{"id":2491,"date":"2026-05-25T05:27:55","date_gmt":"2026-05-25T05:27:55","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2491"},"modified":"2026-05-25T05:36:36","modified_gmt":"2026-05-25T05:36:36","slug":"anodic-bonding-vs-direct-bonding","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/cs\/anodic-bonding-vs-direct-bonding\/","title":{"rendered":"Anodick\u00e9 spojov\u00e1n\u00ed versus p\u0159\u00edm\u00e9 spojov\u00e1n\u00ed: Kter\u00e1 metoda je vhodn\u011bj\u0161\u00ed pro zpracov\u00e1n\u00ed MEMS a senzorov\u00fdch desti\u010dek?"},"content":{"rendered":"

V oblasti pokro\u010dil\u00e9 v\u00fdroby MEMS a mont\u00e1\u017ee senzor\u016f, spojov\u00e1n\u00ed desti\u010dek<\/mark><\/a> je kl\u00ed\u010dov\u00fdm krokem, kter\u00fd m\u00e1 p\u0159\u00edm\u00fd vliv na spolehlivost za\u0159\u00edzen\u00ed, hermetick\u00e9 ut\u011bsn\u011bn\u00ed a dlouhodobou funk\u010dnost. Mezi nej\u010dast\u011bji pou\u017e\u00edvan\u00e9 techniky pat\u0159\u00ed anodick\u00e9 spojov\u00e1n\u00ed<\/strong> a p\u0159\u00edm\u00e9 (f\u00fazn\u00ed) spojov\u00e1n\u00ed<\/strong>.<\/p>\n\n\n\n

A\u010dkoli ob\u011b metody spojuj\u00ed desti\u010dky na atomov\u00e9 nebo molekul\u00e1rn\u00ed \u00farovni, vych\u00e1zej\u00ed z \u00fapln\u011b odli\u0161n\u00fdch fyzik\u00e1ln\u00edch mechanism\u016f a jsou vhodn\u00e9 pro r\u016fzn\u00e9 materi\u00e1ly a struktury za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n

Tento \u010dl\u00e1nek p\u0159in\u00e1\u0161\u00ed p\u0159ehledn\u00e9 srovn\u00e1n\u00ed zam\u011b\u0159en\u00e9 na segment B2B, kter\u00e9 m\u00e1 pomoci technik\u016fm a n\u00e1kupn\u00edm t\u00fdm\u016fm vybrat vhodnou metodu lepen\u00ed pro MEMS, senzory a modern\u00ed polovodi\u010dov\u00e1 za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Co je to anodick\u00e9 spojov\u00e1n\u00ed?<\/h2>\n\n\n\n

Anodick\u00e9 spojov\u00e1n\u00ed<\/strong> (zn\u00e1m\u00e1 tak\u00e9 jako elektrostatick\u00e9 spojov\u00e1n\u00ed) je technika spojov\u00e1n\u00ed polovodi\u010dov\u00fdch desti\u010dek, kter\u00e1 se obvykle pou\u017e\u00edv\u00e1 mezi k\u0159em\u00edk a sklo (obvykle borosilik\u00e1tov\u00e9 sklo)<\/strong>.<\/p>\n\n\n\n

Jak to funguje:<\/h3>\n\n\n\n
    \n
  • Na desti\u010dky se p\u0159iv\u00e1d\u00ed vysok\u00e9 nap\u011bt\u00ed (obvykle 200\u20131000 V)<\/li>\n\n\n\n
  • Teplota se zv\u00fd\u0161\u00ed (obvykle na 300\u2013450 \u00b0C)<\/li>\n\n\n\n
  • Pohybliv\u00e9 ionty (ve skle zejm\u00e9na Na\u207a) se pohybuj\u00ed v elektrick\u00e9m poli<\/li>\n\n\n\n
  • Siln\u00e1 elektrostatick\u00e1 p\u0159ita\u017elivost vytv\u00e1\u0159\u00ed trvalou vazbu na rozhran\u00ed<\/li>\n<\/ul>\n\n\n\n

    Kl\u00ed\u010dov\u00e9 vlastnosti:<\/h3>\n\n\n\n
      \n
    • Vy\u017eaduje kombinaci vodiv\u00e9ho a iontov\u00e9ho materi\u00e1lu (k\u0159em\u00edk + sklo)<\/li>\n\n\n\n
    • Proces p\u0159i m\u00edrn\u00e9 teplot\u011b<\/li>\n\n\n\n
    • Rychl\u00e9 vytvrzen\u00ed<\/li>\n\n\n\n
    • Vysok\u00e1 hermetick\u00e1 t\u011bsnost<\/li>\n<\/ul>\n\n\n\n

