{"id":2466,"date":"2026-05-14T06:21:48","date_gmt":"2026-05-14T06:21:48","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2466"},"modified":"2026-05-14T06:22:03","modified_gmt":"2026-05-14T06:22:03","slug":"wafer-notching-and-coring-processes","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/cs\/wafer-notching-and-coring-processes\/","title":{"rendered":"Procesy vrubov\u00e1n\u00ed a r\u00fdhov\u00e1n\u00ed desti\u010dek p\u0159i v\u00fdrob\u011b 300mm polovodi\u010d\u016f"},"content":{"rendered":"<p>P\u0159i v\u00fdrob\u011b 300mm polovodi\u010d\u016f jsou vrubov\u00e1n\u00ed a korigov\u00e1n\u00ed desti\u010dek kritick\u00fdmi mechanick\u00fdmi procesy, kter\u00e9 se pou\u017e\u00edvaj\u00ed k p\u0159\u00edprav\u011b k\u0159em\u00edkov\u00fdch desti\u010dek pro n\u00e1sledn\u00e9 v\u00fdrobn\u00ed kroky. Tyto procesy zaji\u0161\u0165uj\u00ed spr\u00e1vnou orientaci desti\u010dek, struktur\u00e1ln\u00ed integritu a kompatibilitu s automatizovan\u00fdmi manipula\u010dn\u00edmi syst\u00e9my v modern\u00edch v\u00fdrobn\u00edch z\u00e1vodech.<\/p>\n\n\n\n<p>Vzhledem k tomu, \u017ee se st\u00e1le zv\u011bt\u0161uj\u00ed rozm\u011bry desti\u010dek a procesn\u00ed uzly jsou st\u00e1le pokro\u010dilej\u0161\u00ed, je p\u0159esnost mechanick\u00e9ho tvarov\u00e1n\u00ed desti\u010dek st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed pro kontrolu v\u00fdt\u011b\u017enosti a kompatibilitu za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n<p>Tento \u010dl\u00e1nek vysv\u011btluje, co je to vrubov\u00e1n\u00ed a korigov\u00e1n\u00ed desti\u010dek, jak se prov\u00e1d\u00ed a pro\u010d jsou v modern\u00ed v\u00fdrob\u011b polovodi\u010d\u016f nezbytn\u00e9.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"533\" src=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg\" alt=\"\" class=\"wp-image-2467\" srcset=\"https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH.jpg 800w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-300x200.jpg 300w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-768x512.jpg 768w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-18x12.jpg 18w, https:\/\/www.zmsh-semitech.com\/wp-content\/uploads\/2026\/05\/NOTCH-600x400.jpg 600w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Co je to vrubov\u00e1n\u00ed desti\u010dek?<\/h2>\n\n\n\n<p>Vrubov\u00e1n\u00ed desti\u010dek je proces vytv\u00e1\u0159en\u00ed mal\u00e9ho, p\u0159esn\u011b um\u00edst\u011bn\u00e9ho \u0159ezu (vrubu) na okraji k\u0159em\u00edkov\u00e9 desti\u010dky. Tento z\u00e1\u0159ez slou\u017e\u00ed jako orienta\u010dn\u00ed reference pro automatizovan\u00e9 syst\u00e9my.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">\u00da\u010del vrubov\u00e1n\u00ed desti\u010dek<\/h3>\n\n\n\n<p>Mezi hlavn\u00ed funkce vrubov\u00e1n\u00ed desti\u010dek pat\u0159\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Vyrovn\u00e1n\u00ed orientace krystal\u016f<\/strong> (nap\u0159.  