{"id":2114,"date":"2026-04-03T06:00:09","date_gmt":"2026-04-03T06:00:09","guid":{"rendered":"https:\/\/www.zmsh-semitech.com\/?p=2114"},"modified":"2026-04-03T06:03:19","modified_gmt":"2026-04-03T06:03:19","slug":"the-ten-core-semiconductor-equipment-in-2026","status":"publish","type":"post","link":"https:\/\/www.zmsh-semitech.com\/cs\/the-ten-core-semiconductor-equipment-in-2026\/","title":{"rendered":"Deset hlavn\u00edch polovodi\u010dov\u00fdch za\u0159\u00edzen\u00ed v roce 2026: od technologick\u00fdch p\u0159ek\u00e1\u017eek k dom\u00e1c\u00edm pr\u016flom\u016fm"},"content":{"rendered":"

Srdce polovodi\u010dov\u00e9ho pr\u016fmyslu udr\u017euj\u00ed vysoce sofistikovan\u00e1 z\u00e1kladn\u00ed za\u0159\u00edzen\u00ed, z nich\u017e ka\u017ed\u00e9 stoj\u00ed miliony dolar\u016f. In\u017een\u00fd\u0159i p\u0159es p\u0159esn\u00e1 ok\u00e9nka sleduj\u00ed obvody tis\u00edckr\u00e1t jemn\u011bj\u0161\u00ed ne\u017e lidsk\u00fd vlas a zaji\u0161\u0165uj\u00ed, aby ka\u017ed\u00fd krok p\u0159i v\u00fdrob\u011b modern\u00edch \u010dip\u016f spl\u0148oval ty nejvy\u0161\u0161\u00ed standardy. Ka\u017ed\u00fd pr\u016flom v polovodi\u010dov\u00e9 technologii p\u0159\u00edmo z\u00e1vis\u00ed na pokroku v t\u011bchto za\u0159\u00edzen\u00edch, kter\u00e1 jsou um\u00edst\u011bna v p\u0159edn\u00ed \u010d\u00e1sti pr\u016fmyslov\u00e9ho \u0159et\u011bzce. Glob\u00e1ln\u00ed za\u0159\u00edzen\u00ed pro v\u00fdrobu polovodi\u010d\u016f<\/mark> <\/a>v roce 2026 nad\u00e1le roz\u0161i\u0159ovat, co\u017e poukazuje na strategick\u00fd a hospod\u00e1\u0159sk\u00fd v\u00fdznam t\u011bchto stroj\u016f.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Pr\u016fmyslov\u00e9 prost\u0159ed\u00ed: Hodnota a distribuce za\u0159\u00edzen\u00ed<\/h3>\n\n\n\n

Jeden nejmodern\u011bj\u0161\u00ed litografick\u00fd stroj pro extr\u00e9mn\u00ed ultrafialov\u00e9 z\u00e1\u0159en\u00ed (EUV) m\u016f\u017ee st\u00e1t stovky milion\u016f dolar\u016f a obsahuje stovky tis\u00edc sou\u010d\u00e1stek - mnohem slo\u017eit\u011bj\u0161\u00edch ne\u017e z\u00e1kladn\u00ed d\u00edly automobilu. V\u00fdroba polovodi\u010d\u016f p\u0159ipom\u00edn\u00e1 ultrap\u0159esn\u00fd \u0161tafetov\u00fd z\u00e1vod, kde ka\u017ed\u00fd proces z\u00e1vis\u00ed na specifick\u00e9m vybaven\u00ed. V\u011bt\u0161ina investic do za\u0159\u00edzen\u00ed p\u0159ipad\u00e1 na v\u00fdrobu p\u0159edn\u00edch desti\u010dek, co\u017e odr\u00e1\u017e\u00ed jak vysok\u00e9 technick\u00e9 p\u0159ek\u00e1\u017eky, tak nerovnom\u011brn\u00e9 rozlo\u017een\u00ed hodnoty mezi jednotliv\u00fdmi typy za\u0159\u00edzen\u00ed.<\/p>\n\n\n\n

Mezi hlavn\u00ed kategorie z\u00e1kladn\u00edho vybaven\u00ed pat\u0159\u00ed:<\/p>\n\n\n\n