      2. Co je to p\u0159\u00edm\u00e9 lepen\u00ed (f\u00fazn\u00ed lepen\u00ed)?<\/h2>\n\n\n\n

      P\u0159\u00edm\u00e9 lepen\u00ed<\/strong>, tak\u00e9 naz\u00fdvan\u00fd spojov\u00e1n\u00ed taven\u00edm<\/strong>, spojuje dva dokonale rovn\u00e9 a dokonale \u010dist\u00e9 povrchy bez pou\u017eit\u00ed lepidel \u010di elektrick\u00fdch pol\u00ed.<\/p>\n\n\n\n

      Jak to funguje:<\/h3>\n\n\n\n
        \n
      • Dv\u011b desti\u010dky se o\u010dist\u00ed a aktivuj\u00ed (plazmovou nebo chemickou \u00fapravou)<\/li>\n\n\n\n
      • Pl\u00e1tky se spoj\u00ed p\u0159i pokojov\u00e9 teplot\u011b<\/li>\n\n\n\n
      • Po\u010d\u00e1te\u010dn\u00ed slab\u00e9 van der Waalsovy s\u00edly vytv\u00e1\u0159ej\u00ed p\u0159edb\u011b\u017enou vazbu<\/li>\n\n\n\n
      • \u017d\u00edh\u00e1n\u00ed p\u0159i vysok\u00fdch teplot\u00e1ch (800\u20131100 \u00b0C) posiluje vazby prost\u0159ednictv\u00edm atomov\u00e9 dif\u00faze<\/li>\n<\/ul>\n\n\n\n

        Kl\u00ed\u010dov\u00e9 vlastnosti:<\/h3>\n\n\n\n
          \n
        • Nen\u00ed nutn\u00e1 \u017e\u00e1dn\u00e1 mezivrstva<\/li>\n\n\n\n
        • Mimo\u0159\u00e1dn\u011b vysok\u00e1 pevnost spoje po \u017e\u00edh\u00e1n\u00ed<\/li>\n\n\n\n
        • Vy\u017eaduje dokonale hladk\u00e9 a rovn\u00e9 povrchy<\/li>\n\n\n\n
        • Proces s vysok\u00fdm tepeln\u00fdm rozpo\u010dtem<\/li>\n<\/ul>\n\n\n\n

          3. Anodick\u00e9 spojov\u00e1n\u00ed vs. p\u0159\u00edm\u00e9 spojov\u00e1n\u00ed: hlavn\u00ed rozd\u00edly<\/h2>\n\n\n\n
          Funkce<\/th>Anodick\u00e9 spojov\u00e1n\u00ed<\/th>P\u0159\u00edm\u00e9 (f\u00fazn\u00ed) spojov\u00e1n\u00ed<\/th><\/tr><\/thead>
          Mechanismus dluhopis\u016f<\/td>Elektrostatick\u00fd jev + migrace iont\u016f<\/td>Atomov\u00e1 dif\u00faze<\/td><\/tr>
          Materi\u00e1ly<\/td>Si + sklo<\/td>Si + Si \/ SiO\u2082 + SiO\u2082<\/td><\/tr>
          Teplota<\/td>300\u2013450 \u00b0C<\/td>800\u20131100 \u00b0C<\/td><\/tr>
          Po\u017eadovan\u00e9 nap\u011bt\u00ed<\/td>Ano<\/td>Ne<\/td><\/tr>
          Po\u017eadavky na povrch<\/td>M\u00edrn\u00e1<\/td>Mimo\u0159\u00e1dn\u011b vysok\u00e1 (ultra-ploch\u00e1)<\/td><\/tr>
          Rozhran\u00ed<\/td>Rozhran\u00ed na b\u00e1zi skla<\/td>Bez mezivrstvy<\/td><\/tr>
          Pevnost spoje<\/td>Vysok\u00e1<\/td>Velmi vysok\u00e1 (po \u017e\u00edh\u00e1n\u00ed)<\/td><\/tr>
          Slo\u017eitost procesu<\/td>Doln\u00ed<\/td>Vy\u0161\u0161\u00ed<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