nebo  orientace k\u0159em\u00edku)<\/li>\n\n\n\n<li><strong>Odkaz na um\u00edst\u011bn\u00ed za\u0159\u00edzen\u00ed<\/strong> pro robotick\u00e9 manipula\u010dn\u00ed syst\u00e9my<\/li>\n\n\n\n<li><strong>Konzistence procesu v litografick\u00fdch, leptac\u00edch a depozi\u010dn\u00edch kroc\u00edch<\/strong><\/li>\n\n\n\n<li><strong>Kompatibilita automatizace v 300mm tov\u00e1rn\u00e1ch<\/strong><\/li>\n<\/ul>\n\n\n\n<p>U 300mm desti\u010dek je vrub standardizovan\u00fdm prvkem, kter\u00fd umo\u017e\u0148uje za\u0159\u00edzen\u00edm identifikovat orientaci desti\u010dky bez manu\u00e1ln\u00edho z\u00e1sahu.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Co je vrt\u00e1n\u00ed desti\u010dek?<\/h2>\n\n\n\n<p>Korigov\u00e1n\u00ed desti\u010dek znamen\u00e1 odstran\u011bn\u00ed nebo tvarov\u00e1n\u00ed st\u0159edov\u00e9 oblasti nebo okrajov\u00fdch \u010d\u00e1st\u00ed desti\u010dky pro specializovan\u00e9 aplikace nebo procesn\u00ed po\u017eadavky. P\u0159esto\u017ee se o n\u011bm hovo\u0159\u00ed m\u00e9n\u011b \u010dasto ne\u017e o vrubov\u00e1n\u00ed, hraje koring roli ve specifick\u00fdch pokro\u010dil\u00fdch v\u00fdrobn\u00edch a v\u00fdzkumn\u00fdch aplikac\u00edch.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Kl\u00ed\u010dov\u00e9 funkce r\u00fdhov\u00e1n\u00ed desti\u010dek<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Vytv\u00e1\u0159en\u00ed centr\u00e1ln\u00edho vyrovn\u00e1n\u00ed nebo mechanick\u00fdch odleh\u010dovac\u00edch struktur<\/li>\n\n\n\n<li>P\u0159\u00edprava desti\u010dek pro specializovan\u00e9 procesy lepen\u00ed nebo stohov\u00e1n\u00ed<\/li>\n\n\n\n<li>Odstran\u011bn\u00ed nam\u00e1han\u00fdch nebo vadn\u00fdch centr\u00e1ln\u00edch oblast\u00ed v experiment\u00e1ln\u00edch procesech<\/li>\n\n\n\n<li>Podpora vlastn\u00edch geometri\u00ed desti\u010dek pro v\u00fdzkum a prototypov\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n<p>V pokro\u010dil\u00fdch polovodi\u010dov\u00fdch prost\u0159ed\u00edch se korigov\u00e1n\u00ed obvykle prov\u00e1d\u00ed pomoc\u00ed vysoce p\u0159esn\u00fdch diamantov\u00fdch n\u00e1stroj\u016f nebo laserem asistovan\u00fdch syst\u00e9m\u016f.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Za\u0159\u00edzen\u00ed pou\u017e\u00edvan\u00e1 p\u0159i vrubov\u00e1n\u00ed a vrt\u00e1n\u00ed<\/h2>\n\n\n\n<p>Vysoce p\u0159esn\u00e9 tvarov\u00e1n\u00ed desti\u010dek vy\u017eaduje specializovan\u00e9 za\u0159\u00edzen\u00ed navr\u017een\u00e9 pro mikronovou p\u0159esnost a minim\u00e1ln\u00ed po\u0161kozen\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Syst\u00e9my pro p\u0159esn\u00e9 vrubov\u00e1n\u00ed desti\u010dek<\/h3>\n\n\n\n<p>Tyto syst\u00e9my pou\u017e\u00edvaj\u00ed diamantov\u00e9 brusn\u00e9 kotou\u010de nebo laserov\u00e9 \u0159ezac\u00ed hlavy k vytvo\u0159en\u00ed p\u0159esn\u00fdch z\u00e1\u0159ez\u016f na hran\u00e1ch desti\u010dek.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Diamantov\u00e9 dr\u00e1tov\u00e9 pily<\/h3>\n\n\n\n<p>Pou\u017e\u00edv\u00e1 se p\u0159i n\u011bkter\u00fdch aplikac\u00edch vrt\u00e1n\u00ed a tvarov\u00e1n\u00ed, zejm\u00e9na p\u0159i pr\u00e1ci s tvrd\u00fdmi materi\u00e1ly nebo tlust\u00fdmi pl\u00e1tky.