{"id":2555,"date":"2026-06-16T01:21:44","date_gmt":"2026-06-16T01:21:44","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2555"},"modified":"2026-06-16T01:21:50","modified_gmt":"2026-06-16T01:21:50","slug":"what-are-wafer-ttv-bow-and-warp","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/cs\/what-are-wafer-ttv-bow-and-warp\/","title":{"rendered":"Co jsou TTV, prohnut\u00ed a zkroucen\u00ed desti\u010dky? Praktick\u00fd pr\u016fvodce rovinnost\u00ed desti\u010dek"},"content":{"rendered":"<p>V <a href=\"https:\/\/www.zmsh-semitech.com\/cs\/products\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">v\u00fdroba polovodi\u010d\u016f<\/mark><\/a>, kvalita desti\u010dky toti\u017e nespo\u010d\u00edv\u00e1 pouze v \u010distot\u011b materi\u00e1lu. I dokonale vyrobena desti\u010dka z k\u0159em\u00edku, saf\u00edru, k\u0159emene nebo karbidu k\u0159em\u00edku m\u016f\u017ee zp\u016fsobit probl\u00e9my ve v\u00fdrob\u011b, pokud nen\u00ed jej\u00ed geometrie \u0159\u00e1dn\u011b kontrolov\u00e1na.<\/p>\n\n\n\n<p>Mezi nejd\u016fle\u017eit\u011bj\u0161\u00ed parametry geometrie desti\u010dky pat\u0159\u00ed TTV (celkov\u00e1 odchylka tlou\u0161\u0165ky), prohnut\u00ed a zkroucen\u00ed. Tyto m\u011b\u0159en\u00ed pom\u00e1haj\u00ed in\u017een\u00fdr\u016fm posoudit rovnom\u011brnost tlou\u0161\u0165ky a rovinnost desti\u010dky je\u0161t\u011b p\u0159edt\u00edm, ne\u017e desti\u010dka vstoup\u00ed do kritick\u00fdch proces\u016f, jako jsou litografie, lepen\u00ed, zten\u010dov\u00e1n\u00ed a balen\u00ed.<\/p>\n\n\n\n<p>Tento \u010dl\u00e1nek vysv\u011btluje, co tyto parametry znamenaj\u00ed, pro\u010d jsou d\u016fle\u017eit\u00e9 a jak se m\u011b\u0159\u00ed.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-1024x683.png\" alt=\"\" class=\"wp-image-2556\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-1024x683.png 1024w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-300x200.png 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-768x512.png 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-18x12.png 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp-600x400.png 600w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/06\/What-Are-Wafer-TTV-Bow-and-Warp.png 1536w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Pro\u010d je rovinnost desti\u010dky d\u016fle\u017eit\u00e1<\/h2>\n\n\n\n<p>Modern\u00ed polovodi\u010dov\u00e1 za\u0159\u00edzen\u00ed se vyr\u00e1b\u011bj\u00ed s extr\u00e9mn\u011b mal\u00fdmi tolerancemi. I nepatrn\u00e1 odchylka v tlou\u0161\u0165ce nebo rovinnosti desti\u010dky m\u016f\u017ee m\u00edt vliv na:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>P\u0159esnost zaost\u0159en\u00ed p\u0159i fotolitografii<\/li>\n\n\n\n<li>Kvalita spojov\u00e1n\u00ed