          4. Kompatibilita proces\u016f a materi\u00e1lov\u00e1 omezen\u00ed<\/h2>\n\n\n\n

          Anodick\u00e9 spojov\u00e1n\u00ed:<\/h3>\n\n\n\n

          Nejvhodn\u011bj\u0161\u00ed pro:<\/p>\n\n\n\n

            \n
          • Konstrukce typu k\u0159em\u00edk-sklo<\/li>\n\n\n\n
          • MEMS rezon\u00e1tory s optick\u00fdm p\u0159\u00edstupem<\/li>\n\n\n\n
          • Tlakov\u00e9 senzory se sklen\u011bn\u00fdmi krytkami<\/li>\n\n\n\n
          • Mikrofluidn\u00ed za\u0159\u00edzen\u00ed<\/li>\n<\/ul>\n\n\n\n

            B\u011b\u017en\u011b pou\u017e\u00edvan\u00e9 sklen\u011bn\u00e9 materi\u00e1ly:<\/p>\n\n\n\n

              \n
            • Borosilik\u00e1tov\u00e9 sklo (typu Pyrex)<\/li>\n\n\n\n
            • Aluminatosilik\u00e1tov\u00e9 sklo<\/li>\n<\/ul>\n\n\n\n

              P\u0159\u00edm\u00e9 lepen\u00ed:<\/h3>\n\n\n\n

              Nejvhodn\u011bj\u0161\u00ed pro:<\/p>\n\n\n\n

                \n
              • Struktury typu k\u0159em\u00edk na k\u0159em\u00edku<\/li>\n\n\n\n
              • V\u00fdroba SOI desti\u010dek<\/li>\n\n\n\n
              • Vysoce v\u00fdkonn\u00e1 MEMS za\u0159\u00edzen\u00ed<\/li>\n\n\n\n
              • Sady desti\u010dek optick\u00e9 kvality<\/li>\n\n\n\n
              • Pokro\u010dil\u00e1 integrace 3D<\/li>\n<\/ul>\n\n\n\n

                5. Aplikace v oblasti MEMS a senzor\u016f<\/h2>\n\n\n\n

                Aplikace anodick\u00e9ho spojov\u00e1n\u00ed v oblasti MEMS<\/h3>\n\n\n\n

                V Mikroelektromechanick\u00e9 syst\u00e9my<\/strong>, anodick\u00e9 spojov\u00e1n\u00ed se \u0161iroce pou\u017e\u00edv\u00e1 pro:<\/p>\n\n\n\n

                  \n
                • Tlakov\u00e9 senzory<\/li>\n\n\n\n
                • Akcelerometry (konstrukce s krytem)<\/li>\n\n\n\n
                • Tiskov\u00e9 hlavy pro inkoustov\u00e9 tisk\u00e1rny<\/li>\n\n\n\n
                • Mikrofluidn\u00ed \u010dipy<\/li>\n\n\n\n
                • Optick\u00e9 MEMS se sklen\u011bn\u00fdmi ok\u00e9nky<\/li>\n<\/ul>\n\n\n\n

                  Pro\u010d je up\u0159ednost\u0148ov\u00e1n:<\/strong><\/p>\n\n\n\n

                    \n
                  • Vynikaj\u00edc\u00ed hermetick\u00e9 ut\u011bsn\u011bn\u00ed<\/li>\n\n\n\n
                  • Pr\u016fhledn\u00e9 sklo umo\u017e\u0148uje vizu\u00e1ln\u00ed kontrolu<\/li>\n\n\n\n
                  • Hospod\u00e1rn\u00e9 pro s\u00e9riovou v\u00fdrobu<\/li>\n<\/ul>\n\n\n\n

                    Aplikace p\u0159\u00edm\u00e9ho spojov\u00e1n\u00ed v oblasti MEMS<\/h3>\n\n\n\n

                    P\u0159i integraci vysoce v\u00fdkonn\u00fdch MEMS a polovodi\u010d\u016f se up\u0159ednost\u0148uje p\u0159\u00edm\u00e9 lepen\u00ed:<\/p>\n\n\n\n

                      \n
                    • MEMS za\u0159\u00edzen\u00ed na b\u00e1zi SOI<\/li>\n\n\n\n
                    • RF MEMS sp\u00edna\u010de<\/li>\n\n\n\n
                    • Vysokofrekven\u010dn\u00ed rezon\u00e1tory<\/li>\n\n\n\n
                    • 3D integrace na \u00farovni \u010dip\u016f<\/li>\n\n\n\n
                    • P\u0159esn\u00e9 inerci\u00e1ln\u00ed senzory<\/li>\n<\/ul>\n\n\n\n