Typ za\u0159\u00edzen\u00ed<\/th>Pod\u00edl na p\u0159edn\u00ed hodnot\u011b<\/th>Koncentrace trhu<\/th>Dom\u00e1c\u00ed status<\/th><\/tr><\/thead>
Litografie<\/td>~24%<\/td>Vysoce koncentrovan\u00fd<\/td>Pr\u016flomov\u00e9 stadium ve vysp\u011bl\u00fdch procesech<\/td><\/tr>
Lept\u00e1n\u00ed<\/td>~20%<\/td>Vysoce koncentrovan\u00fd<\/td>Rychl\u00fd dom\u00e1c\u00ed pokrok<\/td><\/tr>
Nan\u00e1\u0161en\u00ed tenk\u00fdch vrstev<\/td>~20%<\/td>Koncentrovan\u00e9<\/td>F\u00e1ze doh\u00e1n\u011bn\u00ed<\/td><\/tr>
\u0158\u00edzen\u00ed a kontrola proces\u016f<\/td>~11%<\/td>P\u0159edn\u00ed sv\u011btov\u00ed hr\u00e1\u010di<\/td>Prvn\u00ed dom\u00e1c\u00ed pr\u016flomy<\/td><\/tr>
\u010ci\u0161t\u011bn\u00ed oplatek<\/td>~5%<\/td>M\u00edrn\u00e1<\/td>\u010c\u00e1ste\u010dn\u011b lokalizovan\u00e9<\/td><\/tr>
Chemicko-mechanick\u00e9 le\u0161t\u011bn\u00ed (CMP)<\/td>~4%<\/td>M\u00edrn\u00e1<\/td>Vysok\u00e1 penetrace v dom\u00e1cnostech (>50%)<\/td><\/tr>
Iontov\u00e1 implantace<\/td>~3%<\/td>Vysok\u00e1 bari\u00e9ra<\/td>Od 0 do 1 dom\u00e1c\u00edho \u00fasp\u011bchu<\/td><\/tr>
Nan\u00e1\u0161en\u00ed a v\u00fdvoj fotorezist\u016f<\/td><3%<\/td>Vysoce koncentrovan\u00fd<\/td>Prvn\u00ed pr\u016flomy<\/td><\/tr>
Oxidace\/dif\u00faze<\/td>~2%<\/td>Koncentrovan\u00e9<\/td>Vysok\u00e9 dom\u00e1c\u00ed pokryt\u00ed ve vysp\u011bl\u00fdch procesech<\/td><\/tr>
Odoln\u00e9 odizolov\u00e1n\u00ed<\/td>Mal\u00fd pod\u00edl<\/td>Relativn\u011b rozpt\u00fdlen\u00e9<\/td>T\u00e9m\u011b\u0159 \u00fapln\u00e1 v\u00fdm\u011bna v dom\u00e1cnosti<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n

2. Litografie: Vrchol technologie<\/h3>\n\n\n\n

Litografie p\u0159en\u00e1\u0161\u00ed vzory obvod\u016f na k\u0159em\u00edkov\u00e9 desti\u010dky, \u010d\u00edm\u017e p\u0159\u00edmo ur\u010duje integraci \u010dipu a v\u00fdkonnostn\u00ed limity. Tento proces se op\u00edr\u00e1 o p\u0159esn\u00e9 optick\u00e9 projek\u010dn\u00ed syst\u00e9my a \u0159\u00edd\u00ed se Rayleighov\u00fdm krit\u00e9riem (CD = k\u2081-\u03bb\/NA), kter\u00e9 posouv\u00e1 hranice rozli\u0161en\u00ed. Celosv\u011btov\u011b je trh oligopoln\u00ed. Strategickou prioritou z\u016fst\u00e1v\u00e1 dosa\u017een\u00ed dom\u00e1c\u00edch schopnost\u00ed pro vysp\u011bl\u00e9 procesy (\u226590 nm) a prob\u00edhaj\u00edc\u00ed \u00fasil\u00ed se zam\u011b\u0159uje na dal\u0161\u00ed roz\u0161i\u0159ov\u00e1n\u00ed schopnost\u00ed sm\u011brem k pokro\u010dil\u00fdm uzl\u016fm.<\/p>\n\n\n\n