desti\u010dek<\/li>\n\n\n\n<li>Rovnom\u011brnost nan\u00e1\u0161en\u00ed tenk\u00fdch vrstev<\/li>\n\n\n\n<li>V\u00fdkonnost CMP (chemicko-mechanick\u00e9ho le\u0161t\u011bn\u00ed)<\/li>\n\n\n\n<li>V\u00fdt\u011b\u017enost kr\u00e1jen\u00ed na kostky a balen\u00ed<\/li>\n<\/ul>\n\n\n\n<p>S rostouc\u00edm pr\u016fm\u011brem desti\u010dek a zvy\u0161uj\u00edc\u00ed se slo\u017eitost\u00ed struktur polovodi\u010dov\u00fdch prvk\u016f nab\u00fdv\u00e1 kontrola geometrie desti\u010dek st\u00e1le v\u011bt\u0161\u00edho v\u00fdznamu.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je TTV (celkov\u00e1 odchylka tlou\u0161\u0165ky)?<\/h2>\n\n\n\n<p>TTV (Total Thickness Variation) ud\u00e1v\u00e1, jak rovnom\u011brn\u00e1 je tlou\u0161\u0165ka desti\u010dky po cel\u00e9 jej\u00ed plo\u0161e.<\/p>\n\n\n\n<p>Definuje se jako rozd\u00edl mezi maxim\u00e1ln\u00ed a minim\u00e1ln\u00ed tlou\u0161\u0165kou nam\u011b\u0159enou na desti\u010dce.<\/p>\n\n\n\n<p><strong>Vzorec:<\/strong><\/p>\n\n\n\n<p>TTV = maxim\u00e1ln\u00ed tlou\u0161\u0165ka \u2212 minim\u00e1ln\u00ed tlou\u0161\u0165ka<\/p>\n\n\n\n<p>Nap\u0159\u00edklad pokud je nejtlust\u0161\u00ed m\u00edsto na desti\u010dce 726 \u03bcm a nejten\u010d\u00ed m\u00edsto 721 \u03bcm, pak je TTV 5 \u03bcm.<\/p>\n\n\n\n<p>Ni\u017e\u0161\u00ed hodnota TTV obecn\u011b sv\u011bd\u010d\u00ed o lep\u0161\u00ed rovnom\u011brnosti tlou\u0161\u0165ky, co\u017e je pro p\u0159esn\u00e9 zpracov\u00e1n\u00ed polovodi\u010d\u016f z\u00e1sadn\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Pro\u010d je TTV d\u016fle\u017eit\u00e9<\/h3>\n\n\n\n<p>Nadm\u011brn\u00e1 hodnota TTV m\u016f\u017ee v\u00e9st k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Chyby zaost\u0159en\u00ed p\u0159i litografii<\/li>\n\n\n\n<li>Nerovnom\u011brn\u00e9 v\u00fdsledky le\u0161t\u011bn\u00ed<\/li>\n\n\n\n<li>N\u00edzk\u00e1 \u00fa\u010dinnost spojov\u00e1n\u00ed desti\u010dek<\/li>\n\n\n\n<li>Zv\u00fd\u0161en\u00e1 procesn\u00ed variabilita<\/li>\n<\/ul>\n\n\n\n<p>U \u0161pi\u010dkov\u00fdch polovodi\u010dov\u00fdch desti\u010dek se \u010dasto vy\u017eaduj\u00ed hodnoty TTV v \u0159\u00e1du pouh\u00fdch n\u011bkolika mikron\u016f nebo m\u00e9n\u011b.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je to prohnut\u00ed desti\u010dky?<\/h2>\n\n\n\n<p>Bow popisuje celkov\u00e9 zak\u0159iven\u00ed desti\u010dky vzhledem k referen\u010dn\u00ed rovin\u011b.<\/p>\n\n\n\n<p>P\u0159edstavte si, \u017ee polo\u017e\u00edte desti\u010dku na rovnou plochu. Pokud se st\u0159ed desti\u010dky vyv\u00fd\u0161\u00ed nad referen\u010dn\u00ed rovinu nebo klesne pod ni, doch\u00e1z\u00ed k prohnut\u00ed desti\u010dky.