                      Pro\u010d je up\u0159ednost\u0148ov\u00e1n:<\/strong><\/p>\n\n\n\n

                        \n
                      • \u017d\u00e1dn\u00e1 kontamina\u010dn\u00ed vrstva na povrchu<\/li>\n\n\n\n
                      • Mimo\u0159\u00e1dn\u011b vysok\u00e1 mechanick\u00e1 pevnost<\/li>\n\n\n\n
                      • Vynikaj\u00edc\u00ed tepeln\u00e9 a elektrick\u00e9 vlastnosti<\/li>\n<\/ul>\n\n\n\n

                        6. \u00davahy ohledn\u011b spolehlivosti a v\u00fdkonu<\/h2>\n\n\n\n

                        Pevnost anodick\u00e9ho spojen\u00ed:<\/h3>\n\n\n\n
                          \n
                        • Trval\u00e9 hermetick\u00e9 ut\u011bsn\u011bn\u00ed<\/li>\n\n\n\n
                        • Dobr\u00e1 odolnost v\u016f\u010di prost\u0159ed\u00ed s m\u00edrn\u00fdm nam\u00e1h\u00e1n\u00edm<\/li>\n\n\n\n
                        • Zral\u00fd pr\u016fmyslov\u00fd proces<\/li>\n<\/ul>\n\n\n\n

                          Omezen\u00ed:<\/h3>\n\n\n\n
                            \n
                          • Tepeln\u00fd nesoulad mezi sklem a k\u0159em\u00edkem<\/li>\n\n\n\n
                          • Po\u017eadavky na nap\u011bt\u00ed zvy\u0161uj\u00ed slo\u017eitost procesu<\/li>\n\n\n\n
                          • Omezeno na ur\u010dit\u00e9 kombinace materi\u00e1l\u016f<\/li>\n<\/ul>\n\n\n\n

                            Pevnost p\u0159\u00edm\u00e9ho lepen\u00ed:<\/h3>\n\n\n\n
                              \n
                            • Nejvy\u0161\u0161\u00ed pevnost spoje ze v\u0161ech metod lepen\u00ed desti\u010dek<\/li>\n\n\n\n
                            • Vynikaj\u00edc\u00ed tepeln\u00e1 vodivost na rozhran\u00ed<\/li>\n\n\n\n
                            • \u017d\u00e1dn\u00e9 postupn\u00e9 zhor\u0161ov\u00e1n\u00ed kvality materi\u00e1lu<\/li>\n<\/ul>\n\n\n\n

                              Omezen\u00ed:<\/h3>\n\n\n\n
                                \n
                              • Velmi citliv\u00fd na drsnost povrchu<\/li>\n\n\n\n
                              • \u017d\u00edh\u00e1n\u00ed p\u0159i vysok\u00fdch teplot\u00e1ch m\u016f\u017ee m\u00edt vliv na vrstvy za\u0159\u00edzen\u00ed<\/li>\n\n\n\n
                              • Vy\u0161\u0161\u00ed n\u00e1klady a slo\u017eitost procesu<\/li>\n<\/ul>\n\n\n\n

                                7. N\u00e1klady a v\u00fdrobn\u00ed hledisko<\/h2>\n\n\n\n

                                Z hlediska v\u00fdroby:<\/p>\n\n\n\n

                                  \n
                                • Anodick\u00e9 spojov\u00e1n\u00ed<\/strong> \u2192 ni\u017e\u0161\u00ed n\u00e1klady, vy\u0161\u0161\u00ed v\u00fdt\u011b\u017enost, snaz\u0161\u00ed \u0159\u00edzen\u00ed procesu<\/li>\n\n\n\n
                                • P\u0159\u00edm\u00e9 lepen\u00ed<\/strong> \u2192 vy\u0161\u0161\u00ed n\u00e1klady, p\u0159\u00edsn\u011bj\u0161\u00ed po\u017eadavky na procesy, vy\u0161\u0161\u00ed v\u00fdkon<\/li>\n<\/ul>\n\n\n\n

                                  U MEMS senzor\u016f ur\u010den\u00fdch pro masov\u00fd trh se \u010dasto up\u0159ednost\u0148uje anodick\u00e9 spojov\u00e1n\u00ed.
                                  V oblasti pokro\u010dil\u00fdch RF MEMS a \u0161pi\u010dkov\u00e9 integrace je p\u0159\u00edm\u00e9 lepen\u00ed pr\u016fmyslov\u00fdm standardem.<\/p>\n\n\n\n