3. Lept\u00e1n\u00ed: p\u0159esnost ve t\u0159ech rozm\u011brech<\/h3>\n\n\n\n

Lept\u00e1n\u00edm se z desti\u010dek pod vzorovan\u00fdmi maskami odstra\u0148uj\u00ed specifick\u00e9 materi\u00e1ly a vytv\u00e1\u0159ej\u00ed se slo\u017eit\u00e9 3D struktury. S p\u0159echodem od 2D k 3D architektu\u0159e se zvy\u0161uje po\u010det a v\u00fdznam leptac\u00edch krok\u016f. Such\u00e9 lept\u00e1n\u00ed, zejm\u00e9na lept\u00e1n\u00ed na b\u00e1zi plazmatu, je hlavn\u00ed technologi\u00ed. Dom\u00e1c\u00ed za\u0159\u00edzen\u00ed v tomto odv\u011btv\u00ed dos\u00e1hla rychl\u00e9ho pokroku, p\u0159i\u010dem\u017e vysp\u011bl\u00e9 leptac\u00ed stroje jsou schopny zpracov\u00e1vat vysok\u00e9 pom\u011bry stran vhodn\u00e9 pro v\u00fdrobu 3D NAND.<\/p>\n\n\n\n

4. Nan\u00e1\u0161en\u00ed tenk\u00fdch vrstev: Stavba \u201cblok\u016f\u201d \u010dipu\u201d<\/h3>\n\n\n\n

Tenkovrstvou depozic\u00ed se na povrch desti\u010dky nan\u00e1\u0161ej\u00ed vrstvy funk\u010dn\u00edch materi\u00e1l\u016f - vodi\u010d\u016f, izolant\u016f nebo polovodi\u010d\u016f, kter\u00e9 tvo\u0159\u00ed z\u00e1kladn\u00ed \u201cstavebn\u00ed kameny\u201d \u010dipu. Mezi hlavn\u00ed techniky nan\u00e1\u0161en\u00ed pat\u0159\u00ed fyzik\u00e1ln\u00ed depozice z par (PVD), chemick\u00e1 depozice z par (CVD) a depozice z atomov\u00fdch vrstev (ALD), p\u0159i\u010dem\u017e nejroz\u0161\u00ed\u0159en\u011bj\u0161\u00ed je CVD. Dom\u00e1c\u00ed technologie dos\u00e1hla v\u00fdznamn\u00e9ho pokroku v syst\u00e9mech PECVD, PVD a MOCVD, kter\u00e9 pokr\u00fdvaj\u00ed \u0159adu metalisa\u010dn\u00edch a slo\u017een\u00fdch polovodi\u010dov\u00fdch aplikac\u00ed.<\/p>\n\n\n\n

5. Ostatn\u00ed kritick\u00e1 za\u0159\u00edzen\u00ed<\/h3>\n\n\n\n

Dal\u0161\u00ed nezbytn\u00e1 za\u0159\u00edzen\u00ed podporuj\u00ed v\u00fdrobu \u010dip\u016f a zaji\u0161\u0165uj\u00ed jejich v\u00fdt\u011b\u017enost a kvalitu:<\/p>\n\n\n\n

    \n
  • \u0158\u00edzen\u00ed a kontrola proces\u016f:<\/strong> Monitoruje v\u00fdrobn\u00ed kroky v nanometrov\u00e9m m\u011b\u0159\u00edtku s c\u00edlem zachovat v\u00fdt\u011b\u017enost. Technologick\u00e9 p\u0159ek\u00e1\u017eky jsou vysok\u00e9, ale dom\u00e1c\u00ed syst\u00e9my za\u010d\u00ednaj\u00ed p\u0159ekon\u00e1vat tuto mezeru.<\/li>\n\n\n\n
  • Iontov\u00e1 implantace:<\/strong> M\u011bn\u00ed elektrick\u00e9 vlastnosti polovodi\u010d\u016f. Dom\u00e1c\u00ed vysokoenergetick\u00e9 iontov\u00e9 implant\u00e1tory dos\u00e1hly pr\u016flomu \u201c0 a\u017e 1\u201d.<\/li>\n\n\n\n
  • Chemicko-mechanick\u00e9 le\u0161t\u011bn\u00ed (CMP):<\/strong> Zaji\u0161\u0165uje glob\u00e1ln\u00ed planarizaci desti\u010dek. Dom\u00e1c\u00ed syst\u00e9my CMP nyn\u00ed p\u0159ekra\u010duj\u00ed tr\u017en\u00ed pod\u00edl 50% pro \u226528nm procesy.<\/li>\n\n\n\n
  • \u010ci\u0161t\u011bn\u00ed oplatek:<\/strong> Integr\u00e1ln\u00ed pro v\u00fdrobu bez vad. Dom\u00e1c\u00ed \u010distic\u00ed syst\u00e9my dos\u00e1hly pom\u011brn\u011b vysok\u00e9 m\u00edry lokalizace.<\/li>\n<\/ul>\n\n\n\n