<\/p>\n\n\n\n<p>Ohyb je obvykle zp\u016fsoben vnit\u0159n\u00edm nap\u011bt\u00edm vznikaj\u00edc\u00edm b\u011bhem:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Epitaxn\u00ed r\u016fst<\/li>\n\n\n\n<li>Nan\u00e1\u0161en\u00ed tenk\u00fdch vrstev<\/li>\n\n\n\n<li>Tepeln\u00e9 zpracov\u00e1n\u00ed<\/li>\n\n\n\n<li>Zten\u010dov\u00e1n\u00ed desti\u010dek<\/li>\n<\/ul>\n\n\n\n<p>Kladn\u00e9 prohnut\u00ed znamen\u00e1, \u017ee st\u0159ed desti\u010dky le\u017e\u00ed v\u00fd\u0161e ne\u017e referen\u010dn\u00ed rovina, zat\u00edmco z\u00e1porn\u00e9 prohnut\u00ed znamen\u00e1, \u017ee le\u017e\u00ed n\u00ed\u017ee.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Pro\u010d je luk d\u016fle\u017eit\u00fd<\/h3>\n\n\n\n<p>Luk m\u016f\u017ee ovlivnit:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Manipulace s desti\u010dkami<\/li>\n\n\n\n<li>P\u0159esnost vyrovn\u00e1n\u00ed<\/li>\n\n\n\n<li>Procesy lepen\u00ed<\/li>\n\n\n\n<li>Hodnocen\u00ed nap\u011bt\u00ed v tenk\u00fdch vrstv\u00e1ch<\/li>\n<\/ul>\n\n\n\n<p>U speci\u00e1ln\u011b vyvinut\u00fdch desti\u010dek a modern\u00edch substr\u00e1t\u016f se prohnut\u00ed \u010dasto sleduje v pr\u016fb\u011bhu cel\u00e9ho v\u00fdrobn\u00edho procesu.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je to deformace desti\u010dky?<\/h2>\n\n\n\n<p>M\u011b\u0159en\u00ed deformace (Warp) slou\u017e\u00ed k ur\u010den\u00ed celkov\u00e9 deformace voln\u011b le\u017e\u00edc\u00edho waferu.<\/p>\n\n\n\n<p>Na rozd\u00edl od prohnut\u00ed, kter\u00e9 popisuje p\u0159edev\u0161\u00edm rovnom\u011brn\u00e9 zak\u0159iven\u00ed, pojem \u201edeformace\u201c zahrnuje jak celkov\u00e9 ohyby, tak lok\u00e1ln\u00ed povrchov\u00e9 deformace.<\/p>\n\n\n\n<p>V d\u016fsledku toho zkreslen\u00ed obvykle poskytuje realisti\u010dt\u011bj\u0161\u00ed obraz skute\u010dn\u00e9ho tvaru desti\u010dky.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Pro\u010d je Warp d\u016fle\u017eit\u00fd<\/h3>\n\n\n\n<p>Vysok\u00e9 hodnoty osov\u00e9 deformace mohou zp\u016fsobit:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Probl\u00e9my s manipulac\u00ed s vybaven\u00edm<\/li>\n\n\n\n<li>Probl\u00e9my s vakuov\u00fdm up\u00edn\u00e1n\u00edm<\/li>\n\n\n\n<li>Sn\u00ed\u017een\u00e1 v\u00fdt\u011b\u017enost spojov\u00e1n\u00ed<\/li>\n\n\n\n<li>Obavy ohledn\u011b spolehlivosti balen\u00ed<\/li>\n<\/ul>\n\n\n\n<p>Deformace se stala obzvl\u00e1\u0161t\u011b d\u016fle\u017eitou v oblasti pokro\u010dil\u00fdch balic\u00edch technologi\u00ed, kde se kombinuje v\u00edce materi\u00e1l\u016f s r\u016fzn\u00fdmi koeficienty tepeln\u00e9 rozta\u017enosti.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Bow vs. Warp: V \u010dem spo\u010d\u00edv\u00e1 rozd\u00edl?<\/h2>\n\n\n\n<p>A\u010dkoli se tyto pojmy \u010dasto pou\u017e\u00edvaj\u00ed spole\u010dn\u011b, popisuj\u00ed r\u016fzn\u00e9 aspekty geometrie desti\u010dky.