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Laserov\u00e9 syst\u00e9my mikroobr\u00e1b\u011bn\u00ed<\/h3>\n\n\n\n<p>Pokro\u010dil\u00e9 tov\u00e1rny mohou pou\u017e\u00edvat laserov\u00e9 n\u00e1stroje pro bezkontaktn\u00ed vrubov\u00e1n\u00ed a vrubov\u00e1n\u00ed, aby se sn\u00ed\u017eilo mechanick\u00e9 nam\u00e1h\u00e1n\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. P\u0159esn\u00e9 CNC brusky<\/h3>\n\n\n\n<p>Zaji\u0161\u0165uj\u00ed vysokou opakovatelnost a p\u0159\u00edsnou kontrolu rozm\u011br\u016f p\u0159i zpracov\u00e1n\u00ed okraj\u016f desti\u010dek.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Procesn\u00ed tok p\u0159i v\u00fdrob\u011b 300mm desti\u010dek<\/h2>\n\n\n\n<p>Zjednodu\u0161en\u00fd procesn\u00ed postup pro vrubov\u00e1n\u00ed a v\u00fdvrtkov\u00e1n\u00ed desti\u010dek zahrnuje:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><strong>Kontrola desti\u010dek<\/strong>\n<ul class=\"wp-block-list\">\n<li>Detekce povrchov\u00fdch vad<\/li>\n\n\n\n<li>M\u011b\u0159en\u00ed tlou\u0161\u0165ky a rovinnosti<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Vyrovn\u00e1n\u00ed orientace<\/strong>\n<ul class=\"wp-block-list\">\n<li>Ur\u010den\u00ed sm\u011bru krystalov\u00e9 osy<\/li>\n\n\n\n<li>Nastaven\u00ed referen\u010dn\u00ed polohy z\u00e1\u0159ezu<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Mechanick\u00e9 nebo laserov\u00e9 zpracov\u00e1n\u00ed<\/strong>\n<ul class=\"wp-block-list\">\n<li>\u0158ez\u00e1n\u00ed z\u00e1\u0159ez\u016f na hran\u011b desti\u010dky<\/li>\n\n\n\n<li>Vrt\u00e1n\u00ed nebo centr\u00e1ln\u00ed tvarov\u00e1n\u00ed (pokud je vy\u017eadov\u00e1no)<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Odjehlov\u00e1n\u00ed a povrchov\u00e1 \u00faprava<\/strong>\n<ul class=\"wp-block-list\">\n<li>Odstran\u011bn\u00ed mikrotrhlin a ne\u010distot<\/li>\n\n\n\n<li>Le\u0161t\u011bn\u00ed hran pro sn\u00ed\u017een\u00ed nap\u011bt\u00ed<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li><strong>Kontrola po zpracov\u00e1n\u00ed<\/strong>\n<ul class=\"wp-block-list\">\n<li>Optick\u00e1 metrologie<\/li>\n\n\n\n<li>Ov\u011b\u0159ov\u00e1n\u00ed rozm\u011br\u016f<\/li>\n\n\n\n<li>Kontrola integrity povrchu<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">V\u00fdznam v 300mm v\u00fdrob\u011b polovodi\u010d\u016f<\/h2>\n\n\n\n<p>S rostouc\u00edm pr\u016fm\u011brem desti\u010dek na 300 mm a v\u00edce je mechanick\u00e1 p\u0159esnost st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed z d\u016fvodu:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">1. Po\u017eadavky na automatizaci<\/h3>\n\n\n\n<p>Modern\u00ed tov\u00e1rny se ve velk\u00e9 m\u00ed\u0159e spol\u00e9haj\u00ed na robotickou manipulaci s wafery. Dokonce i nepatrn\u00e1 nesouosost m\u016f\u017ee zp\u016fsobit:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Zlomen\u00ed oplatky<\/li>\n\n\n\n<li>Nespr\u00e1vn\u00e9 