    6. P\u0159\u00edle\u017eitosti a v\u00fdzvy v odv\u011btv\u00ed v roce 2026<\/h3>\n\n\n\n

    Vzestup dom\u00e1c\u00edho polovodi\u010dov\u00e9ho vybaven\u00ed je d\u00e1n kombinac\u00ed technologi\u00ed, popt\u00e1vky na trhu a politick\u00e9 podpory. Rozs\u00e1hl\u00e9 roz\u0161i\u0159ov\u00e1n\u00ed za\u0159\u00edzen\u00ed na v\u00fdrobu desti\u010dek poskytuje cenn\u00fd zku\u0161ebn\u00ed prostor, zat\u00edmco n\u00e1rodn\u00ed fondy urychluj\u00ed inovace. Sou\u010dasn\u00e9 pr\u016flomy se zam\u011b\u0159uj\u00ed na vysp\u011bl\u00e9 procesy (\u226528 nm), p\u0159i\u010dem\u017e c\u00edlem je \u010dasem pokr\u00fdt i pokro\u010dil\u00e9 uzly. N\u011bkter\u00e9 segmenty, jako je litografie, \u0161pi\u010dkov\u00e1 metrologie a iontov\u00e1 implantace, z\u016fst\u00e1vaj\u00ed obt\u00ed\u017en\u00fdmi v\u00fdzvami. Polovodi\u010dov\u00e9 vybaven\u00ed je ze sv\u00e9 podstaty n\u00e1ro\u010dn\u00e9 na kapit\u00e1l, talenty a technologie, co\u017e vy\u017eaduje dlouhodob\u00fd v\u00fdvoj a spolupr\u00e1ci s ekosyst\u00e9mem.<\/p>\n\n\n\n

    Uvnit\u0159 \u010dist\u00e9ho prostoru robotick\u00e1 ramena plynule vkl\u00e1daj\u00ed desti\u010dky do dom\u00e1c\u00edch leptac\u00edch stroj\u016f. Monitorov\u00e1n\u00ed v re\u00e1ln\u00e9m \u010dase v nanometrov\u00e9m m\u011b\u0159\u00edtku zaji\u0161\u0165uje stabiln\u00ed parametry a c\u00edlov\u00e9 v\u00fdt\u011b\u017enosti. In\u017een\u00fd\u0159i zaznamen\u00e1vaj\u00ed data - d\u016fkaz \u00fasp\u011b\u0161n\u00e9ho ov\u011b\u0159ov\u00e1n\u00ed dom\u00e1c\u00edho za\u0159\u00edzen\u00ed. Prototypy litografick\u00fdch stroj\u016f nov\u00e9 generace mezit\u00edm proch\u00e1zej\u00ed pe\u010dlivou kalibrac\u00ed a jejich sv\u011bteln\u00e9 zdroje jemn\u011b z\u00e1\u0159\u00ed. Na st\u011bn\u011b vis\u00ed slogan: \u201cKa\u017ed\u00fd nanometr pokroku m\u011b\u0159\u00edme vlastn\u00ed rukou.\u201d<\/p>","protected":false},"excerpt":{"rendered":"

    The heartbeat of the semiconductor industry is maintained by highly sophisticated core equipment, each worth millions of dollars. Engineers monitor circuits thousands of times finer than human hair through precision windows, ensuring every step in modern chip manufacturing meets the highest standards. Every breakthrough in semiconductor technology relies directly on advances in these devices, which […]<\/p>\n","protected":false},"author":1,"featured_media":2115,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[24],"tags":[795,792,793,343,797,276,800,706,799,798,40,721,794,350,796],"class_list":["post-2114","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-2026-trends","tag-chip-manufacturing","tag-cleaning-equipment","tag-cmp-equipment","tag-domestic-manufacturers","tag-etching-equipment","tag-high-end-equipment","tag-ion-implantation","tag-lithography-machine","tag-localization","tag-semiconductor-equipment","tag-semiconductor-industry","tag-technological-barrier","tag-thin-film-deposition","tag-wafer-fab"],"_links":{"self":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2114","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/comments?post=2114"}],"version-history":[{"count":1,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2114\/revisions"}],"predecessor-version":[{"id":2116,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/posts\/2114\/revisions\/2116"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media\/2115"}],"wp:attachment":[{"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/media?parent=2114"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/categories?post=2114"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.zmsh-semitech.com\/cs\/wp-json\/wp\/v2\/tags?post=2114"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}