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th>Parametr<\/th><th>Luk<\/th><th>Warp<\/th><\/tr><tr><td>Opat\u0159en\u00ed<\/td><td>Celkov\u00e9 zak\u0159iven\u00ed<\/td><td>Celkov\u00e1 deformace<\/td><\/tr><tr><td>Zahrnuje lok\u00e1ln\u00ed zkreslen\u00ed<\/td><td>Ne<\/td><td>Ano<\/td><\/tr><tr><td>Typick\u00e1 hodnota<\/td><td>Men\u0161\u00ed<\/td><td>V\u011bt\u0161\u00ed<\/td><\/tr><tr><td>Hlavn\u00ed aplikace<\/td><td>Anal\u00fdza nap\u011bt\u00ed<\/td><td>Balen\u00ed a lepen\u00ed<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Jednoduch\u00fd zp\u016fsob, jak si tento rozd\u00edl zapamatovat, je:<\/p>\n\n\n\n<p><strong>Pojem \u201ebow\u201c popisuje zak\u0159iven\u00ed desti\u010dky, zat\u00edmco pojem \u201ewarp\u201c popisuje jej\u00ed skute\u010dn\u00fd tvar.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Jak se m\u011b\u0159\u00ed TTV, prohnut\u00ed a zkroucen\u00ed?<\/h2>\n\n\n\n<p>Modern\u00ed metrologie polovodi\u010dov\u00fdch desti\u010dek se op\u00edr\u00e1 p\u0159edev\u0161\u00edm o bezkontaktn\u00ed optick\u00e9 m\u011b\u0159ic\u00ed techniky.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Laserov\u00e9 skenovac\u00ed syst\u00e9my<\/h3>\n\n\n\n<p>Laserov\u00e9 syst\u00e9my skenuj\u00ed oba povrchy desti\u010dek a vytv\u00e1\u0159ej\u00ed podrobn\u00e9 mapy tlou\u0161\u0165ky a rovinnosti.<\/p>\n\n\n\n<p>Tyto syst\u00e9my mohou m\u011b\u0159it:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Tlou\u0161\u0165ka<\/li>\n\n\n\n<li>TTV<\/li>\n\n\n\n<li>Luk<\/li>\n\n\n\n<li>Warp<\/li>\n<\/ul>\n\n\n\n<p>Jsou \u0161iroce vyu\u017e\u00edv\u00e1ny pro desti\u010dky z k\u0159em\u00edku, saf\u00edru, k\u0159emene a SiC.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Optick\u00e9 profilometry<\/h3>\n\n\n\n<p>Optick\u00e9 profilometry vytv\u00e1\u0159ej\u00ed trojrozm\u011brn\u00e9 profily povrchu s vysokou p\u0159esnost\u00ed.<\/p>\n\n\n\n<p>Obvykle se pou\u017e\u00edvaj\u00ed k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Anal\u00fdza osnovy<\/li>\n\n\n\n<li>M\u011b\u0159en\u00ed topografie povrchu<\/li>\n\n\n\n<li>Kontrola rovinnosti<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Interferometry s b\u00edl\u00fdm sv\u011btlem<\/h3>\n\n\n\n<p>Pro ultrap\u0159esn\u00e9 aplikace m\u016f\u017ee interferometrie s b\u00edl\u00fdm sv\u011btlem poskytnout m\u011b\u0159ic\u00ed rozli\u0161en\u00ed v \u0159\u00e1du submikron\u016f a dokonce i nanometr\u016f.<\/p>\n\n\n\n<p>Tyto syst\u00e9my se \u010dasto vyu\u017e\u00edvaj\u00ed v oblastech MEMS, fotoniky a ve v\u00fdzkumn\u00fdch aplikac\u00edch.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Specifikace typick\u00e9 geometrie desti\u010dek<\/h2>\n\n\n\n<p>P\u0159\u00edpustn\u00e9 hodnoty TTV, prohnut\u00ed a zkroucen\u00ed se li\u0161\u00ed v z\u00e1vislosti na materi\u00e1lu desti\u010dky a konkr\u00e9tn\u00edm pou\u017eit\u00ed.