um\u00edst\u011bn\u00ed litografick\u00fdch n\u00e1stroj\u016f<\/li>\n\n\n\n<li>Ztr\u00e1ta v\u00fdnosu v navazuj\u00edc\u00edch procesech<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Citlivost na stres<\/h3>\n\n\n\n<p>Velk\u00e9 desti\u010dky jsou citliv\u011bj\u0161\u00ed na mechanick\u00e9 nam\u00e1h\u00e1n\u00ed p\u0159i zpracov\u00e1n\u00ed hran. \u0160patn\u00e9 vroubkov\u00e1n\u00ed nebo vroubkov\u00e1n\u00ed m\u016f\u017ee v\u00e9st k:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Mikrotrhliny<\/li>\n\n\n\n<li>Odlamov\u00e1n\u00ed hran<\/li>\n\n\n\n<li>Delaminace p\u0159i tepeln\u00e9m cyklov\u00e1n\u00ed<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Integrace proces\u016f<\/h3>\n\n\n\n<p>Z\u00e1\u0159ezy mus\u00ed b\u00fdt p\u0159esn\u011b zarovn\u00e1ny s:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Syst\u00e9my pro zarovn\u00e1v\u00e1n\u00ed litografie<\/li>\n\n\n\n<li>Orientace leptac\u00edho n\u00e1stroje<\/li>\n\n\n\n<li>Referen\u010dn\u00ed r\u00e1mce metrologie<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">B\u011b\u017en\u00e9 probl\u00e9my p\u0159i vrubov\u00e1n\u00ed a vrubov\u00e1n\u00ed desti\u010dek<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. \u0160t\u011bpkov\u00e1n\u00ed hran<\/h3>\n\n\n\n<p>Nespr\u00e1vn\u00e9 \u0159ezn\u00e9 parametry mohou zp\u016fsobit mikrotrhliny na okraji pl\u00e1tku, kter\u00e9 ovliv\u0148uj\u00ed mechanickou pevnost.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">2. Podpovrchov\u00e9 po\u0161kozen\u00ed<\/h3>\n\n\n\n<p>Nadm\u011brn\u00e1 mechanick\u00e1 s\u00edla m\u016f\u017ee zp\u016fsobit skryt\u00e9 vady, kter\u00e9 se \u0161\u00ed\u0159\u00ed b\u011bhem tepeln\u00e9ho zpracov\u00e1n\u00ed.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">3. Chyby zarovn\u00e1n\u00ed<\/h3>\n\n\n\n<p>I mal\u00e9 odchylky v poloze vrubu mohou ovlivnit automatiza\u010dn\u00ed syst\u00e9my cel\u00e9 tov\u00e1rny.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">4. Opot\u0159eben\u00ed n\u00e1stroj\u016f<\/h3>\n\n\n\n<p>Diamantov\u00e9 n\u00e1stroje \u010dasem degraduj\u00ed, co\u017e ovliv\u0148uje jejich konzistenci a vy\u017eaduje p\u0159\u00edsnou kontrolu \u00fadr\u017eby.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Metody kontroly kvality a inspekce<\/h2>\n\n\n\n<p>Aby byla zaji\u0161t\u011bna spolehlivost v\u00fdroby polovodi\u010d\u016f, jsou procesy vrubov\u00e1n\u00ed a v\u00fdvrt\u016f p\u0159\u00edsn\u011b kontrolov\u00e1ny pomoc\u00ed:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kontrola optick\u00fdm mikroskopem<\/li>\n\n\n\n<li>Metrologie laserov\u00e9ho skenov\u00e1n\u00ed<\/li>\n\n\n\n<li>Syst\u00e9my pro m\u011b\u0159en\u00ed profilu hran<\/li>\n\n\n\n<li>Anal\u00fdza drsnosti povrchu (AFM\/SEM v pokro\u010dil\u00fdch p\u0159\u00edpadech)<\/li>\n<\/ul>\n\n\n\n<p>Tyto metody zaji\u0161\u0165uj\u00ed shodu s normami pro polovodi\u010de.