                                  8. Jak vybrat spr\u00e1vnou metodu lepen\u00ed?<\/h2>\n\n\n\n

                                  Zvolte anodick\u00e9 spojov\u00e1n\u00ed, pokud pot\u0159ebujete:<\/h3>\n\n\n\n
                                    \n
                                  • Konstrukce typu k\u0159em\u00edk-sklo<\/li>\n\n\n\n
                                  • Optick\u00e1 pr\u016fhlednost obal\u016f<\/li>\n\n\n\n
                                  • Ni\u017e\u0161\u00ed v\u00fdrobn\u00ed n\u00e1klady<\/li>\n\n\n\n
                                  • Stabiln\u00ed zapouzd\u0159en\u00ed MEMS senzoru<\/li>\n<\/ul>\n\n\n\n

                                    Zvolte p\u0159\u00edm\u00e9 lepen\u00ed, pokud pot\u0159ebujete:<\/h3>\n\n\n\n
                                      \n
                                    • Nejvy\u0161\u0161\u00ed mechanick\u00e1 pevnost<\/li>\n\n\n\n
                                    • Integrace k\u0159em\u00edku s k\u0159em\u00edkem<\/li>\n\n\n\n
                                    • Vysokofrekven\u010dn\u00ed vlastnosti<\/li>\n\n\n\n
                                    • Pokro\u010dil\u00e9 3D vrstven\u00ed \u010dip\u016f<\/li>\n<\/ul>\n\n\n\n

                                      9. Trendy v oboru: sm\u011b\u0159ov\u00e1n\u00ed k hybridn\u00edmu lepen\u00ed<\/h2>\n\n\n\n

                                      Modern\u00ed balen\u00ed polovodi\u010d\u016f st\u00e1le \u010dast\u011bji kombinuje ob\u011b metody s:<\/p>\n\n\n\n

                                        \n
                                      • Zapouzd\u0159en\u00ed na \u00farovni \u010dipu<\/li>\n\n\n\n
                                      • Heterogenn\u00ed integrace<\/li>\n\n\n\n
                                      • 3D vrstven\u00e9 syst\u00e9my MEMS<\/li>\n\n\n\n
                                      • Pokro\u010dil\u00e9 vysokofrekven\u010dn\u00ed moduly<\/li>\n<\/ul>\n\n\n\n

                                        Tento hybridn\u00ed p\u0159\u00edstup zvy\u0161uje jak n\u00e1kladovou efektivitu, tak v\u00fdkon za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n

                                        10. Z\u00e1v\u011br<\/h2>\n\n\n\n

                                        Jak anodick\u00e9 spojov\u00e1n\u00ed, tak p\u0159\u00edm\u00e9 spojov\u00e1n\u00ed hraj\u00ed z\u00e1sadn\u00ed roli p\u0159i zpracov\u00e1n\u00ed modern\u00edch MEMS a senzorov\u00fdch desti\u010dek.<\/p>\n\n\n\n

                                          \n
                                        • Anodick\u00e9 spojov\u00e1n\u00ed<\/strong> \u2192 cenov\u011b v\u00fdhodn\u00e9 sklen\u011bn\u00e9 pouzdro pro MEMS<\/li>\n\n\n\n
                                        • P\u0159\u00edm\u00e9 lepen\u00ed<\/strong> \u2192 vysoce v\u00fdkonn\u00e9 syst\u00e9my s integrovan\u00fdmi obvody<\/li>\n<\/ul>\n\n\n\n

                                          Spr\u00e1vn\u00e1 volba z\u00e1vis\u00ed na kompatibilit\u011b materi\u00e1l\u016f, po\u017eadavc\u00edch na v\u00fdkon a rozsahu v\u00fdroby.<\/p>","protected":false},"excerpt":{"rendered":"

                                          In advanced MEMS manufacturing and sensor packaging, wafer bonding is a critical step that directly impacts device reliability, hermetic sealing, and long-term performance. Among the most widely used techniques are anodic bonding and direct (fusion) bonding. Although both methods join wafers at the atomic or molecular level, they rely on completely different physical mechanisms and […]<\/p>\n","protected":false},"author":1,"featured_media":2031,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[207,206,208,1395,1393,1396,210,1394,204,215],"class_list":["post-2491","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-anodic-bonding","tag-direct-bonding","tag-fusion-bonding","tag-glass-bonding","tag-mems-packaging","tag-mems-sensors","tag-silicon-wafer-bonding","tag-soi-wafer","tag-wafer-bonding","tag-wafer-level-packaging"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2491","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2491"}],"version-history":[{"count":2,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2491\/revisions"}],"predecessor-version":[{"id":2494,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2491\/revisions\/2494"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2031"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2491"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/categories?post=2491"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/tags?post=2491"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}