<\/p>\n\n\n\n<p>Mezi typick\u00e9 p\u0159\u00edklady pat\u0159\u00ed:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Typ desti\u010dky<\/td><td>Typick\u00e1 hodnota TTV<\/td><\/tr><tr><td>K\u0159em\u00edkov\u00e9 desti\u010dky<\/td><td>1\u20135 \u03bcm<\/td><\/tr><tr><td>Saf\u00edrov\u00e1 desti\u010dka<\/td><td>3\u201310 \u03bcm<\/td><\/tr><tr><td>K\u0159em\u00edkov\u00e1 desti\u010dka<\/td><td>5\u201320 \u03bcm<\/td><\/tr><tr><td>SiC Wafer<\/td><td>2\u201310 \u03bcm<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Konkr\u00e9tn\u00ed technick\u00e9 parametry z\u00e1vis\u00ed na pr\u016fm\u011bru a tlou\u0161\u0165ce desti\u010dky a na po\u017eadavc\u00edch dan\u00e9ho kone\u010dn\u00e9ho pou\u017eit\u00ed.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Z\u00e1v\u011br<\/h2>\n\n\n\n<p>TTV, prohnut\u00ed a zvr\u00e1sn\u011bn\u00ed jsou z\u00e1kladn\u00ed parametry pou\u017e\u00edvan\u00e9 k hodnocen\u00ed geometrie a rovinnosti desti\u010dky.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>TTV<\/strong> m\u011b\u0159\u00ed rovnom\u011brnost tlou\u0161\u0165ky.<\/li>\n\n\n\n<li><strong>Luk<\/strong> m\u011b\u0159\u00ed celkov\u00e9 zak\u0159iven\u00ed desti\u010dky.<\/li>\n\n\n\n<li><strong>Warp<\/strong> m\u011b\u0159\u00ed celkovou deformaci desti\u010dky.<\/li>\n<\/ul>\n\n\n\n<p>Vzhledem k neust\u00e1l\u00e9mu pokroku ve v\u00fdrob\u011b polovodi\u010d\u016f je p\u0159\u00edsn\u011bj\u0161\u00ed kontrola t\u011bchto parametr\u016f nezbytn\u00e1 pro dosa\u017een\u00ed vy\u0161\u0161\u00edch v\u00fdt\u011b\u017enost\u00ed, lep\u0161\u00edho v\u00fdkonu za\u0159\u00edzen\u00ed a v\u011bt\u0161\u00ed stability v\u00fdrobn\u00edho procesu.<\/p>\n\n\n\n<p>A\u0165 u\u017e hled\u00e1te dodavatele <a href=\"https:\/\/www.zmsh-semitech.com\/cs\/kategorie-produktu\/wafer\/\"><mark style=\"background-color:rgba(0, 0, 0, 0);color:#cf2e2e\" class=\"has-inline-color\">k\u0159em\u00edkov\u00e9 desti\u010dky, saf\u00edrov\u00e9 desti\u010dky, k\u0159emenn\u00e9 desti\u010dky nebo substr\u00e1ty z karbidu k\u0159em\u00edku<\/mark><\/a>, porozum\u011bn\u00ed parametr\u016fm TTV, prohnut\u00ed a zkroucen\u00ed v\u00e1m m\u016f\u017ee pomoci vybrat spr\u00e1vn\u00e9 specifikace desti\u010dky pro va\u0161i aplikaci.<\/p>\n\n\n\n<p><\/p>","protected":false},"excerpt":{"rendered":"<p>In semiconductor manufacturing, wafer quality is about much more than material purity. Even a perfectly grown silicon, sapphire, quartz, or silicon carbide wafer can cause production issues if its geometry is not properly controlled. Among the most important wafer geometry parameters are TTV (Total Thickness Variation), Bow, and Warp. 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