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Pr\u016fmyslov\u00e9 aplikace<\/h2>\n\n\n\n<p>Vroubkov\u00e1n\u00ed pl\u00e1tk\u016f a korigov\u00e1n\u00ed se \u0161iroce pou\u017e\u00edv\u00e1 v:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>V\u00fdroba 300mm k\u0159em\u00edkov\u00fdch desti\u010dek<\/li>\n\n\n\n<li>Pokro\u010dil\u00e9 tov\u00e1rny na v\u00fdrobu logick\u00fdch obvod\u016f a pam\u011bt\u00ed<\/li>\n\n\n\n<li>V\u00fdzkum a v\u00fdvoj prototyp\u016f wafer\u016f<\/li>\n\n\n\n<li>Speci\u00e1ln\u00ed polovodi\u010dov\u00e9 materi\u00e1ly (SiC, saf\u00edr, sklen\u011bn\u00e9 desti\u010dky)<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Z\u00e1v\u011br<\/h2>\n\n\n\n<p>Vrubov\u00e1n\u00ed do desti\u010dek a vrt\u00e1n\u00ed jsou z\u00e1sadn\u00ed p\u0159esn\u00e9 procesy v oblasti<mark style=\"background-color:rgba(0, 0, 0, 0);color:#0693e3\" class=\"has-inline-color\"> 300mm v\u00fdroba polovodi\u010d\u016f<\/mark>. A\u010dkoli se mohou zd\u00e1t v porovn\u00e1n\u00ed s litografi\u00ed nebo depozic\u00ed zanedbateln\u00e9, tyto mechanick\u00e9 kroky p\u0159\u00edmo ovliv\u0148uj\u00ed p\u0159esnost manipulace s desti\u010dkami, stabilitu procesu a celkovou v\u00fdt\u011b\u017enost.<\/p>\n\n\n\n<p>S dal\u0161\u00edm rozvojem polovodi\u010dov\u00e9 technologie bude popt\u00e1vka po velmi p\u0159esn\u00e9m zpracov\u00e1n\u00ed hran nad\u00e1le r\u016fst, a proto budou tyto procesy v tov\u00e1rn\u00e1ch nov\u00e9 generace st\u00e1le d\u016fle\u017eit\u011bj\u0161\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"<p>In 300mm semiconductor manufacturing, wafer notching and coring are critical mechanical processes used to prepare silicon wafers for downstream fabrication steps. These processes ensure proper wafer orientation, structural integrity, and compatibility with automated handling systems in advanced fabs. As wafer sizes continue to increase and process nodes become more advanced, precision in mechanical wafer shaping [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2467,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[1367,1370,185,1327,1369,1365,1366,1337,1368],"class_list":["post-2466","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-300mm-wafer-manufacturing","tag-precision-wafer-processing","tag-semiconductor-manufacturing-equipment","tag-semiconductor-wafer-processing","tag-silicon-wafer-alignment","tag-wafer-coring","tag-wafer-edge-notching","tag-wafer-handling-systems","tag-wafer-notching"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2466","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2466"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2466\/revisions"}],"predecessor-version":[{"id":2468,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2466\/revisions\/2468"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2467"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2466"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/categories?post=2466"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/tags?post=2466"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}