><td>Posun st\u0159edu od referen\u010dn\u00ed roviny<\/td><\/tr><tr><td>Warp<\/td><td>Celkov\u00e1 deformace desti\u010dky<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>V\u0161echna tato m\u011b\u0159en\u00ed dohromady poskytuj\u00ed ucelen\u00fd p\u0159ehled o kvalit\u011b desti\u010dek a kompatibilit\u011b proces\u016f.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Z\u00e1v\u011br<\/h2>\n\n\n\n<p>TTV i TIR jsou sice oba z\u00e1sadn\u00ed parametry pro m\u011b\u0159en\u00ed polovodi\u010dov\u00fdch desti\u010dek, ale slou\u017e\u00ed k odli\u0161n\u00fdm \u00fa\u010del\u016fm.<\/p>\n\n\n\n<p>Parametr TTV kvantifikuje rovnom\u011brnost tlou\u0161\u0165ky po cel\u00e9m povrchu desti\u010dky, co\u017e z n\u011bj \u010din\u00ed kl\u00ed\u010dovou specifikaci pro v\u00fdrobce substr\u00e1t\u016f a polovodi\u010dov\u00e9 tov\u00e1rny. Parametr TIR naproti tomu m\u011b\u0159\u00ed celkovou polohovou odchylku b\u011bhem ot\u00e1\u010den\u00ed a odr\u00e1\u017e\u00ed kombinovan\u00e9 \u00fa\u010dinky kol\u00eds\u00e1n\u00ed tlou\u0161\u0165ky, povrchov\u00fdch nerovnost\u00ed a mechanick\u00e9ho vyrovn\u00e1n\u00ed.<\/p>\n\n\n\n<p>Vzhledem k tomu, \u017ee se v\u00fdroba polovodi\u010d\u016f st\u00e1le v\u00edce orientuje na v\u011bt\u0161\u00ed pr\u016fm\u011bry desti\u010dek, pokro\u010dil\u00e9 balen\u00ed a p\u0159\u00edsn\u011bj\u0161\u00ed procesn\u00ed tolerance, st\u00e1v\u00e1 se pro in\u017een\u00fdry zab\u00fdvaj\u00edc\u00ed se v\u00fdrobou desti\u010dek, kontrolou a v\u00fdrobou za\u0159\u00edzen\u00ed st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed pochopit rozd\u00edl mezi TTV a TIR.<\/p>\n\n\n\n<p>D\u00edky p\u0159esn\u00e9mu vyhodnocen\u00ed obou parametr\u016f mohou v\u00fdrobci zlep\u0161it stabilitu procesu, v\u00fdkon za\u0159\u00edzen\u00ed a celkovou v\u00fdt\u011b\u017enost za\u0159\u00edzen\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"<p>In semiconductor manufacturing, wafer geometry plays a critical role in determining process stability, lithography accuracy, bonding quality, and ultimately device yield. As wafer diameters continue to increase and advanced packaging technologies become more demanding, the need for precise wafer metrology has never been greater. Among the many parameters used to evaluate wafer quality, Total Thickness [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2559,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[25],"tags":[1522,383,1524,36,195,637,1090,1520,130,1518,372,1515,1521,714,1517,1523,1519,873,131],"class_list":["post-2558","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-technology-applications","tag-cmp-process","tag-precision-metrology","tag-semiconductor-engineering","tag-semiconductor-manufacturing","tag-semiconductor-materials","tag-sic-wafer","tag-silicon-wafer","tag-total-indicated-reading","tag-total-thickness-variation","tag-wafer-bow","tag-wafer-flatness","tag-wafer-geometry","tag-wafer-grinding","tag-wafer-inspection","tag-wafer-metrology","tag-wafer-thickness-measurement","tag-wafer-tir","tag-wafer-ttv","tag-wafer-warp"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2558","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2558"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2558\/revisions"}],"predecessor-version":[{"id":2560,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2558\/revisions\/2560"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2559"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2558"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/categories?post=2558"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/tags?post=2558"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}